JPH02139199A - Deburring method - Google Patents
Deburring methodInfo
- Publication number
- JPH02139199A JPH02139199A JP28828488A JP28828488A JPH02139199A JP H02139199 A JPH02139199 A JP H02139199A JP 28828488 A JP28828488 A JP 28828488A JP 28828488 A JP28828488 A JP 28828488A JP H02139199 A JPH02139199 A JP H02139199A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- hole
- template
- printed wiring
- pressure water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は穴バリの除去方法に関し、特に多層印刷配線板
の穴バリの除去方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for removing hole burrs, and particularly to a method for removing hole burrs from a multilayer printed wiring board.
多層印刷配線基板はスルホールを開口する必要がある場
合がある。従来、前記基板のスルホール内のバリを除去
するにあたっては、高圧水を基板の全面に一様に噴射さ
せてバリを除去していた。Multilayer printed wiring boards may require opening through holes. Conventionally, when removing burrs in the through-holes of the substrate, high-pressure water was uniformly sprayed over the entire surface of the substrate to remove the burrs.
しかしながら、多層印刷配線基板はその板厚が厚く、ス
ルホールの口径が小径であり、基板全面に一様に高圧水
を噴射させただけでは、スルポール内のバリを完全に除
去することは不可能であった。However, multilayer printed wiring boards are thick and the through holes have small diameters, and it is impossible to completely remove burrs inside the through holes by simply spraying high-pressure water uniformly over the entire surface of the board. there were.
本発明の目的は前記課題を解決したバリ取り方法を提供
することにある。An object of the present invention is to provide a deburring method that solves the above problems.
上述した従来のバリ取り方法に対し、本発明は印刷配線
板の各スルホールに高圧水の噴射を集中させて行い、バ
リを除去するという相違点を有する。The present invention differs from the conventional deburring method described above in that burrs are removed by jetting high-pressure water concentrated on each through hole of a printed wiring board.
前記目的を達成するため、本発明に係るバリ取り方法に
おいては、スルホールを有する印刷配線基板の上面に、
該印刷配線基板のすべてのスルホールと位置および直径
が合致する透孔を有するテンプレートを載置、固定し、
前記テンプレートの透孔を通して高圧水を前記印刷配線
基板のスルホールに集中して噴射させるものである。In order to achieve the above object, in the deburring method according to the present invention, on the upper surface of a printed wiring board having through holes,
placing and fixing a template having through holes whose positions and diameters match all the through holes of the printed wiring board;
High-pressure water is sprayed through the through-holes of the template in a concentrated manner onto the through-holes of the printed wiring board.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図は印刷配線基板を示す正面図である０図において
、印刷配線基板１には第１図及び第３図６ご示す可動テ
ーブル６の位置決めピン４を受は入れる位置決め孔５ａ
、５ｂが設けられているとともに、小径のスルホール３
，３・・・が複数開口されている。FIG. 1 is a front view of the printed wiring board. In FIG.
, 5b are provided, and a small diameter through hole 3 is provided.
, 3... are opened in plurality.
第２図、第３図は本発明によるバリ取り方法を示す図で
ある。図において、本発明は印刷配線基板１上に載置固
定するテンプレート８を用いており、該テンプレート８
には、印刷配線基板１のスルホール３に対応きせて同一
径の透孔８ａ、８ａ・・・を有しており、該透孔８ａは
上方に向けてテーバ状に拡径しである。FIGS. 2 and 3 are diagrams showing the deburring method according to the present invention. In the figure, the present invention uses a template 8 that is placed and fixed on a printed wiring board 1.
The through-holes 8a, 8a, . . . have the same diameter corresponding to the through-holes 3 of the printed wiring board 1, and the through-holes 8a are tapered upward in diameter.
第２図に示すように、スルホール３内に異物・バリ２が
生じた印刷配線基板１はＸＹ力方向移動することが可能
な可動テーブル６上に穴明は時に使用した位置決めピン
４及び位置決め孔５によって正確に位置決め固定される
。As shown in FIG. 2, the printed circuit board 1 with foreign objects and burrs 2 inside the through-holes 3 is placed on a movable table 6 that can be moved in the XY direction. 5, it is accurately positioned and fixed.
次に、第３図に示すように、印刷配線基板１上にテンプ
レート８を載置し、テンプレート８の透孔８ａを印刷配
線基板１のスルホール３に一致させ、その状態で固定す
る。一方、高圧水を噴射するヘッド７をテンプレート８
の上方に配設する。Next, as shown in FIG. 3, a template 8 is placed on the printed wiring board 1, the through holes 8a of the template 8 are aligned with the through holes 3 of the printed wiring board 1, and the template 8 is fixed in this state. On the other hand, the head 7 that injects high-pressure water is attached to the template 8.
Placed above.
この状態で穴明は時に使用したＮ／Ｃデータ（フロッピ
ーディスク）により可動テーブル６の位置制御を行い、
テンプレート８の透孔８ａを通し高圧水ヘッド７から高
圧水９を印刷配線基板１のスルホール３に噴射させ、穴
明けで残った異物・バリ２を完全に除去する。In this state, Anaki controlled the position of the movable table 6 using the N/C data (floppy disk) used at the time.
