JPH02130941A - Mounting method for ic chip onto substrate - Google Patents

Abstract

PURPOSE:To unnecessitate a positioning mark formed on a chip or a substrate, and facilitate mounting by a method wherein, when an IC chip is mounted on a substrate via CCB(controlled collapse bonding), positioning is performed while the chip is subjected to magnification see-through observation by using a transparent substrate. CONSTITUTION:An IC chip is mounted on a precisely movable stand 9 on which a heater is arranged in a body. Above the chip, a transparent substrate 11 is so arranged that its electrode pattern 7 for connection use almost faces a CCB bump 6. When the substrate 11 is observed from above the transparent substrate 11 with an optical apparatus 8 like a microscope, the degree of positioning between the pattern 7 and the bump 6 can be easily confirmed. In the case where perfect positioning is not achieved, the movable stand 9 is travelled in XY direction to complete the positioning. After that, the substrate 11 is made to descend, and the bump is once melted by the heater 10. Thereby, the pattern 7 is connected with the bump 6, and the chip 2 is mounted on the substrate 11.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a method for mounting or attaching an IC chip to a board via a CCB bump, and in particular to a method for easily mounting an IC chip by ensuring that the IC chip is well positioned on the board. This invention relates to a method for mounting an IC chip onto a substrate.

[Conventional technology]

The integrated circuit itself, the so-called IC chip, is made into a CCB (Cont
rolled Co11apse Bonding
) The method shown in FIG. 2 has been known for mounting or attaching to a board via bumps.

That is, a mark 5 is provided in advance at a position on the back side corresponding to the mounting position of the CCB bump 6 on the IC chip 2, and similarly corresponds to a position of the electrode pattern 7 for connection with the CCB bump 6 on the substrate 3. Positioning marks 5 are also provided in advance on the back side of the IC chip 2, and while positioning these marks 5, the CCB bumps 6 are once melted and the IC chip 2 is connected to the connection electrode pattern 7.

6 As shown in the figure, I is mounted on the board 3.
The C chip 2 and the substrate 3 are initially positioned so that the CCB bumps 6 and the connection electrode patterns 7 face each other, but any misalignment at that time is managed by the optical synthesis device EI using a double-sided exposure device or mirror 4. - It is designed to be detected as a deviation between the marks 5 and 5. If a misalignment is detected, the substrate 3 is finely adjusted to eliminate the misalignment, thereby positioning the IC chip 2 on the substrate 3. The IC chip 2 can be positioned and mounted on the substrate 3 by melting and connecting it to the connecting electrode pattern 7.

Incidentally, an example of a technique related to this type of technology is JP-A-63-56922.

[Problem to be solved by the invention]

However, until now, positioning marks had to be formed in advance on the IC chip and the board on which it is mounted, which not only unnecessarily complicated the manufacturing process, but also made it difficult to place the IC chip on the board. IC chips cannot be easily mounted on a substrate because an optical synthesis device is required for positioning and mounting.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for mounting an IC chip on a substrate, which allows the IC chip to be easily mounted on the substrate without forming positioning marks on the IC chip or the substrate.

[Means to solve the problem]

The above object is achieved by positioning the IC chips while viewing them through the transparent substrate in an enlarged manner, and then connecting them with a CCB.

[Effect]

A connection electrode pattern (or CCB
Bumps) are formed on the IC through this transparent substrate.
When a chip is viewed under magnification, the connection electrode pattern (or CCB bump) and the CCB bump (or connection electrode pattern) pre-formed on the IC chip are easily positioned and CCB connection can be made. It is something.

〔Example〕

The present invention will be explained below with reference to FIG.

FIG. 1 shows the method according to the invention.

As shown in the figure, an IC chip 2 is placed on a fine movement movable table 9 to which a heater lO is integrally attached.
At the top, there is also a transparent substrate IT with its connecting electrode pattern 7.
is positioned substantially opposite the CCB bump 6. Therefore.

By observing the transparent substrate 11 from above using an optical device 8 such as a microscope, it is easy to check the degree of positioning of the connection electrode pattern 7 and the CCB bump 6 due to the transparency of the transparent substrate 11. It can be done. If they are not perfectly positioned, the connection electrode pattern 7 and the CCB bump 6 can be easily positioned by finely adjusting the movable table 9 in the XY force directions.

With the transparent substrate 1 positioned as described above, the transparent substrate 1! is lowered to a predetermined position and once the CCB bumps 6 are melted by the heater lO, the connection electrode pattern 7 is connected to the CCB bumps 6, and the IC chip can be easily mounted on the transparent substrate 11. It's something you get.

By the way, there are various possible materials for the transparent substrate IT, such as acrylic, plastic, glass,
Epoxy is now being used.

〔Effect of the invention〕

As explained above, according to the present invention, it is not necessary to form positioning marks on the IC chip or the substrate, and the IC chip can be easily mounted on the substrate.

[Brief explanation of drawings]

FIG. 1 is a diagram for explaining an example of a method of mounting an IC chip on a substrate according to the present invention, and FIG. 2 is a diagram for explaining a mounting method according to the prior art. 2...IC chip, 6...CCB bump, 7...
Connection electrode pattern, 8...optical device (such as a microscope). 9... Fine movement movable table, 11... Transparent substrate. Patent applicant Hitachi Communication Systems Co., Ltd. Representative Patent Attorney
Akimoto Masami Outer 1 famous port

Claims (1)

[Claims] 1. Using a method of mounting the IC chip on the substrate via CCB bumps, while looking through the IC chip through the transparent substrate, it is possible to connect the connection electrode pattern or CCB bumps formed on the substrate in advance and on the IC chip in advance. An IC chip in which the formed CCB bump or connection electrode pattern is positioned by finely adjusting either the chip or the transparent substrate, and then the CCB bump is melted to connect the bump and the connection electrode pattern. mounting method on the board.