JPH02134846A - Semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To facilitate allocation of wiring tracks between wirings, common occupation of horizontal wiring tracks and minimization of wiring channel widths by a method wherein distances between I/O terminals of logic function blocks are so selected as to be larger than twice the wiring pitch. CONSTITUTION:A plurality of logic function blocks composed of a plurality of elements are formed on a semiconductor substrate and wirings are provided between the I/O terminals of the respective logic function blocks to constitute a semiconductor integrated circuit. In the integrated circuit, the distances between the I/O terminals of the respective function blocks are so selected as to be larger than twice the wiring pitch. For instance, the distance between respective adjoining terminals in the I/O terminals 1A-4A of a logic function block A and the distance between respective adjoining terminals in the I/O terminals 1B-4B of a logic functional block B are selected to be twice the wiring pitch. With this constitution, when the terminal 1A, 2A, 3A and 4A are connected to the terminals 1B, 2B, 3B and 4B respectively, the horizontal wiring track of the wiring between the terminals 2A and 2B can be also used as the horizontal wiring track of the wiring between the terminals 4A and 4B and the horizontal wiring track of the wiring between the terminals 1A and 1B can be also used as the horizontal wiring track of the wiring between the terminals 3A and 3B.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit, and more particularly to a semiconductor integrated circuit having logical function blocks.

[Conventional technology]

An example of a semiconductor integrated circuit incorporating a conventional logic function block will be described with reference to the drawings.

FIG. 3 is a wiring diagram of a logic function block portion of a conventional semiconductor integrated circuit.

In FIG. 3, IC, 2C, 3C, and 4C are input/output terminals of logic block C, and the interval between them is less than twice the wiring pitch. L.D.

2D, 3D, 4D, and 5D are input/output terminals of the logic block D, and the intervals therebetween are all smaller than twice the wiring pitch.

Now, when wiring between terminals IC and ID, 2C and 2D, 3C and 3D, and 4C and 4D, respectively, and wiring terminal 5D with a terminal of another logic function block (not shown), as shown in Fig. 3. Similarly, one wiring track was assigned to each bend in a wiring book.

[Problem to be solved by the invention]

The input/output terminal spacing of the conventional logic function block mentioned above is
In particular, since they are not arranged according to a convention of at least twice the wiring pitch, input/output terminals whose pitch is less than twice the wiring pitch cannot share the wiring track 4 with other wiring when the connected wiring bends. First, there is a drawback that the wiring channels between logical function blocks become larger, leading to an increase in chip size.

[Means to solve the problem]

The present invention provides a semiconductor integrated circuit in which a logic function block composed of a plurality of elements is formed on a semiconductor substrate, and wiring is made between input and output terminals of each logic function block.
The wiring pitch between the input and output terminals of the logic function block is 2.
It was designed to be more than twice as far apart.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a wiring diagram between logical function blocks showing a first embodiment of the present invention.

LA, 2A, 3A, and 4A are input/output terminals of logic function block A, and IB, 2B, 3B, 4B, and 5B are input/output terminals of logic function block B.
It's twice as far away.

1 is a first layer wiring, 2 is a second layer wiring, and 3 is a through hole connecting the first N wiring and the second M wiring.

Now, when connecting terminals IA and IB, 2A and 2B, 3A and 3B, 4A and 4B, and connecting terminal 5B to another functional block (not shown), vertical wiring track 4 is connected between the terminals. As shown in the figure, between 2A and 2B, 3
The wiring between A and 3B can be crossed, and the horizontal wiring track of the wiring between 2A and 2B can be shared with the horizontal wiring track of the distance between 4A and 4B. Further, the horizontal wiring track between IA and 18 can be shared with the wiring track between 3A and 3B. Number of wiring tracks used is 2
It is.

FIG. 2 is a wiring diagram between logical function blocks in a second embodiment of the present invention.

In the second embodiment, compared to the first embodiment, the position of the logic function block B is shifted and the terminals 2B and 3B are located.

4B are terminals IA and 2A of logic function block A.

The difference is that the X coordinate is the same as 3A.

Even when the terminal positions of the upper and lower blocks are aligned in this way, as shown in Figure 2, by using two wiring tracks to connect terminals 2A-2B and 3A-3B, there are only two wires in total. You can get away with using a wiring track.

〔Effect of the invention〕

As explained above, in the present invention, wiring tracks can be allocated between terminals by setting the input/output terminal spacing of a logic function block to at least twice the wiring pitch, and horizontal wiring tracks can be shared. This has the effect that the wiring channel width can be minimized.

5B, IC-4C, ID-5D... Input/output terminal.

Claims (1)

[Claims] In a semiconductor integrated circuit in which a logic function block composed of a plurality of elements is formed on a semiconductor substrate, and the input and output terminals of each logic function block are wired, the wiring pitch between the input and output terminals of the logic function block is A semiconductor integrated circuit characterized by being separated by at least twice the distance.