JPH02133981A - Manufacture of substrate fuse circuit - Google Patents
Manufacture of substrate fuse circuitInfo
- Publication number
- JPH02133981A JPH02133981A JP28669688A JP28669688A JPH02133981A JP H02133981 A JPH02133981 A JP H02133981A JP 28669688 A JP28669688 A JP 28669688A JP 28669688 A JP28669688 A JP 28669688A JP H02133981 A JPH02133981 A JP H02133981A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- electrodes
- electrode
- solder
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 31
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 3
- 238000011084 recovery Methods 0.000 abstract 1
- 230000008439 repair process Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000011297 pine tar Substances 0.000 description 1
- 229940068124 pine tar Drugs 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
Landscapes
- Fuses (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業−にの利用分野〕
本発明は回路基板にお１プるヒユーズ回路とその製３３
方法に関Ｊる。更に詳しくはヒユーズ作動後、両端の電
極が半［ＥＩ ＜われを起して修復が不能となって、本
来の保護回路としての機能を果すヒユーズ回路どぞの製
造方法に関する。[Detailed description of the invention] [Industrial field of application] The present invention relates to a fuse circuit mounted on a circuit board and its manufacture.
Regarding the method. More specifically, it relates to a method for manufacturing fuse circuits in which, after the fuse is activated, the electrodes at both ends become half-repairable and cannot be repaired, thus functioning as an original protection circuit.
回路基板に必要以上の電流が流れるなど、基板が１゛シ
常に発熱した場合、基板自身およびその周辺部分を保護
するため、ある作動条件にて回路を遮断Ｊるようにヒユ
ーズ回路が設けられている。If the circuit board constantly generates heat due to excessive current flowing through the circuit board, a fuse circuit is installed to cut off the circuit under certain operating conditions in order to protect the board itself and its surroundings. There is.
従来のらのは、−爪作動した後にら、両端の電極はその
まま存在しており、銅線や半田などにより接続を復帰さ
せることができた。In the conventional RANO, the electrodes at both ends remained intact after the claw was operated, and the connection could be restored using copper wire, solder, etc.
即ち従来のヒユーズ回路は第５図、第６図に示すように
２つの ４に間を半田で接続したものである。このヒユ
ーズは半田が溶融する温度に達すると、両端の電極に引
張られ、回路が遮断される。That is, the conventional fuse circuit has two 4's connected by solder as shown in FIGS. 5 and 6. When this fuse reaches the temperature at which the solder melts, it is pulled by the electrodes at both ends, breaking the circuit.
第５図、第６図において１５は電極、１６は半田、１８
はホウ［１つ、１７はソルダーレジストを示す。In FIGS. 5 and 6, 15 is an electrode, 16 is solder, and 18
1, 17 indicates solder resist.
作８後は第７図の如く、半田１６は、両端の電極１−に
まるく残るだけになる。電極ｎ体には何の変化もない。After step 8, as shown in FIG. 7, only a circle of solder 16 remains on the electrodes 1- at both ends. There is no change in the n-electrode.
このヒユーズの作動特性（温度、Ｂ）問）は、使用され
る半田の組成、１等に大きく支配される。The operating characteristics (temperature, B) of this fuse are largely controlled by the composition of the solder used.
すなわら、それを管理することによって、保護回路とし
ての機能を維持することができる。In other words, by managing this, the function as a protection circuit can be maintained.
前記のごとく、従来のヒユーズ回路は、作動後に銅線や
半田などにより接続を復帰させることができた。しかし
その様な修復を施したものは本来の作動条件では働かず
、設計者の意図する保護回路としての機能を東さない。As mentioned above, in the conventional fuse circuit, the connection can be restored by copper wire, solder, etc. after activation. However, such a repaired circuit will not work under its original operating conditions and will not function as a protection circuit as intended by the designer.
本発明の目的は、−度ヒユーズが作動すると、半田や銅
線で容易には修復できないヒユーズ回路を提供し、従っ
て設計者が意図した作動特性から変化した作動特性には
なし得ず、本来の保護機能を発揮させる基板ヒユーズ回
路及びその−製造方法を提供す′ることである。It is an object of the present invention to provide a fuse circuit which cannot be easily repaired with solder or copper wire once the fuse is activated, and which therefore cannot have operating characteristics that have changed from those intended by the designer, and which protects the circuit from the original protection. It is an object of the present invention to provide a substrate fuse circuit that exhibits its functions and a manufacturing method thereof.
