JPH02130892A - Molded board with circuit pattern - Google Patents

Abstract

PURPOSE:To eliminate cutting of a circuit pattern, to improve reliability, to improve productivity, and to easily form the patterns on both side faces of a molded board by integrating the molded board made of nonconductive resin and the pattern made of conductive resin by double molding. CONSTITUTION:A groove 16 is formed on the inner face of a sheath molded board 12 molded from nonconductive resin. The groove 16 is formed in the same pattern as the circuit pattern integrally molded within the inner face of the board 12. A hook 24 for securing an electronic component 22 is integrally molded with the board 12, and a click 24A is formed at the end of the hook 24. A circuit pattern 14 is double molded in the groove 16 of the board 12 in the same mold. The end of the connecting leg 22A of the component 22 is inserted into the hole 26A of the end 26 of a circuit pattern 14 and the hole 28A of a terminal 28 by the operation of the board 12. Then, the component 22 is pressed down. In this case, the click 24A is engaged with the upper face of the component 22 by the lateral elastic deformation and the release of the deformation. The component 22 is electrically connected to the pattern 14.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a substrate with a circuit pattern used in electronic equipment such as a camera, and more particularly to a molded substrate with a circuit pattern in which the substrate is molded.

[Conventional technology]

Conventionally, in electronic devices such as cameras, a printed circuit board is fixed inside an external case of the electronic device, and electronic components are mounted on the printed circuit board. However, in recent years, electronic devices have become smaller and lighter, and one way to do this is to integrally form a circuit pattern on the inner surface of the outer molded case of the electronic device in order to remove the printed circuit board. Mounting electronic components is being considered.

For example, Japanese Patent Application Laid-Open No. 63-80597 discloses that a flexible printed circuit is temporarily fixed to the inner surface of a mold, and when molding resin for an exterior case with the mold, the flexible printed circuit and the exterior molded case are A method of integration is disclosed. Further, Japanese Utility Model Application Publication No. 63-55568 discloses an exterior molded board with a circuit pattern in which a circuit film in which a desired circuit pattern is formed on a plastic film using copper foil or conductive paste is integrated with an exterior molded case. There is.

[Problem that the invention seeks to solve]

However, if a flexible printed circuit or a circuit film is integrally formed on the exterior mold case during molding of the exterior mold case, there is a problem that the circuit pattern may be cut and the reliability of the circuit pattern is low.

Further, when a circuit pattern is required on the inner and outer surfaces of the exterior molded case, there is a problem in that it is difficult to mold the circuit pattern on both surfaces.

The present invention was made in view of the above circumstances, and it is possible to improve reliability and productivity by eliminating cutting of circuit patterns, and furthermore, it is possible to easily mold circuit patterns on both sides of a molded substrate. The purpose of the present invention is to provide a molded substrate with a circuit pattern that can be used to create a circuit pattern.

[Means for solving problems]

In order to achieve the above object, the present invention provides a molded substrate with a circuit pattern used for electronic devices such as cameras.
It is characterized in that a molded substrate made of non-conductive resin and a circuit pattern made of conductive resin are integrated by double molding.

[Effect]

According to the present invention, the molded substrate made of non-conductive resin and the circuit pattern made of conductive resin are double-molded and integrated, so that the circuit pattern is not cut during molding. Further, circuit patterns can be easily formed on both sides of the molded substrate.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a molded substrate with a circuit pattern according to the present invention will be described in detail below with reference to the accompanying drawings.

As shown in FIG. 1, a molded substrate 10 with a circuit pattern
consists of an exterior molded substrate 12 and a circuit pattern 14, and the exterior molded substrate 12 is molded with a non-conductive resin. On the inner surface of the exterior mold substrate 12, a second
As shown in the figure, grooves 16, 16... are formed. The groove 16 is formed in the same pattern as the circuit pattern integrally formed on the inner surface of the exterior molded substrate 12.

In addition, in portions of the circuit pattern of the exterior molded board 120 corresponding to terminals, through holes 18, holes 20 whose bottoms are closed, etc. are formed as necessary. Furthermore, a hook 24 for fixing the electronic component 22 is integrally molded on the exterior molded substrate 12, and a claw 24A is molded at the end of the hook 24.

The circuit pattern 14 is double molded in the groove 16 of the exterior mold substrate 12 using the same mold. Further, terminals 26 of the circuit pattern 14 are formed in the through holes 18 of the exterior molded substrate 120. This terminal 26 can be used as a terminal for the circuit pattern 14 formed on the upper and lower surfaces.

