JP2852905B2 - Printer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printer device using a print head substrate having a heating resistor.

[0002]

2. Description of the Related Art Conventionally, as this type of printer,
For example, there is one described in JP-A-63-98451. The printer device described in the publication is provided so as to be rotatable with respect to the housing body so as to be rotatable, while attaching the print head substrate to the housing body,
A platen is attached to the rotating body. According to such a configuration, the recording paper is supplied between the platen and the print head substrate, and the platen is brought close to the print head substrate so that the recording paper is along the surface of the heating resistor of the print head substrate. In addition, predetermined printing can be performed on recording paper.

[0003]

In this type of printer, a control circuit board for controlling the driving of a heating resistor for printing provided on the print head board is electrically connected to the print head board. There is a need. However, in the past, the control circuit board was not mounted on the housing body or the rotating body, but was disposed at a position considerably distant from the print head substrate. Then, the control circuit board and the print head board are connected using a flexible cord having a relatively long dimension.

Therefore, conventionally, noise is apt to be mixed into the high-frequency control signal transmitted from the control circuit board to the print head board, and this has been a factor of deteriorating the printer performance. In addition, the flexible cord used for connecting the control circuit board and the print head board generally has a high manufacturing cost, and the connection work is complicated, and the manufacturing cost of the entire printer device is high. There was also a problem of becoming.

The present invention has been made under the above circumstances, and aims to improve the performance of a printer by reducing the possibility that noise is mixed in a control signal transmitted to a print head substrate. It is an object of the present invention to provide a printer device which can reduce the manufacturing cost.

[0006]

Means for Solving the Problems To solve the above problems, the present invention takes the following technical means.

That is, the invention described in claim 1 of the present application provides a housing body, a rotating body rotatably supported with respect to the housing body, and one of the housing body and the rotating body. A print head substrate provided on a member, a control circuit board for performing drive control of a heating resistor for printing provided on the print head substrate, and the housing body facing the print head substrate And a platen provided on the other member of the rotating body, and, on the print head substrate, a printer device provided with a plurality of connection terminals, wherein the plurality of connection terminals,
The control circuit board is arranged intensively in a partial area in the longitudinal direction of the print head board, and the control circuit board is provided on one of the housing body and the rotating body on which the print head board is provided. A plurality of connection terminals provided on the control circuit board are disposed close to a plurality of connection terminals of the print head board, and each connection between the control circuit board and the print head board is provided. The terminals are characterized by being lead-connected to each other.

According to a second aspect of the present invention, there is provided the printer according to the first aspect, wherein a support plate is provided on the housing main body or the rotating body, and the print head substrate is provided. Is adhered and supported by the support plate on a part of the back surface in the longitudinal direction other than where the plurality of connection terminals are provided on the print head substrate.

The invention described in claim 3 of the present application is the printer device according to claim 2, wherein the support plate is
It is elastically deformable, and is elastically urged by a spring at a plurality of portions in the longitudinal direction in a direction facing the platen.

The invention described in claim 4 of the present application is the printer device according to claim 2, wherein the support plate is
While the platen is rigid with respect to the member to which it is attached, the platen is elastically biased by a spring in a direction facing the printhead substrate.

The invention described in claim 5 of the present application is the printer device according to claim 2, wherein the support plate is
A part of one member of the housing body and the rotating body, on which the support plate is provided, is formed integrally with the member by performing a bending process.

The invention described in claim 6 of the present application is the printer device according to claim 2, wherein the support plate is
A part of the control circuit board is an extended part.

[0013]

According to the first aspect of the present invention, the control circuit board is attached to one of the two members, the housing body and the rotating body, on which the print head board is provided. Since the control circuit board is brought closer to the print head board, the wiring distance for electrically connecting the control circuit board and the print head board can be shortened. Therefore,
It is possible to make it difficult for noise to be mixed into a high-frequency control signal transmitted from the control circuit board to the print head board, and to prevent a decrease in printer performance due to the noise.

According to the first aspect of the present invention, since the connection terminals of the control circuit board and the print head board are lead-connected to each other by using a lead foot or the like, the conventional flexible cord is not used. Compared with the means used, the cost of parts can be reduced by the amount that the expensive flexible cord can be dispensed with. In addition, mechanization of lead connection work can be easily performed,
It is also possible to reduce the operation cost of the wiring connection operation.

