JPS5138969A - - Google Patents

Info

Publication number
JPS5138969A
JPS5138969A JP49111469A JP11146974A JPS5138969A JP S5138969 A JPS5138969 A JP S5138969A JP 49111469 A JP49111469 A JP 49111469A JP 11146974 A JP11146974 A JP 11146974A JP S5138969 A JPS5138969 A JP S5138969A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49111469A
Other languages
Japanese (ja)
Inventor
Tsutomu Shimata
Masakazu Ozawa
Ryozo Yuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49111469A priority Critical patent/JPS5138969A/ja
Priority to DE19752543651 priority patent/DE2543651A1/de
Publication of JPS5138969A publication Critical patent/JPS5138969A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W46/00—
    • H10W72/90—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H10W46/301—
    • H10W46/601—
    • H10W46/603—
    • H10W72/01938—
    • H10W72/075—
    • H10W72/07553—
    • H10W72/531—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/59—
    • H10W72/932—
    • H10W72/934—
    • H10W72/952—

Landscapes

  • Wire Bonding (AREA)
JP49111469A 1974-09-30 1974-09-30 Pending JPS5138969A (enExample)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP49111469A JPS5138969A (enExample) 1974-09-30 1974-09-30
DE19752543651 DE2543651A1 (de) 1974-09-30 1975-09-30 Halbleitersubstrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49111469A JPS5138969A (enExample) 1974-09-30 1974-09-30

Publications (1)

Publication Number Publication Date
JPS5138969A true JPS5138969A (enExample) 1976-03-31

Family

ID=14562023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49111469A Pending JPS5138969A (enExample) 1974-09-30 1974-09-30

Country Status (2)

Country Link
JP (1) JPS5138969A (enExample)
DE (1) DE2543651A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499226U (enExample) * 1977-12-23 1979-07-13
JPS5715435A (en) * 1980-06-30 1982-01-26 Nec Home Electronics Ltd Substrate for semiconductor device
JPS60134616A (ja) * 1983-12-23 1985-07-17 Toshiba Corp ダイヤフラム型圧電共振子

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0214777B2 (enExample) * 1979-07-04 1990-04-10 Uesuchinguhausu Bureiku Ando Shigunaru Co Ltd
JPS5948924A (ja) * 1982-09-14 1984-03-21 Nec Corp 電子線露光用位置合せマ−ク
DE19632116A1 (de) * 1996-08-08 1998-02-12 Siemens Ag Chiperkennungsvorrichtung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123078A (en) * 1974-08-20 1976-02-24 Matsushita Electronics Corp Handotaisoshino denkyokukozo

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123078A (en) * 1974-08-20 1976-02-24 Matsushita Electronics Corp Handotaisoshino denkyokukozo

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499226U (enExample) * 1977-12-23 1979-07-13
JPS5715435A (en) * 1980-06-30 1982-01-26 Nec Home Electronics Ltd Substrate for semiconductor device
JPS60134616A (ja) * 1983-12-23 1985-07-17 Toshiba Corp ダイヤフラム型圧電共振子

Also Published As

Publication number Publication date
DE2543651A1 (de) 1976-04-15

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