本発明者らは前記課題を解決するため鋭怠仙究を行った
。その結果、ヒユーズ両端の電極の先端部をヒユーズ作
動時に半田くわれを起して電極の先端部が消滅し、電極
が根本部の僅かの部分を残して間隔が広く開きｆｉ復を
不可能にすることによって目的を達成しうろことを見い
出だし本発明を完成した。The present inventors conducted extensive research in order to solve the above problem. As a result, when the fuse is operated, the tips of the electrodes at both ends of the fuse are soldered, causing the tips of the electrodes to disappear, leaving only a small portion of the electrodes at their bases, and the gap widening, making it impossible to restore the fuse. By doing so, they found a way to achieve their objectives and completed the present invention.
寸なわら本発明は基板上に形成された電極間をヒユーズ
で接続する構造のヒユーズ回路において、両端の電極の
先端部の大部分を半田と低融点合金を作り易い金属の多
数の独立した微小電極の集合体で構成し、この電極を半
田で結ぶ構造とし、ヒユーズ作動後、両端の電極が半田
くわれを起して修復が不能となるように構成した基板ヒ
ユーズ回路である。In a fuse circuit having a structure in which fuses are used to connect electrodes formed on a substrate, the present invention uses a fuse circuit in which most of the tips of the electrodes at both ends are made of solder and a large number of independent microscopic pieces of metal that can be easily formed into a low melting point alloy. This circuit board fuse circuit is composed of an assembly of electrodes, and the electrodes are connected with solder. After the fuse is activated, the electrodes at both ends are soldered and cannot be repaired.
前記多数の独立した微小電極の集合体としては、両端の
電極が根本部の一部を残して、１００〜２００μｍの格
子状の隙間をもった１００〜２００ｐ角で、厚さが５〜
１５μｍの多数の貴金属系導体よりなる厚膜電極とし、
画電極の中間部に空隙をもたせた基板ヒユーズ回路が好
適である。The assembly of a large number of independent microelectrodes is 100 to 200p square with a lattice-like gap of 100 to 200 μm, with the electrodes at both ends leaving a part of the base, and the thickness is 5 to 200 μm.
A thick film electrode made of a large number of noble metal conductors of 15 μm,
A substrate fuse circuit having a gap in the middle of the picture electrode is suitable.
またその製造方法としては、基板上に分割された導体回
路の電極間に中間部を残して、互いに１００〜２００戸
の間隔をあけた多数の１００〜２００岬角を有するパタ
ーンの導体層をスクリーン印刷により印刷焼成して形成
したのち、ヒユーズを形成するための電極間部分を除い
た部分にソルダーレジスト層を印刷焼成して形成し、づ
いて該電極間に半田ペーストを印刷焼成してヒユーズを
形成することを特徴とする基板ヒユーズ回路の製造方法
である。In addition, its manufacturing method involves screen printing a conductor layer with a pattern having a large number of cape angles of 100 to 200 mm, spaced apart from each other by 100 to 200 mm, leaving an intermediate portion between the electrodes of the conductor circuit divided on the substrate. After printing and baking, a solder resist layer is printed and baked on the area excluding the area between the electrodes for forming the fuse, and then solder paste is printed and baked between the electrodes to form the fuse. This is a method of manufacturing a substrate fuse circuit, characterized in that:
半田と低融点合金を作り易い金属としく゛は、例えばΔ
９又はＡｕ、Ａｑ−Ｐｄなどが好適である。A metal that is easy to form a low melting point alloy with solder is, for example, Δ
9, Au, Aq-Pd, etc. are suitable.
多数の独立した微小電極の集合体としては、ランダムに
配置されたものでも差し支えないが、製造上からは、ま
た微小電極を偏らず、密度を均笠に近く分布させるため
にも、スクリーン印す１１できる格子状の隙間をもつｌ
ζ縦横に１″５？！Ａ目状に並んだ独立Ｔｉ極が好まし
く、間隔としては１００へ・２００ｔｍ１電極の大きさ
も１００〜２００期角としたパターンが好適である。電
極の厚さとしては５〜１５岬が好適である。As an assembly of a large number of independent microelectrodes, it is acceptable to arrange them randomly, but from a manufacturing standpoint, and to ensure that the microelectrodes are not biased and the density is distributed almost uniformly, screen printing is recommended. 11 with a lattice-like gap
ζ Independent Ti electrodes arranged in a 1"5?A pattern in the vertical and horizontal directions are preferable, and the spacing is 100 to 200 tm. A pattern in which the size of the electrodes is also 100 to 200 is preferable. The thickness of the electrodes is 5 to 15 capes are preferred.