Further, according to the first aspect of the present invention, since the control circuit board can be attached to the housing main body or the rotating body with good space efficiency while approaching the print head board. The overall size can also be reduced.

In the invention described in claim 2 of the present application, since only a part of the back surface of the print head substrate is adhered to the support plate, the print head substrate and the heating resistor on the print head substrate are formed. Warpage due to the so-called bimetal effect can be prevented from occurring between the support plate and the support plate where heat is transmitted from the body and undergoes thermal expansion.
In particular, the bonding site between the printhead substrate and the support plate
In the longitudinal direction of the print head board, since the connection terminal is a portion other than the portion where the connection terminal is provided in a concentrated manner, when a lead foot or the like is soldered to the connection terminal, the solder connection portion is heated. It can also be prevented from being adversely affected by stress. Therefore, the reliability of the electrical conduction between the print head substrate and the control circuit substrate can be maintained for a long period of time.

In the invention described in claim 3 of the present application, since the support plate for supporting the print head substrate is elastically deformable and is urged in a platen direction at a plurality of longitudinal positions thereof. When the print head substrate is brought into contact with the platen, the heating resistor on the print head substrate can be brought into contact with the platen at a uniform pressure over the entire length in the longitudinal direction. Therefore, printing quality can be improved.

In the invention described in claim 4 of the present application, although the support plate for supporting the print head substrate is rigid, the platen side is elastically urged by a spring, so that the urging force of this spring is used. As a result, the surface of the platen can be appropriately brought into contact with the heating resistor of the print head substrate. This is not a configuration in which a spring or the like is provided on the print head substrate side, so that the print head portion provided with the print head substrate can be made thinner, which is preferable.

In the invention described in claim 5 of the present application, since the support plate for supporting the print head substrate is formed by bending a part of the housing body or the rotating body, the support plate is formed. As compared with the case where is formed by a separate member, the total number of components can be reduced, the manufacturing of the printer device can be facilitated, and the manufacturing cost can be further reduced.

In the invention described in claim 6 of the present application, since the support plate for supporting the printhead substrate is formed by extending a part of the control circuit board, the support plate is substantially formed. A configuration similar to that obtained by removing the plate can be used. Therefore, even in this case,
As in the case of claim 5, the total number of parts is reduced,
It is possible to facilitate the manufacture of the printer device and to further reduce the manufacturing cost.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is a plan view showing an example of a print head substrate 1 used in the printer according to the present invention.

In the print head substrate 1, a printing medium as a printing medium extending in parallel with the one side edge 2a near one side edge 2a of the material substrate 2 is formed on the upper surface of a strip-shaped material substrate 2 made of ceramic or the like. The heating resistor 3 is formed linearly. On the other hand, a plurality of drive ICs 4 for driving the heating resistor 3 for each predetermined number of dots are arranged in a row near the other side edge 2b of the head substrate 1 along a straight line parallel to the other side edge. Are located.

As can be seen from FIG. 1, in the print head substrate 1, the area a in the longitudinal direction of the substrate where the drive ICs 4 are to be disposed is intentionally shorter than the effective length b of the heating resistor 3. The other side edge 2 is set at both ends of the board, which is
A plurality of connection terminals 5 are arranged in a concentrated manner along b. The portion where the connection terminals 5 are arranged and the portion where the drive IC 4 is arranged do not overlap in the longitudinal direction of the substrate. On the other hand, the portion where the connection terminal 5 is arranged overlaps with the area where the heating resistor 3 is arranged in the longitudinal direction of the substrate.

A common wiring pattern 6 is formed over the entire length in the longitudinal direction of the substrate in a band-shaped region between the heating resistor 3 and one side edge 2a of the substrate. At both ends of the substrate, it is connected to one of the connection terminals 5 while crossing in the width direction. The connection terminals 5 are provided at both ends in the longitudinal direction of the substrate 1, and it is not necessary to make the common wiring pattern 6 wrap around the central portion in the longitudinal direction of the substrate 1. Can be prevented from becoming unnecessarily long. In FIG. 1, each driving IC 4...
A fine wiring pattern to be formed between them and a wiring pattern for controlling signal input / output between each connection terminal 5 and each drive IC 4 are omitted.

FIG. 2 shows the details of the left end of the print head substrate 1 shown in FIG. 1, FIG. 3 shows the details of the intermediate portion, and FIG. 4 shows the details of the right end.

