JPH04133489A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To enable a current to flow through a printed wiring board before it is divided and the printed wiring board to be easily divided by a method wherein a V-shaped groove is provided to the printed wiring board, a plating film is provided onto the side wall of the groove, and a circuit pattern and a through-hole are provided inside the groove. CONSTITUTION:V-shaped grooves 3 are provided in a copper plated board 1', and a coating 4 is applied to the whole surface of the copper plated 1', including the grooves, by electroless plating. Furthermore, a copper foil 2 and the plating 4 are etched so as to leave a required circuit pattern 6 and a plating inside the groove 3 unremoved. Then, a slit 7 is provided to a part of the V-shaped groove 3 through router processing so as to prevent a current from flowing through a part of the circuit pattern 6 other than the required circuit. At this point, a terminal 5 is provided to one of the circuit patterns of the divided boards.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method of manufacturing a printed wiring board, and particularly to a printed wiring board that allows continuity testing from the board end terminals after mounting components and is easy to divide. .

[Conventional technology]

Conventionally, when dividing a printed wiring board, in order to facilitate the division, perforations are made in advance at the dividing positions or V-shaped grooves are formed. When dividing, it is possible to divide by bending the dividing position. However, since a continuity test is performed from the board edge after components are mounted on the printed wiring board, effective terminals may be required at the board edge.

In this case, after the continuity test, the plate end terminals are no longer needed, and they are divided and discarded (Fig. 2). However, since the circuit pattern 6 is present in the divided portion, it is not possible to facilitate division by providing the above-mentioned 7-shaped grooves and perforation-like holes on the printed wiring board in advance.

[Problem to be solved by the invention]

In the conventional printed wiring board described above, since the holes or grooves are formed in advance, it is impossible to establish conduction between the dividing positions before dividing.

In addition, as shown in Figure 2, if a circuit pattern at the dividing position is required after component mounting, it is not possible to prepare grooves or holes in advance to facilitate division at the end, resulting in (1) deviations in the dividing position; . (2) After division, the circuit pattern is likely to peel off due to the unevenness of the end surface. (3) Due to division,
A dedicated cutting device is required (Figure 2).

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a printed wiring board that solves the above-mentioned drawbacks, allows conduction even before division, and facilitates division.

Means for Solving the Problem] The method for manufacturing a printed wiring board of the present invention includes a step of forming a V-shaped groove on a printed wiring board, a step of forming plating on the wall surface of the groove, The method is characterized by including a step of forming a circuit pattern in this groove, and a step of further forming a through hole.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) to 1(0) are cross-sectional views or plan views showing a method for manufacturing a printed wiring board according to an embodiment of the present invention in the order of steps. First, in FIG. 1(a), in this embodiment, a copper clad plate 1' with grooves 3 in the shape of a 7 is prepared. This copper clad board 1' has a copper foil 2 on the ambiguous surface of the insulating board.
will be prepared. Next, electroless plating is performed on the entire surface of the copper clad plate 1'. FIG. 1(c) is a plan view showing this state;
FIG. 1(b) is a sectional view taken along line AA' in FIG. 1(c).

At this time, plating is formed within the grooves 3 as well as on the surface of the copper clad plate 1'. Further, by conventional circuit forming means, the copper foil 2 and the plating 4 are plated, leaving the desired circuit pattern 6 and the plating inside the V-groove 3 (Fig. 1(d)
)). Next, in order to separate conduction other than the desired circuit in the circuit pattern 6, a part of the groove 3 is made into a slit-like hole by router machining to obtain a slit 7 (Fig. 1(e)).
. At this time, if a terminal 5 is formed on one circuit pattern of the divided board, a continuity test can be performed through the terminal 5 even after components are mounted on the printed wiring board 8 (FIG. 1(e)). If it becomes necessary to divide the printed wiring board 8, the printed wiring board 8 can be easily divided by bending the axis of the groove 3 as a crease (FIG. 1(r)). When the number of continuity test terminals is small, for example, when the interval between the circuit patterns 6 is 10 mm or more, the slit 7 is formed by the router process, but when the interval between the circuit patterns 6 is 10 mm or less, for example, the gap is 0.
If 5 mm is required, use a drill with a drill diameter of 0.5φ.
It is preferable to perform drilling and divide the circuit pattern 6 with round holes.

As mentioned above, especially when drilling holes of 1 mm or less, there is a problem of router bit breakage when using a router, but this can be prevented using a drill. For example, plate thickness 1.6mm, division length 100mm
In the case of glass epoxy material, if the holes or grooves are processed in advance, the shearing force required for splitting is 600 kgf.
required, but if there is no hole or groove machining, 3 to 4 times 20
A shearing force of 00 kgf or more is required.

〔Effect of the invention〕

As explained above, the present invention enables conduction between the divided positions of the printed wiring board to be divided and facilitates the division, so that the present invention has the following effects.

(A) As for the division position, ■grooves and slits prevent misalignment.

CB) Since the circuit pattern is inside the V-groove, peeling of the circuit pattern is less likely to occur after division.

(C) Since division is possible by simply bending around the dividing position, no special cutting device is required.

[Brief explanation of drawings]

FIG. 1(a) is a cross-sectional view of a copper-clad board prepared in the method for manufacturing a printed wiring board according to an embodiment of the present invention, and FIG.
Cross-sectional view showing the state of plating on the copper clad plate of a), 1st
FIG. 1(c) is a plan view of FIG. 1(b), FIG. 1(d) to FIG. 1(f) are plan views sequentially showing the manufacturing process after FIG. 1(c), and FIG. 2 is a plan view of FIG. 1(b). FIG. 2 is a plan view showing a divided state of a conventional printed wiring board. 1... Insulating substrate, 2... Copper foil, 3.
...V groove, 1'...Copper clad plate, 4...
・Plating, 5...terminal, 6...circuit pattern, 7...slit, end---printed wiring board. Agent Patent Attorney Susumu Uchihara 1st Ward (Shen) Figure 1 (b) Otsu Figure 911 (H) Figure 2

Claims (1)

[Claims] A step of forming a V-shaped groove on a printed wiring board, a step of forming plating on the wall surface of the groove, a step of forming a circuit pattern in the groove, and a step of forming a through hole in the circuit pattern in the groove. A method for manufacturing a printed wiring board, the method comprising: forming a printed wiring board.