JPH02128863A - Thermal head array - Google Patents

Abstract

PURPOSE:To eliminate a mechanismical restriction in loading by a method wherein only a heating element is provided on the top surface of an insulating substrate, the other electric circuits are provided on the rear surface thereof, and the electric circuits are connected to the heating element via through holes provided on the insulating substrate. CONSTITUTION:Each through hole 16 is provided on every end of a lead 14 to be connected, whereby a heating element 1 on the top surface of an insulating substrate 10 is connected to an electric circuit on the rear surface thereof. In some cases, the through hole 16 is made only a hole, and a conductor may be passed through the hole to connect the both surfaces of the insulating substrate 10. After an IC 13 is formed and connected, the IC is subjected to a sealing 130. In a thermal head array having the aforesaid structure, the heating element 1 is disposed on the top of the insulating substrate 10. Therefore, a structural restriction with respect to the fixing of a platen roller and a thermal head is eliminated, an overall dimension is decreased, and the reduced impedance of a common electrode 7 results in the increase of a maximum simultaneous printing dot number.

Description

[Detailed description of the invention] [Industrial application fields] It concerns door arrays.

[Prior Art] FIG. 2 is an explanatory diagram showing the configuration of a thermal RAD array, in which (1) is an arrangement of heating element elements, (2) is a shift register, (3) is a latch, and (4) is an arrangement of heating element elements. is the driver
(5) is the power supply, (6) is the switch, (60), (61)
, (62) are the contacts of switch (6), (71), (72
) is a common electrode, dl and d2 are backflow blocking diodes, (
81).

(82)・ ・ ・ (91), (92) ・ ・
・It is a beam.

When contacts (60) and (62) of switch (6) are connected and only Dl of driver (4) is on, current flows between leads (81) and (91). A heating element between them is heated. When contacts (60) and (61) are connected and only Dl is in the on state, current flows between leads (82) and (91), heating the heating element located therebetween. It is also possible to omit the switch (6) and adopt a configuration in which the common electrodes (71) and (72) are combined. In this case, when only driver D1 is in the on state, between leads (81) and (91) and lead (8)
A current flows between leads (81) and (91), and leads (81) and (
82) The heating element between the two is heated.

Figures 3 and 4 are side views showing the structure of a conventional thermal array. In these figures, (1) is a heating element, (10) is an insulating substrate, (11) is a recording paper, and (12) is a heating element.
) is the roller, (13) is the shift register (2) in Figure 2.
, latch (3), driver (4), diode di, d
The ICs (integrated circuits) (14) that constitute 2..., etc. are (81), (82)...(91), (9) in Figure 2.
This is a lead corresponding to 2).

In the example shown in FIG. 3, the heating element (1) and other electric circuits are mounted on one side of the insulating substrate (10), and in the example shown in FIG. 4, the side surface of the end of the insulating substrate (10) heating element (
1) is provided, and other electrical circuits are provided on both sides of the insulating substrate (10).

[Problems to be Solved by the Invention] In the conventional structure as described above, as shown in FIG.
Since the recording must be made by pressing against the roller, the dimensions of the insulating substrate (10) must be determined according to the dimensions of the roller.
゛ Also, in order to avoid the influence of the wiring resistance of the common electrode, the thickness or width of the lines that make up the common electrode should be increased, but parallel lines must be formed, as shown in Figure 3. In the structure shown, since the common electrode is on the same surface as the heating element, it is difficult to implement these measures, and in the structure shown in Figure 4, the lead (14) is placed near the heating element (1). There was a problem in that it became difficult and required microfabrication and curved surface treatment of the end face portion to which the heating element (1) is attached.

This invention was made to solve the above-mentioned problems in the conventional ones, and its object is to provide a thermal RAD array suitable for mounting on a thermal recording device.

[Means for Solving the Problems] In the present invention, only the heating element is provided on the surface of an insulating substrate, other electric circuits are provided on the back side of the insulating substrate, and the connection between the electric circuit and the heating element is insulated. This was done through a through hole provided on the board.

[Since the size of the working board is small and the heating element is located at the top of the board, there are no mechanical constraints on fixing the RAD array to the platen roller or thermal.

[Embodiments] Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1st
The figure is an explanatory diagram showing one embodiment of the present invention, and FIG. 1(a)
is an elevational view, Figure 1(b) is a plan view showing the surface, and Figure 1(b) is a plan view showing the surface.
c) is a plan view showing the back surface. In the figure, the same reference numerals as in Figure 3 indicate the same or corresponding parts, and (7) is the same as in Figure 2 (
Common electrodes correspond to 71) and (72), (15) is a connector, and (16) is a through hole. Also, (130
) represents IC sealing performed after forming the IC (13).

A through hole (16) is provided at each end of the lead (14) to be connected, and the heating element (16) is provided on the surface of the insulating substrate (10).
) and the electric circuit on the back side.

Depending on the case, the through hole (16) may be just a hole and a conductor may be passed through the hole to connect both sides of the insulating substrate (10).After the formation of the IC (13) and its connection are completed, the IC sealing ( 130).

In the thermal array with the above structure, the heating element (1) is located at the top of the insulating substrate (10), so there are no mechanical constraints on fixing the platen roller or thermal head, and the overall size is reduced. , common electrode (7
) is reduced, the maximum number of simultaneously printed dots can be increased, and the glue leads (14) on both sides as shown in Figure 4 are no longer necessary, eliminating the risk of breakage of leads at the end faces. .

[Effects of the Invention] As described above, according to the present invention, there are advantages in that the overall size of the thermal array is reduced, mechanical constraints on mounting are eliminated, and the impedance of the common electrode is reduced.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing an embodiment of the present invention, FIG. 2 is an explanatory diagram showing the configuration of a thermal RAD array, and FIGS. 3 and 4 are side views showing the structure of a conventional thermal RAD array. DESCRIPTION OF SYMBOLS 1... Heating element, 7... Common electrode, 10 Insulating substrate, 13... IC114 lead, 16... Through hole. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] Heating elements for performing thermal recording on thermal recording paper are arranged, and any element (single or plural) of the array of heating elements is selected and only the selected element generates heat. In a fixed thermal head array equipped with an electric circuit that performs control such as An electric circuit that controls the flow of current only to selected elements of the lever is constructed on the back side of the insulating substrate, and connection between the electric circuit and the heating element is made through a through hole provided in the insulating substrate. A thermal head array characterized by a row of rows.