As can be understood from FIGS. 2 to 4, the print head substrate 1 is provided with a large number of wire bonding pads 7. A comb-shaped fine wiring pattern 8 is formed which extends while slightly increasing the mutual distance as it goes. From each end of the fine wiring pattern 8, a dot drive pattern 9 at equal intervals is formed in a comb-like shape. Extends to. Between the unit patterns of the dot drive patterns 9 are individual common patterns 10 whose bases are commonly conducted to the common wiring pattern 6. Then, the above-mentioned comb-shaped dot drive pattern 9
And the overlapping portion with the individual common pattern 10 having a comb-like shape is made to run vertically in the longitudinal direction of the substrate.
Are provided by thick film printing.

As can be understood from FIG. 2, the longitudinal center of the heating resistor 3 constituting the block to be handled by the first drive IC 4 and the longitudinal center of the first drive IC 4 are arranged. The positional relationship is such that the central portion in the longitudinal direction of the driving IC 4 is deviated from the central portion in the longitudinal direction of the substrate 2. Thereby, the driving I in the longitudinal direction of the substrate is performed.
Space margins are formed on both sides of the portion where C4 is provided. Then, as described above, the necessary external connection terminals 5 are provided by utilizing the space allowance.

In this embodiment, as shown in FIG. 2, eight external connection terminals 5 are provided at the left end of the head substrate.
... are arranged in a concentrated manner. These external connection terminals are, in order from the left end, a common terminal (COM), a power ground terminal (PG), a power ground terminal (PG), a thermistor connection terminal (TM), and a logic ground terminal (L).
G), data-in terminal (DI), strobe terminal (AE)
O2), and a logic power supply terminal (VDD). The reason why both the second and third terminals from the left are power ground terminals (PG) is that a sufficient amount of current can be obtained.

On the other hand, as shown in FIG. 4, eight external connection terminals 5 are also provided at the right end of the head substrate 1. These are the terminals for common (CO
M), power ground terminal (PG), power ground terminal (PG), thermistor connection terminal (TM), logic ground terminal (LG), strobe terminal (AEO)
1), a logic power supply terminal (VDD), and a clock pulse terminal (CP).

As described above, both ends of the left and right common terminals (COM) are connected by conductor patterns at both ends of the common wiring pattern 6 which is routed in parallel to the upper side of the substrate of the heating resistor 3. ing. A power ground pattern 11 extending from one of the left and right power ground terminals (PG) extends in the longitudinal direction of the substrate through the lower layer of the area where the drive IC 4 is provided, and extends to the other of the left and right power ground terminals (P).
G). In the power ground pattern 11, bonding portions 11a branching downward and extending downward from a portion passing through a lower layer of the drive IC 4 are formed at predetermined intervals. In the illustrated example, one drive I
With respect to the region where C4 rides, three bonding pad portions 11a extend in a branched manner from the left end, the center, and the right end of this region.

A thermistor arrangement pattern 12 is formed and connected relatively close to each of the left and right thermistor connection pads. The logic ground pattern 13 extending from the logic ground terminal (LG) and the data-in terminal (D
I) four wiring patterns 14, 1 consisting of a data-in pattern 14, a strobe pattern 15 extending from the strobe terminal (AEO2), and a logic power pattern 16 extending from the logic power terminal (VDD).
5, 16 and 17 are arranged in parallel without intersecting with each other, and are formed so as to extend generally in the longitudinal direction of the substrate while bending in a zigzag manner while bypassing the branched bonding pad portions 11a of the power ground pattern 11. I have.

However, the data-in pattern 14 corresponds to a data-in pad (D) provided at the left end of the drive IC 4.
In the vicinity of I), it starts near the data out pad (DO) formed near the right end of the driving IC 4 and again stops near the data in pad (DI) of the adjacent driving IC 4. Is formed. That is, this data-in pattern 14 is used for each driving IC 4.
It is formed so as to cascade between them. Since the print data is sequentially sent between the driving ICs 4..., The input terminal (DI) to be provided on the substrate
Need not be provided for the external connection terminals 5 provided at the right end of the head substrate. If necessary, a data-out terminal may be provided at the rightmost terminal of the substrate.

Instead of the external connection terminals 5 at the right end of the substrate, clock pulse terminals (CP) are provided at the innermost positions. The clock pulse pattern 17 extending from the clock pulse terminal (CP) includes a logic ground pattern 13, a data-in pattern 14, a strobe pattern 15, and a logic power supply extending in a zigzag and parallel manner in the longitudinal direction of the substrate as described above. The lower side of the head substrate of the pattern 16 extends in parallel from right to left and extends in parallel from the right.
And ends with the corresponding part. The clock pulse pattern 17 has a bonding portion 17a which branches into a comb-shaped portion provided at a predetermined portion of the logic power supply pattern 16 and enters.