両端の電極の中間部には、過電流が流れた旧に遮断され
易くするために、独立電極のない空隙部をもたせること
が必要である。It is necessary to provide a gap in the middle between the electrodes at both ends, where there is no independent electrode, so that an overcurrent can be easily interrupted.
この電極を接続１゛る半田としてはハンダパウダーに松
ヤニ等のフラックスおよびブヂルカルビトール簀のシン
ナーを混合したハングペーストを用いて印刷し焼成して
形成する。この焼成の際に余りＡ４、艮口）間とＪると
ヒユーズ作動時と同様となり、前記独立Ｗｉ極を溶融し
てしまうので、低温・短時間として半溶融の多孔質の状
態に形成させる。The solder for connecting these electrodes is formed by printing and baking using a hang paste prepared by mixing solder powder with a flux such as pine resin and a thinner such as butyl carbitol. During this firing, if there is too much space between A4 and A4, the result will be similar to when a fuse is activated, and the independent Wi electrode will be melted, so it is formed into a semi-molten porous state at a low temperature and for a short time.
ソルダーレジスト層としては、形成工程で劣化しないも
のであればガラス以外に樹脂なども使用できる。As the solder resist layer, resin or the like can be used in addition to glass as long as it does not deteriorate during the formation process.
第１図は本発明のヒユーズ回路の平面図である。FIG. 1 is a plan view of the fuse circuit of the present invention.
第１図にボすようにヒユーズ２の両端の電極４に１００
〜２００−程度のスリットを入れ、微小独立電極１の集
合体とする。３は両端の電極の根本部、５はオーバーグ
レーズ層、６はホウロウ面を示づ。画電極の中ＩＮ部に
は空隙部７を設けておく。As shown in Figure 1, connect the electrodes 4 at both ends of the fuse 2 to
A slit of about 200 mm is made to form an assembly of minute independent electrodes 1. 3 indicates the root portions of the electrodes at both ends, 5 indicates the overglaze layer, and 6 indicates the enamel surface. A cavity 7 is provided in the inner IN portion of the picture electrode.
両端の電極の根本部はオーバーグレーズ層を形成した鴇
、４休回路とヒユーズとの接続を確実にするために必要
である。The root portions of the electrodes at both ends are necessary to ensure the connection between the overglaze layer formed, the 4-off circuit, and the fuse.
独立電極１の集合体の厚みを５〜１５戸程度におさえる
ことにより、そして該電極を半田と低融点合金を作り易
い金属で作っているので、ヒユーズ作ｖＩ後に、該電極
が半田くわれを起し、溶は去るので、後は３の電極根本
部しか残らずそのためヒユーズの修復を困難にするもの
である。By keeping the thickness of the assembly of independent electrodes 1 to about 5 to 15 units, and because the electrodes are made of a metal that is easy to form with solder and a low-melting point alloy, the electrodes will not have any solder holes after making a fuse. As the melt is removed, only the base of electrode 3 remains, which makes repairing the fuse difficult.
修復を困難にする事により、再起動に当っては、基板自
体を差し替えることに限定されるため、設計者の意図す
る保護機能を紺持することがでさる。By making repair difficult, restarting is limited to replacing the board itself, making it possible to maintain the protection function intended by the designer.
第２図は第１図の断面立面図である。８は金属コアを示
す。FIG. 2 is a cross-sectional elevational view of FIG. 8 indicates a metal core.
第３図はヒユーズ作動後の断面立面図であり、溶解した
ヒユーズは９の部分に付着し【残る以外は、球状になっ
て除かれる。独立電極１はすべて半田くわれにより融解
し去り、修復を不能にする。Fig. 3 is a cross-sectional elevational view after the fuse is activated, and the melted fuse adheres to the part 9 and is removed in a spherical shape except for the remaining part. All of the independent electrodes 1 are melted away by solder cracks, making repair impossible.