As shown in FIG. 3, the terminal 26 is formed with a hole 26A into which the connecting leg 22A of the electronic component 22 can be inserted.
The diameter of the hole 26A is formed so as to gradually decrease from the opening between the inner and outer surfaces of the exterior molded substrate 12 to the center of the hole 26A. Therefore, the connection leg 22 of the electronic component 22
A is securely connected at the center of the terminal 14A. In addition, the terminals 28 of the circuit pattern 14 on the inner surface side of the outer molded substrate 12 are formed in the holes 20 formed on the inner surface of the outer molded substrate 12. The holes 28A are formed in the terminals 28.

The motor with circuit pattern according to the present invention configured as described above. The function of the board will be explained below.

First, the tips of the connecting legs 22A, 22A of the electronic component 22 are inserted into the holes 26A of the terminals 26 and the holes 28A of the terminals 28 of the circuit pattern 14. Next, electronic component 22 is pushed down. At this time, the electronic component 22 and the claw 24A of the hook 24
Because of the interference, the electronic component 22 is pushed down and the hook 24 is elastically deformed in the lateral direction. Therefore, the electronic component 22 climbs over the claw 24A and is placed in the position shown in FIG. At the same time, the claw 24A and the electronic component 2
2 is released, and the elastic deformation of the hook 24 in the lateral direction is released, so that the claw 24A is locked onto the upper surface of the electronic component 22. As a result, the electronic component 22 is connected to the circuit pattern 14.
electrically connected to.

Next, electronic components are sequentially mounted in accordance with the procedure described above, and the exterior molded substrate 12 is fixed to the other exterior molded case to form an electronic device.

In the embodiment described above, the terminals 26 of the circuit pattern 14 are formed as shown in FIG. 3, but the invention is not limited to this, and may be formed as shown in FIGS. 4(A) and 4(B). Another embodiment of the molded substrate with a circuit pattern according to the present invention will be described below with reference to FIG. Incidentally, the same members as those in the above embodiment are given the same reference numerals and the explanation thereof will be omitted.

A hole 30 whose diameter gradually decreases from the inner surface to the outer surface is formed in the exterior molded substrate 12. A terminal 32 of the circuit pattern 14 is molded in the hole 30, and the terminal 32 has legs 32A, 32A, 32A, which are molded approximately parallel to the inner surface of the hole 30.
It is formed from 32A.

Therefore, when the connecting legs 22A of the electronic component 22 are inserted into the terminals 32, the legs 32A, 32A of the terminals 32.

32A, 32A grasp the connection leg 22A, and connect the electronic component 22
is electrically connected to the circuit pattern 14.

Furthermore, as another method, the electronic components 22 can be
The circuit pattern 14 may be electrically connected. -Also, in the above embodiment, the electronic component 22 is fixed with the hook 24, but it may be fixed only with the terminal of the circuit pattern 14 and the connection leg 22A of the electronic component.

Further, in the above embodiment, the circuit pattern 14 is double-molded on the exterior molded case 14, but the circuit pattern 14 is not limited to this, and may be double-molded on a mold substrate other than the exterior mold.

Note that for double molding, either outsert molding or insert molding may be used.

〔Effect of the invention〕

As explained above, according to the molded board with a circuit pattern according to the present invention, since the molded board and the circuit pattern are integrated by double molding a non-conductive resin material and a conductive resin material, the circuit pattern is formed during molding. Cutting of the pattern can be prevented, reliability of the circuit pattern can be improved, and productivity can be improved. Furthermore, circuit patterns can be easily formed on both sides of the molded substrate.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of a molded board with a circuit pattern according to the present invention, FIG. 2 is a sectional view taken along line AA in FIG.
Figure 3 is an enlarged view of the B-B section in Figure 2, Figure 4, (A)
4 is a cross-sectional view of a main part showing another embodiment of a molded substrate with a circuit pattern according to the present invention, and FIG. 4(B) is a view taken along arrow CC in FIG. 4(A). 10...Mold board with circuit pattern, 12...
・Exterior mold case, 14...Circuit pattern,
16...Electronic parts. 1st mouth

Claims (1)

[Claims] In a molded substrate with a circuit pattern used in electronic devices such as cameras, a molded substrate made of a non-conductive resin and a circuit pattern made of a conductive resin are integrated by double molding. A molded board with a circuit pattern.