On the other hand, the signal pads provided on the lower side of each drive IC 4...
From left to right, two power ground pads (PGN
D), data in pad (DI), logic power pad (VDD), clock pulse pad (CP), negative logic strobe pad (AEO), logic ground pad (LGND), two power ground pads (PGN)
D), logic power supply pad (VDD), positive logic strobe pad (BEO), latch pad (LA), data out pad (DO), logic ground pad (LGN)
D) and two power ground pads (PGN)
D), and these pads and the above-mentioned wiring patterns 11, 12, 13, 14, 15, 16, 17 are
Each is connected by wire bonding.

Here, corresponding pads of the respective drive ICs 4 are commonly connected to wiring patterns other than the data-in pattern 14. In the drawing, of the wiring patterns formed on the substrate, a portion extending in the vertical direction functions as a wire bonding part for performing wire bonding. The figure shows a state where wire bonding is performed while the negative logic strobe specification is selected.

In the illustrated example, the wiring pattern configuration in the case of controlling the drive IC without using an independent latch signal or a latch terminal is shown. In the illustrated example, this can be achieved by replacing the pattern corresponding to the logic ground pattern 13 with the latch signal pattern. After mounting each drive IC 4 and performing predetermined wire bonding, this drive IC or bonding wire is protected by resin.

Then, the dot drive pattern 9 specified at a certain time instant is turned on by a control signal input to each drive IC 4 via each of the connection terminals 5. A current is caused to flow in a region defined by the two individual common patterns 10 located in the region (1), and the heating resistor 3 in that region is heated.

The drive IC 4 shown in FIG. 3 or a wiring pattern related thereto appears repeatedly in the longitudinal direction of the substrate. More specifically, among the plurality of driving ICs 4, the wiring patterns respectively associated with all the intermediate driving ICs except the driving ICs at both ends are a repetition of the wiring pattern shown in FIG. In this way, even when the print width is changed, the design of the wiring pattern itself can be completed simply by increasing or decreasing the number of repetitions of the wiring pattern shown in FIG. The wiring design cost can be significantly reduced, and each drive IC can be visually or image-recognized.
Also in the case of inspecting the wire bonding between each signal pad and the wiring pattern of No. 4, the effect that the workability is remarkably improved can be obtained.

In the above configuration, as shown in FIG. 1, the arrangement area a of the drive ICs 4 arranged on the substrate is intentionally set shorter than the effective length b of the heating resistor 3 so that A space margin is formed at both ends in the longitudinal direction, and necessary connection terminals 5 are provided without overlapping the drive IC 4 in this portion. Therefore, the drive IC 4 and the side edge 2b of the substrate are provided. The width of the strip-shaped region between the two can be made as narrow as necessary and sufficient for the wiring pattern to be disposed here. Therefore, the width dimension of the print head substrate 1 can be reduced. Further, in the print head substrate 1, necessary connection terminals 5 are provided.
Are not merely concentrated at both ends of the substrate, but a space margin for doing so is required by the drive IC 4.
Is achieved by reducing the length of the arrangement region, so that the length of the substrate does not increase. In particular, since the connection terminal 5 overlaps with the arrangement region of the heating resistor 3 in the longitudinal direction of the substrate, the arrangement region of the connection terminal 5 is located outside of the arrangement region of the heating resistor 3 in the longitudinal direction of the substrate. It is also possible to avoid a large protrusion toward one side, and it is possible to more appropriately prevent the longitudinal dimension of the substrate from increasing.

Further, in the illustrated example, each of the wiring patterns 11 and 1 electrically connected to the connection terminals 5 provided at both ends of the substrate.
3, 15, 16, and 17 are juxtaposed so as to extend generally in the longitudinal direction of the substrate.
Since the input / output pads on C4... Are commonly connected, the number of the connection terminals 5 can be significantly reduced.

In FIGS. 1 to 4, the substrate 2
The connection terminals 5 are arranged in a concentrated manner at both ends in the longitudinal direction of the substrate. However, the connection terminals 5 may be provided at only one of the two ends in the longitudinal direction of the substrate. I don't care.