以下に実施例によって、本発明を更に具体的に説明する
が、本発明は、この実施例に限定されるものではない。EXAMPLES The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to these Examples.
ＢａＯＭＯＯＢ２０３ Ｓ ！ ０２系結晶化ガラス
を施釉焼成したホウロウ基板１０の上に、第４図の様な
形状の厚膜電極１１を印刷する。該電極の先端部は、中
門に空隙部１３（１ｍ）を残して、１２のように０．１
１１１１１１角、間隔０．１ｍｍの■盤１］のパターン
の独立電極の集合体どする。この集合体の良さは左右共
１．５ｍとした。BaOMOOB203S! A thick film electrode 11 having a shape as shown in FIG. 4 is printed on an enamel substrate 10 made of glazed and fired 02 series crystallized glass. The tip of the electrode has a gap of 0.1 m as shown in 12, leaving a gap 13 (1 m) at the middle gate.
An assembly of independent electrodes with a pattern of 111111 squares and a spacing of 0.1 mm. The quality of this aggregate was set at 1.5 m on both the left and right sides.
電極材料としては、Δｑ粉７５重Ｍ％、Ｐ ｂ ０−８
２０３−８ ｉｏ２系ｉ ラス５ ｍ ｆｆｉ ％、残
部エヂルセルロースにブヂルカルビトールアセテート、
もしくはテルピネオール等のシンナーを加えて、３木ロ
ールにて混練したものを使用した。As an electrode material, Δq powder 75% by weight, P b 0-8
203-8 io2 series i last 5 m ffi%, balance edyl cellulose, butyl carbitol acetate,
Alternatively, a thinner such as terpineol was added and kneaded using a Miki roll.
これを８５０℃、１０分間焼成して電極とした。This was baked at 850°C for 10 minutes to form an electrode.
焼成後の膜厚は５岬であった。The film thickness after firing was 5 capes.
その後、図示のようにヒま−ズ電極部分より左右に０．
２５ｍＭづつ拡げた４、５ｓＸ４．５請の窓を開け、そ
の他の部分にはオーバーグレーズを施した。このＡ−バ
ーグレーズの焼成は５００℃、５分間行った。After that, as shown in the figure, 0.
A window of 4.5 s x 4.5 sq. wide with 25 mM was opened, and the other areas were overglazed. This A-Burglaze was fired at 500°C for 5 minutes.
図の白線で囲った領域に半田パウダーと松ヤニ、シンナ
ーよりなる半田ペーストをスクリーン印刷にて１５０＃
１９塗イ１１シ、１９０℃にて３０秒間加熱し、半溶融
状態にしてヒユーズを形成した。Screen print a 150# solder paste consisting of solder powder, pine tar, and thinner in the area surrounded by the white line in the diagram.
Coated No. 19 and No. 11 were heated at 190° C. for 30 seconds to form a semi-molten state and a fuse was formed.
以上のように形成したヒＪ−ズ回路は、１８０℃以上の
温度に達した後、２分間以内に作動した。The fuse circuit formed as described above was activated within 2 minutes after reaching a temperature of 180° C. or higher.
作シＪ後、両端の電極は、半田くわれしており、半田付
着可能な面積は、ｉ［極印刷焼成時の６０％以下となっ
ており、半田ごて等での修復は困難になった。After printing, the electrodes at both ends are soldered, and the area where solder can be attached is less than 60% of the area when printed and fired, making it difficult to repair with a soldering iron, etc. Ta.
本発明の基板ヒユーズ回路は、−度ヒ１−ズが作動した
後は、両端の゛電極に半１′ｆＩ＜われを生じているた
めに、修復が困難になっている。従って、基板自体を差
し替えるほかはなく、設計者の意図しない形での再生が
なされないため、イ＾謹回路としてのべ能を十分に果た
すことができる。In the substrate fuse circuit of the present invention, after the fuse is activated, the electrodes at both ends are half cracked, making it difficult to repair. Therefore, there is no choice but to replace the board itself, and since it will not be reproduced in a manner unintended by the designer, it can fully fulfill its function as a safe circuit.