High-pressure water 9 is injected from a high-pressure water head 7 into the through-holes 3 of the printed wiring board 1 through the through-holes 8a of the template 8 to completely remove foreign matter and burrs 2 left after drilling the holes.
本発明によれば、高圧水をテンプレートをもってスルホ
ールに絞って噴射させるため、スルホール３の異物・バ
リ２を完全に除去することが可能となり、無電解銅メツ
キ後のスルポールバリによる穴径率、スルホール欠損を
解消する。電子部品自動挿入や、ラッピングポスト（配
線ビンン等の打込み時、バリが発生していると、部品の
破損・座屈を生じ、又穴壁面に異物、切粉などが残って
いると、メツキが成長してバリとなって回路形成工程に
おいてドライフィルムでテンティングした部分を破損さ
せ、スルホールの断線及びスルホール欠損となるが、本
発明によれば、スルホール内の異物・バリが完全に除去
されることにより、パネルメッキ後のバリ取り修理が解
消され、大幅な工数低減を達成することができる。According to the present invention, since high-pressure water is squeezed and injected into the through holes with a template, it is possible to completely remove foreign matter and burrs 2 from the through holes 3, and the hole diameter ratio and through hole defects caused by Surpol burrs after electroless copper plating. Eliminate. When automatically inserting electronic components or driving wrapping posts (wiring bins, etc.), if burrs are generated, parts may break or buckle, and if foreign matter or chips remain on the hole wall, plating may occur. The burrs grow and become burrs, which damage the tented areas with the dry film during the circuit formation process, resulting in through-hole disconnections and through-hole defects.However, according to the present invention, foreign matter and burrs inside the through-holes are completely removed. This eliminates the need for deburring and repairing after panel plating, resulting in a significant reduction in man-hours.
以上説明したように本発明は、印刷配線板のスルホール
内のバリ取りにおいて高圧水をテンプレートをもってス
ルホールに絞って噴射させることにより、スルホールの
バリ、異物を完全に除去することができる効果を有する
。As explained above, the present invention has the effect of completely removing burrs and foreign matter from the through-holes by squeezing and spraying high-pressure water into the through-holes with a template when deburring the through-holes of a printed wiring board.
第１図は本発明の一実施例における正面図、第２図、第
３図は本発明のバリ取り方法を工程順に示す断面図であ
る。
１・・・印刷配線基板 ２・・・異物・バリ３・・
・スルホール ４・・・位置決めピン５・・・位
置決め孔 ６・・・可動テーブル７・・・高圧水
ヘッド ８・・・テンプレート９・・・高圧水FIG. 1 is a front view of an embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views showing the deburring method of the present invention in the order of steps. 1...Printed wiring board 2...Foreign objects/burrs 3...
・Through hole 4...Positioning pin 5...Positioning hole 6...Movable table 7...High pressure water head 8...Template 9...High pressure water
Claims (1)
刷配線基板のすべてのスルホールと位置および直径が合
致する透孔を有するテンプレートを載置、固定し、前記
テンプレートの透孔を通して高圧水を前記印刷配線基板
のスルホールに集中して噴射させることを特徴とするバ
リ取り方法。(1) A template having through holes that match the positions and diameters of all the through holes of the printed wiring board is placed and fixed on the upper surface of the printed wiring board having through holes, and high pressure water is applied to the through holes of the printed wiring board through the through holes of the template. A deburring method characterized by spraying concentratedly onto the through-holes of a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28828488A JPH02139199A (en) | 1988-11-15 | 1988-11-15 | Deburring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28828488A JPH02139199A (en) | 1988-11-15 | 1988-11-15 | Deburring method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02139199A true JPH02139199A (en) | 1990-05-29 |
Family
ID=17728170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28828488A Pending JPH02139199A (en) | 1988-11-15 | 1988-11-15 | Deburring method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02139199A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05329825A (en) * | 1992-05-29 | 1993-12-14 | Hirade Seimitsu:Kk | Method for removing flash |
| JPH06304899A (en) * | 1993-04-22 | 1994-11-01 | Casio Comput Co Ltd | Glass cutting method |
| JPH06339900A (en) * | 1993-06-02 | 1994-12-13 | Kawasaki Heavy Ind Ltd | Cutting working method for work |
| JP2010000500A (en) * | 2008-06-23 | 2010-01-07 | Commiss Energ Atom | Method of eliminating engraving defect from metallic film deposited on flexible carrier |
-
1988
- 1988-11-15 JP JP28828488A patent/JPH02139199A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05329825A (en) * | 1992-05-29 | 1993-12-14 | Hirade Seimitsu:Kk | Method for removing flash |
| JPH06304899A (en) * | 1993-04-22 | 1994-11-01 | Casio Comput Co Ltd | Glass cutting method |
| JPH06339900A (en) * | 1993-06-02 | 1994-12-13 | Kawasaki Heavy Ind Ltd | Cutting working method for work |
| JP2010000500A (en) * | 2008-06-23 | 2010-01-07 | Commiss Energ Atom | Method of eliminating engraving defect from metallic film deposited on flexible carrier |
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