FIG. 5 shows a print head substrate 1 having the above configuration.
FIG. 3 is a perspective view illustrating an example of a print head configured using a print head. This print head is configured so that the print head substrate 1 is supported by a support plate 18 and is connected to a control circuit substrate 19.

The support plate 18 has a function to reinforce the fragility of the print head substrate 1 having the material substrate 2 made of ceramic and to radiate the heat generated by the heating resistor 3 on the substrate. Formed of a sheet metal material or an aluminum plate.

In this print head, the support plate 18 is partially provided on the back surface of the print head substrate 1 at a portion other than the portion where the connection terminals 5 are provided.
Are bonded. As shown in FIG. 5, when the connection terminals 5 are provided at both ends in the longitudinal direction of the substrate, it is preferable that only the central portion in the longitudinal direction of the rear surface of the substrate 1 is bonded to the support plate 18 with an adhesive. is there. The portions other than the central portion in the longitudinal direction of the print head substrate 1 are merely in contact with the support plate 18 and are not fixed to each other. Therefore, both ends of the print head substrate 1 are supported. It is relatively movable in the longitudinal direction with respect to the plate 18.

The reason for this construction is that the difference in the coefficient of thermal expansion between the print head substrate 1 formed of ceramic and the support plate 18 formed of aluminum or iron sheet metal is caused by the bimetal effect. This is for avoiding the occurrence of warpage.

The connection terminals 5 provided at both ends in the longitudinal direction of the print head board 1 are connected to the control circuit board 1.
9 is electrically connected. In the example shown in FIG. 5, clip-type lead feet 2 are connected to the connection terminals 5.
.. Are connected by soldering or the like, and the lower ends of the lead legs 20 are connected to pad-shaped connection terminals (not shown) provided on the control circuit board 19 by soldering or the like. The control circuit board 19 is basically a separate member from both the support plate 18 and the print head board 1, and in particular, there is no direct mechanical connection with the support plate 18. Not.

In the above configuration, the print head substrate 1 is adhered to the support plate 18 only at the center, except at both ends where the connection terminals 5 are provided. The thermal stress resulting from the difference in the coefficient of thermal expansion between the connection terminal 5 and the support plate 18 does not adversely affect the portion where the connection terminal 5 is disposed. Therefore, in the case of the present example, there is no fear that the solder for connecting the lead foot 20 and the connection terminals 5...
0 and the connection terminals 5... Are maintained for a long period of time.

Since the print head substrate 1 basically completes the function as a head substrate without requiring any additional members such as a holding cover, the support plate 18 is previously attached to a printer device. By providing the control circuit board 19, even if the control circuit board 19 is disposed under the control circuit board 19, the distance in the thickness direction between the control circuit board 19 and the head substrate 1 can be extremely reduced. The electric connection between the head substrate 1 and the head substrate 1 can be achieved by a very simple method such as using a lead foot 20 with a clip.

Furthermore, since the head substrate 1 and the control circuit substrate 19 can be configured so as to be very close to each other, the generation of noise in the control signal using the high-frequency signal is extremely reduced. Greatly contributes to improving the performance of the printer.

FIG. 6 shows a connection method between the control circuit board 19 and the connection terminals 5 on the head board in the configuration of the print head shown in FIG. 5, in which both ends of the lead wires are soldered. This is an example of changing to. Note that, in the figure, the control circuit board 19 is fixedly supported by a support member in the printer device.

Further, the method of electrical conduction between the connection terminals 5 of the print head board 1 and the control circuit board 19 is not limited to the above, and as shown in FIG. The signal extraction portions 21 protruding from both ends of one side edge are partially overlapped with the connection terminals 5... The connection terminals 5 and the pad-like connection terminals formed on the upper surface of the signal extraction portion 21. 22 may be connected by wire bonding. As can be seen from FIG. 7, the plurality of connection terminals 22 provided on the control circuit board 19 are provided at positions respectively corresponding to the plurality of connection terminals 5 on the print head board 1.

8 to 12 are schematic side views showing specific examples of the printer according to the present invention. These printers are constructed using the print heads shown in FIGS. 5 to 7, and include a housing body 23 and a rotating body 2 rotatably supported with respect to the housing body 23.
4 is provided. In these drawings, mechanisms such as a paper feed mechanism are omitted.