製造方法としても、スクリーン印刷により、多数の微小
独立電極を、両端の電極の先端部に容易に形成できるの
で、本発明のヒユーズ回路を確実にＩＩ造することがで
きる。As a manufacturing method, a large number of small independent electrodes can be easily formed at the tips of the electrodes at both ends by screen printing, so that the fuse circuit of the present invention can be reliably manufactured.
第１図は本発明の基板ヒユーズ回路の平面図である。
第２図は第１図の断面ｑ面図である。
第３図はヒユーズ作動後の断面立面図を示す。
第４図は実施例の基板ヒユーズ回路の平面図である。
第５図は従来の基板ヒユーズ回路の平面図である。
第６図は第５図の断面立面図である。
第７図は第６図のヒユーズが作動した後の断面立面図で
ある。FIG. 1 is a plan view of a substrate fuse circuit of the present invention. FIG. 2 is a cross-sectional q-plane view of FIG. 1. FIG. 3 shows a cross-sectional elevation view after the fuse has been actuated. FIG. 4 is a plan view of the substrate fuse circuit of the embodiment. FIG. 5 is a plan view of a conventional substrate fuse circuit. FIG. 6 is a cross-sectional elevational view of FIG. 5. FIG. 7 is a cross-sectional elevational view after the fuse of FIG. 6 has been actuated.
Claims (3)
構造のヒューズ回路において、両端の電極の先端部の大
部分を半田と低融点合金を作り易い金属の多数の独立し
た微小電極の集合体で構成し、この電極を半田で結ぶ構
造とし、ヒューズ作動後両端の電極が半田くわれを起し
て、修復が不能となるように構成した基板ヒューズ回路
。1. In a fuse circuit that connects electrodes formed on a substrate with a fuse, most of the tips of the electrodes at both ends are composed of a large number of independent microelectrodes made of metal that is easy to form with solder and a low-melting point alloy. However, this board fuse circuit has a structure in which these electrodes are connected with solder, so that after the fuse is activated, the electrodes at both ends will be soldered and cannot be repaired.
て、１００〜２００μｍの格子状の隙間を持った、１０
０〜２００μｍ角で厚さが５〜１５μｍの多数の厚膜導
体よりなり、中間部に空隙をもたせた基板ヒューズ回路
。2. 10. The electrodes at both ends according to claim 1 have a grid-like gap of 100 to 200 μm, leaving a part of the base part.
A substrate fuse circuit consisting of a large number of thick film conductors measuring 0 to 200 μm square and 5 to 15 μm thick, with a gap in the middle.
を残して互いに１００〜２００μｍの間隔をあけた、多
数の１００〜２００μｍ角を有するパターンの導体層を
スクリーン印刷により印刷焼成して形成したのち、ヒュ
ーズを形成するための電極間部分を除いた部分にソルダ
ーレジスト層を印刷焼成して形成し、ついで該電極間に
半田ペーストを印刷焼成してヒューズを形成することを
特徴とする基板ヒューズ回路の製造方法。3. Between the electrodes of the conductor circuit divided on the substrate, a conductor layer was formed by screen printing and firing a pattern having a large number of squares of 100 to 200 μm, with an interval of 100 to 200 μm left in the middle. A substrate fuse characterized in that a solder resist layer is then printed and fired on a portion other than a portion between electrodes for forming a fuse, and then a solder paste is printed and fired between the electrodes to form a fuse. Method of manufacturing circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28669688A JPH02133981A (en) | 1988-11-15 | 1988-11-15 | Manufacture of substrate fuse circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28669688A JPH02133981A (en) | 1988-11-15 | 1988-11-15 | Manufacture of substrate fuse circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02133981A true JPH02133981A (en) | 1990-05-23 |
| JPH0524677B2 JPH0524677B2 (en) | 1993-04-08 |
Family
ID=17707800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28669688A Granted JPH02133981A (en) | 1988-11-15 | 1988-11-15 | Manufacture of substrate fuse circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02133981A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009099372A (en) * | 2007-10-17 | 2009-05-07 | Taiheiyo Seiko Kk | Fuse element and fusible link using the fuse element |
-
1988
- 1988-11-15 JP JP28669688A patent/JPH02133981A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009099372A (en) * | 2007-10-17 | 2009-05-07 | Taiheiyo Seiko Kk | Fuse element and fusible link using the fuse element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0524677B2 (en) | 1993-04-08 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |