JPH02135765A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPH02135765A JPH02135765A JP28977888A JP28977888A JPH02135765A JP H02135765 A JPH02135765 A JP H02135765A JP 28977888 A JP28977888 A JP 28977888A JP 28977888 A JP28977888 A JP 28977888A JP H02135765 A JPH02135765 A JP H02135765A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- hole
- mold
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、主に、樹脂封止型電子部品に利用することの
できるリードフレームに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention mainly relates to a lead frame that can be used for resin-sealed electronic components.
従来の技術
例えば、半導体集積回路装置などは、内部を振動や水分
などから品質的に護るために樹脂成形されているが、そ
の樹脂成形用の封止金型はほとんど樹脂注入口が下型に
設けられている。Conventional technology For example, semiconductor integrated circuit devices are molded with resin to protect the internal parts from vibrations and moisture, but most sealing molds for resin molding have resin injection ports located at the bottom of the mold. It is provided.
発明が解決しようとする課題
しかしながら外部電極端子の数が１００本以上などの多
ビンのリードフレームになると、内部端子間の間隔が非
常に狭いため、そのすき間を強制的に送られる樹脂は極
小な気泡を発生し、その気泡が」−金型部分の樹脂成形
体内、及び表面に現われ、完成品において耐熱性、外観
性をそこなうという問題が発生ずる。Problems to be Solved by the Invention However, when a multi-bin lead frame has more than 100 external electrode terminals, the intervals between internal terminals are very narrow, and the amount of resin that is forced to flow through the gaps is extremely small. Bubbles are generated, and the bubbles appear inside and on the surface of the resin molded body of the mold part, resulting in a problem of impairing the heat resistance and appearance of the finished product.
課題を解決するための手段
本発明は、これらの問題点を解消するもので、要約する
に、気泡の発生をできるだけ防ぐのに、封止用樹脂の注
入を封止用金型の上型、下型の両方から行うための穴部
を設けたリードフレームである。Means for Solving the Problems The present invention solves these problems. To summarize, in order to prevent the generation of bubbles as much as possible, injection of the sealing resin is carried out by using the upper mold of the sealing mold, This is a lead frame with holes for testing from both sides of the lower die.
作用
本発明の構成によると、樹脂成形時に封止用金型の上型
、下型の両方から樹脂を注入し、従来のように下型から
強制的に上型−１流し込むということはないので気泡が
発生しにくくなる。Function According to the structure of the present invention, resin is injected from both the upper mold and the lower mold of the sealing mold during resin molding, and there is no need to forcibly pour the resin from the lower mold to the upper mold-1 as in the conventional method. Air bubbles are less likely to occur.
実施例
第１図は本発明実施例のリードフレームであり、第２図
はこれを用いて形成した電子部品の正面図である。この
実施例のリードフレームは、リード部１を四囲の外枠部
２から内側に向って多数配列した構造であり、同リード
部１の内側先端部分には、電子部品の主部、例えば半導
体集積回路のチップを載置し、その各電極部を各外部電
極端子、すなわち、この多数のリード部１に接続した結
線部を有し、そしてこの部分を樹脂成形体３で封止して
用いるものである。このリードフレームには、外枠部２
に樹脂形成を上型、下型両方から行うための穴部４が設
けられている。経験によると、樹脂封止型半導体集積回
路装置の場合、この穴部４の形状は長さ０．５１〜１０
酎、同幅０．５ｗＩＩＩｌ〜１ｏｒｒｎの範囲に設定す
ることが好適である。Embodiment FIG. 1 shows a lead frame according to an embodiment of the present invention, and FIG. 2 is a front view of an electronic component formed using the lead frame. The lead frame of this embodiment has a structure in which a large number of lead parts 1 are arranged inward from a surrounding outer frame part 2, and the inner tip part of the lead part 1 has a main part of an electronic component, such as a semiconductor integrated A device on which a circuit chip is mounted, each electrode portion of which has a connection portion connected to each external electrode terminal, that is, a large number of lead portions 1, and this portion is sealed with a resin molded body 3 for use. It is. This lead frame has an outer frame portion 2.
Holes 4 are provided for forming resin from both the upper mold and the lower mold. According to experience, in the case of resin-sealed semiconductor integrated circuit devices, the shape of this hole 4 has a length of 0.51 to 10 mm.
It is preferable to set the same width in the range of 0.5wIII1 to 1orrn.
電子部品としては、樹脂封止成形後に、投入し、余って
硬化した樹脂いわゆるカル５を取り去るのだが、これは
従来通りに行えばよい。For electronic parts, after resin sealing molding, the excess hardened resin so-called Cal 5 is removed, and this can be done in the conventional manner.
第２図ａ、ｂは、外枠部２と樹脂成形体３からカル５を
取り去る過程を示す一例の正面図であり、まず第２図ａ
のように樹脂成形体３およびカル５を含む外枠部２を従
来通り、保持手段（真空吸着型６）で保持し、次にこの
保持手段に具備されたカル除去装置７を矢印の方向に押
し下げることにより、第２図すのように、カル５は外枠
部２から引き離される。このようにすれば従来通りに工
程を行う事ができ、設備的にもほとんど影響を及ぼす事
はない。FIGS. 2a and 2b are front views of an example showing the process of removing the cull 5 from the outer frame portion 2 and the resin molded body 3. First, FIG.
As shown in the figure, the outer frame 2 including the resin molded body 3 and the cull 5 is held by a holding means (vacuum suction type 6) as before, and then the cull removing device 7 provided in this holding means is moved in the direction of the arrow. By pressing down, the cull 5 is separated from the outer frame portion 2, as shown in FIG. In this way, the process can be carried out as before, and there is almost no impact on the equipment.
発明の効果
本発明によれば、リードフレームの外枠部に穴部を設け
、この穴部を用いて封止金型の上型、下型の両方から樹
脂を同時に注入する事により、内部端子のすき間を樹脂
が強制的に送られるという事もほとんどなくなり、結果
的に気泡の発生もほとんどなくす事ができるので、本発
明は電子部品の品質、性能の維持向上に有益である。Effects of the Invention According to the present invention, a hole is provided in the outer frame of the lead frame, and resin is simultaneously injected from both the upper mold and the lower mold of the sealing mold using this hole, thereby forming internal terminals. The present invention is useful for maintaining and improving the quality and performance of electronic components because the resin is hardly forced to be fed through the gaps, and as a result, the generation of air bubbles can be almost eliminated.
第１図は本発明実施例の概要を表わす電子部品（半製品
）の全体斜視図、第２図ａ、ｂはカル引き離し工程例の
工程順断面図である。
■・・・・・・（リードフレームの）リード部、２・・
・・・・同外枠部、３・・・・・・樹脂成形体、４・・
・・・・穴部、５・・・・・・カル部。
代理人の氏名 弁理士 粟野重孝 はか１名Ｉ ・−
−リ − ド 部
２−５１′！−件 部
３−・−１９脂 ５１ 斤三 体
４・−穴 部
第１図FIG. 1 is an overall perspective view of an electronic component (semi-finished product) showing an outline of an embodiment of the present invention, and FIGS. 2a and 2b are process-order cross-sectional views of an example of a cull separation process. ■・・・・・・Lead part (of lead frame), 2...
...Same outer frame portion, 3...Resin molded body, 4...
...Hole part, 5...Cul part. Name of agent: Patent attorney Shigetaka Awano Haka1 person I ・-
-Lead part 2-51'! -Part 3-・-19 Fat 51 Three loaves Body 4・-Hole Part 1 Figure
Claims (2)
行うための穴部を設けた半導体装置用リードフレーム。(1) A lead frame for a semiconductor device that has holes for injecting sealing resin from both the upper and lower molds.
部の寸法が、長さ、幅共に０．５ｍｍ〜１０ｍｍの範囲
に設定された請求項（１）記載の半導体装置用リードフ
レーム。(2) The semiconductor device according to claim (1), wherein the dimensions of the hole necessary for pouring the resin into the upper mold of the sealing mold are set in a range of 0.5 mm to 10 mm in both length and width. lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28977888A JPH02135765A (en) | 1988-11-16 | 1988-11-16 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28977888A JPH02135765A (en) | 1988-11-16 | 1988-11-16 | Lead frame for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02135765A true JPH02135765A (en) | 1990-05-24 |
Family
ID=17747638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28977888A Pending JPH02135765A (en) | 1988-11-16 | 1988-11-16 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02135765A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5918691A (en) * | 1994-05-23 | 1999-07-06 | Kanzaki Kokyokoki Mfg. Co., Ltd. | Axle driving apparatus |
| JP2002168320A (en) * | 2000-11-30 | 2002-06-14 | Kanzaki Kokyukoki Mfg Co Ltd | Power transmission mechanism of vehicle |
| US6672843B1 (en) | 2002-04-08 | 2004-01-06 | Hydro-Gear Limited Partnership | Dual pump apparatus comprising dual drive shafts and auxiliary pump |
| US6953327B1 (en) | 2003-03-11 | 2005-10-11 | Hydro-Gear Limited Partnership | Dual pump |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5214359A (en) * | 1975-07-25 | 1977-02-03 | Hitachi Ltd | Process for sealing of the semiconductor and lead-frame used in this method |
| JPS5910251A (en) * | 1983-05-23 | 1984-01-19 | Hitachi Ltd | Lead frame |
-
1988
- 1988-11-16 JP JP28977888A patent/JPH02135765A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5214359A (en) * | 1975-07-25 | 1977-02-03 | Hitachi Ltd | Process for sealing of the semiconductor and lead-frame used in this method |
| JPS5910251A (en) * | 1983-05-23 | 1984-01-19 | Hitachi Ltd | Lead frame |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5918691A (en) * | 1994-05-23 | 1999-07-06 | Kanzaki Kokyokoki Mfg. Co., Ltd. | Axle driving apparatus |
| US5957229A (en) * | 1994-05-23 | 1999-09-28 | Kanzaki Kokyukoki Mfg. Co., Ltd. | Axle driving apparatus |
| JP2002168320A (en) * | 2000-11-30 | 2002-06-14 | Kanzaki Kokyukoki Mfg Co Ltd | Power transmission mechanism of vehicle |
| US6672843B1 (en) | 2002-04-08 | 2004-01-06 | Hydro-Gear Limited Partnership | Dual pump apparatus comprising dual drive shafts and auxiliary pump |
| US7320577B1 (en) | 2002-04-08 | 2008-01-22 | Hydro-Gear Limited Partnership | Dual pump transmission |
| US6953327B1 (en) | 2003-03-11 | 2005-10-11 | Hydro-Gear Limited Partnership | Dual pump |
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