In the example shown in FIG. 8, of the two members connected by the hinge 26, the lower member is integral with the housing body 23, and the upper member corresponds to the rotating body 24. The housing body 23 has a support plate 18 integrally formed by bending the distal end of the housing body 23 into a U-shape in cross section. The print head illustrated in FIGS. The substrate 1 is bonded. of course,
In this case, the print head substrate 1 is bonded to the support plate 18 only at the center in the longitudinal direction. The control circuit board 19 is attached to the housing main body 23 so as to approach the print head board 1. The connection between the connection terminals 5 of the print head substrate 1 and the control circuit board 19 is performed by connecting the connection terminals 5 to the lead legs 2 with clips.
0 is connected by solder, and the lower end of this lead foot is
Connector 2 mounted and fixed on a suitable portion of the upper surface of control circuit board 19
7 (connection terminal).

On the other hand, the rotating body 24 is provided with a platen 29 elastically urged by a spring 28 toward the print head substrate 1. When the rotating body 24 is in the closed state, the platen 29 uniformly contacts the heating resistor 3 of the print head substrate 1 over the entire length in the longitudinal direction.

In the example shown in FIG. 9, the platen 29 is supported on a frame integrated with the housing body 23, while the rotating body 24 is supported.
The support plate 18 is attached via a plurality of leaf springs 30, and the print head substrate 1 is bonded and supported to the support plate 18. Also in this case, it goes without saying that only the center rear surface of the print head substrate 1 is bonded to the support plate 18.

A control circuit board 19 is fixedly supported on the inner surface of the rotating body 24. Electrical conduction between the control circuit board 19 and the connection terminals 5 of the print head board 1 is controlled by a lead with a clip. This is achieved by soldering the feet 20 together. Also, the support plate 18 in this example
Is constituted by a member which can be elastically deformed to some extent. Therefore, this elastically deformable support plate 18 is connected and supported to the rotating body 24 via the leaf spring 30 at a plurality of positions in the longitudinal direction. And the rotating body 24
Is in a predetermined closed state, the heating resistor 3 of the print head substrate 1 comes into uniform contact with the peripheral surface of the platen over the entire length in the longitudinal direction while elastically deforming according to the peripheral surface shape. . As a result, the print quality is improved or the print quality is maintained at a high level without any thermal influence.

In the example shown in FIG. 10, a swelling support plate 18 is integrally formed on a frame integral with the housing body 23, and the print head substrate 1 is bonded to the support plate 18 thus formed. The electrical continuity with the control circuit board 19 supported on the inner surface of the frame integral with the housing body 23 is
This is achieved by the lead foot 20. Also, the rotating body 24
Supports a platen 29 elastically biased toward the print head substrate 1 by a spring 28. As is clear from this figure, the support plate 18 is
It can be seen that the thickness of the printing portion is extremely thin because the frame is formed integrally with the frame.

In the example shown in FIG. 11, the control circuit board 19 and the print head board 1 are mounted and supported on the upper surface of the rotating body 24, but the control circuit board 19 is further extended forward to control this. The board material itself constituting the circuit board functions as the support plate 18. With such a configuration, the number of parts can be further reduced. Then, the rotating body 24 is urged upward by a spring 28, and the platen 29 supported by the housing body 23.
Of the heating resistor 3 of the print head substrate 1
Are made to abut elastically.

In the example shown in FIG. 12, the support plate 18 is integrally formed by bending the tip of a plate-like frame integral with the housing main body 23 into a step-up shape.
8, the head substrate 1 is adhered and supported in a predetermined manner,
The connection terminals 5 of the head substrate 1 are connected to the control circuit substrate 19 attached to the frame by lead legs 20. Further, as described above, the support plate 18 formed by bending the end of the frame in a step-up manner is positively urged upward by a spring 28, whereby the platen 29 supported by the rotating body 24 is moved upward. The heating resistor 3 of the head substrate 1 is configured to abut against the peripheral surface with an appropriate elasticity.

As described above, in any of the printers shown in FIGS. 8 to 12, the support plate 18 for bonding and supporting the head substrate 1 is formed on a member constituting the housing of the printer. The support plate or the holding plate is omitted. Therefore, the thickness of the printing unit in the printer can be reduced accordingly, and as a result, the thickness of the printer can be reduced.

Further, in each of the above-mentioned printers, the print head board 1 and the control circuit board 19 are attached to one of the housing body 23 and the rotating body 24 in a close relationship, and the space between them is relatively large. Since the connection is made by electrical conduction means such as the short lead foot 20,
It is possible to prevent noise from being mixed into a high-frequency signal to be used for controlling the drive IC 4 on the print head substrate, thereby achieving high performance of the printer device.

Of course, the present invention is not limited to the above embodiment. It goes without saying that the printer device according to the present invention can be configured as a single unit, or can also be configured as, for example, a printer unit incorporated in a facsimile device.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an example of a print head substrate applied to a printer device according to the present invention.

FIG. 2 is an enlarged plan view showing a left end wiring pattern configuration of the print head substrate shown in FIG.

FIG. 3 is an enlarged plan view showing a wiring pattern configuration and an IC mounting configuration at an intermediate portion in a longitudinal direction of the print head substrate of FIG. 1;

FIG. 4 is an enlarged plan view showing a configuration of a right end wiring pattern of the print head substrate of FIG. 1;

FIG. 5 is a perspective view showing an example of a print head formed using the print head substrate shown in FIG.

FIG. 6 is a perspective view showing another example of the print head.

FIG. 7 is a perspective view showing an example of a case where an electrical connection is made between a print head substrate and a control circuit substrate.

FIG. 8 is a schematic side view showing an example of a printer device according to the present invention.

FIG. 9 is a schematic side view showing another example of the printer device according to the present invention.

FIG. 10 is a schematic side view showing another example of the printer device according to the present invention.

FIG. 11 is a schematic side view showing another example of the printer device according to the present invention.

FIG. 12 is a schematic side view showing another example of the printer device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Print head board 2 Material board (strip-shaped board) 3 Heating resistor (printing medium) 4 Drive IC 5 Connection terminal 6 Common wiring pattern 11, 13, 15, 16, 17 Wiring pattern 18 Support plate 19 Control circuit board 23 Housing body 24 Rotating body 25 Printer device 29 Platen

Continuing on the front page (72) Inventor Toshihiko Kishimoto 21st Mizozakicho, Saiin, Ukyo-ku, Kyoto-shi ROHM Co., Ltd. Tsukasa 21st, Mizozaki-cho, Saiin, Ukyo-ku, Kyoto-shi ROHM Co., Ltd. (72) Inventor Naoto Matsumoto 258-1 Okuma Omagi, Aki-shi, Fukuoka ROHM Amagi Co., Ltd. 1. Inside ROHM Amagi Co., Ltd. (56) References JP-A-62-259879 (JP, A) JP-A-60-2381 (JP, A) JP-A-1-97670 (JP, A) Jpn. (JP, U) Japanese Utility Model Hei 2-44046 (JP, U) (58) Fields surveyed (Int. Cl. ⁶ , DB name) B41J 2/32 B41J 2/335 B41J 2/345 B41J 25/304-25 / 316

Claims (6)

(57) [Claims] A housing body, a rotating body rotatably supported with respect to the housing body, a printhead substrate provided on one of the housing body and the rotating body, A control circuit board for performing drive control of a heating resistor for printing provided on the print head board; and a control circuit board provided on the other of the housing body and the rotating body so as to face the print head board. And a plurality of connection terminals are provided on the print head substrate, wherein the plurality of connection terminals are formed in a longitudinal direction of the print head substrate.
If it is concentrated in some area in the direction
In addition, the control circuit board is attached to one of the housing body and the rotating body on which the print head board is provided, and a plurality of connection terminals provided on the control circuit board are provided on the control circuit board. A printer device, which is arranged close to a plurality of connection terminals of a print head board, and wherein the respective connection terminals of the control circuit board and the print head board are lead-connected to each other. 2. A support plate is provided on the housing main body or the rotating body, and the print head substrate is arranged in a longitudinal direction other than a position where a plurality of connection terminals of the print head substrate are provided. The printer device according to claim 1, wherein a part of the back surface is adhesively supported by the support plate. 3. The printer device according to claim 2, wherein said support plate is elastically deformable, and is elastically urged by a spring at a plurality of longitudinal positions thereof in a direction facing said platen. 4. The printer according to claim 2, wherein the support plate is rigid with respect to a member to which the support plate is attached, and the platen is elastically biased by a spring in a direction facing the print head substrate. apparatus. 5. The supporting plate is formed integrally with the housing body and the rotating body by bending a part of one of the members on which the supporting plate is provided. Item 3. The printer according to Item 2. 6. The printer device according to claim 2, wherein the support plate is a portion where a part of the control circuit board is extended.