JPH02295762A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH02295762A JPH02295762A JP11653989A JP11653989A JPH02295762A JP H02295762 A JPH02295762 A JP H02295762A JP 11653989 A JP11653989 A JP 11653989A JP 11653989 A JP11653989 A JP 11653989A JP H02295762 A JPH02295762 A JP H02295762A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- mounting
- thermistor
- heat generating
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000010009 beating Methods 0.000 abstract 1
- 239000011295 pitch Substances 0.000 description 18
- 235000007173 Abies balsamea Nutrition 0.000 description 2
- 241000218685 Tsuga Species 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004040 coloring Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007651 thermal printing Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、サーマルプリントに際して使用される号一マ
ルヘソドの改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement of No. 1 Malhesod used in thermal printing.
一般に、サーマルフリントハ、サーマルヘノドにおける
絶縁基仮に設けた発熱体に電流を流したときに発生する
ジュール熱により、前記サーマルヘッドに接触する記録
紙にドットを発色させて印字を行うものであるから、こ
の一連の動作中において、前記絶縁基板にＮ熱の作用が
起こり、サーマルヘッド全体の温度が上昇して、前記ド
ットのサイズが太き《なったり、記録紙に尾引き現象が
出たり、サーマルヘッドの寿命が短くなったりする問題
が発生する。In general, a thermal flint is used to print by coloring dots on the recording paper that comes into contact with the thermal head using the Joule heat generated when a current is passed through a heating element temporarily provided in the insulating base of the thermal head. During this series of operations, the action of N heat occurs on the insulating substrate, the temperature of the entire thermal head increases, the size of the dots becomes thicker, trailing occurs on the recording paper, and thermal Problems such as shortened head life may occur.
このＭ熱を防止するための一つの方法として、サーマル
ヘソドにおける絶縁基板にサーミスタを取付けて、蓄熱
量をフィードバソクする方法があり、このサーミスタを
使用した従来のサーマルヘッドには、サーミスタを、例
えば、特開昭６２−２７０３４８号公報における第２頁
左上欄３〜４行目に記載されているように、当該サーマ
ルヘッドにおける絶縁基板の裏面に対して装着したもの
と、第２図に示すように、細幅状の絶縁基坂ｌの表面に
、当該絶縁基板１の長手力向に沿って適宜長さ寸法Ｌの
発熱部１ａを複数一直線状に並べて形成すると共に、当
該絶縁基板１の長手方向に延びる共通導体１ｂを形成し
、更に、前記絶縁基板１の表面に、前記各発熱部１ａと
絶縁基板１の長手方向に沿って前記発熱部ｌａの長さ寸
法Ｌと同じピッチ間隔Ｐで設けた複数の駆動用ＩＣ搭載
部ＩＣとの相互間を各々連絡する多数本の個別導体１ｄ
を形成して成るサーマルヘッド−において、前記絶縁基
板ｌの長手方向の一端部又は両端部に、延長部１ｅを設
け、この延長部１ｅの表面に、サーミスタ２を装着した
ものとがある。One method to prevent this M heat is to attach a thermistor to the insulating substrate of the thermal head to feed back the amount of heat storage. As described in the 3rd to 4th lines of the upper left column on page 2 of Japanese Patent Application Laid-open No. 62-270348, there are two types of thermal heads: one mounted on the back surface of the insulating substrate in the thermal head, and the other as shown in Fig. 2. , a plurality of heat generating parts 1a having an appropriate length dimension L are formed in a straight line along the longitudinal force direction of the insulating substrate 1 on the surface of the narrow insulating base slope l, and the longitudinal direction of the insulating substrate 1 is A common conductor 1b is formed extending to the surface of the insulating substrate 1, and is further provided on the surface of the insulating substrate 1 at a pitch interval P that is the same as the length L of the heat generating portion la along the longitudinal direction of each of the heat generating portions 1a and the insulating substrate 1. A large number of individual conductors 1d each communicate with the plurality of drive IC mounting ICs.
In some thermal heads, an extension part 1e is provided at one or both ends in the longitudinal direction of the insulating substrate l, and a thermistor 2 is mounted on the surface of the extension part 1e.
しかし、前者のように、サーミスタを、絶縁基板の裏面
に装着することは、絶縁基板に、その表面における各種
駆動用ＩＣ等と、裏面におけるサーミスタとを接続する
ための回路を形成しなければならないので、回路構成が
複雑になるのである。However, in order to mount the thermistor on the back side of the insulating substrate as in the former case, it is necessary to form a circuit on the insulating substrate to connect various driving ICs etc. on the front side and the thermistor on the back side. Therefore, the circuit configuration becomes complicated.
また、後者のように、絶縁基板ｌに延長部１ｅを造形し
、この延長部１ｅの表面にサーミスタ２を装着すること
は、回路構成が簡屯になる利点を有する反面、絶縁基板
１にサーミスタ２を装着するための延長部１ｅを一体的
に造形しなければならないので、絶縁基板１が大型くな
り、コストのアップを招来するのであり、しかも、この
ように、絶縁基板１における長手方向の端邪に延長部１
ｅを造形し、この延長部１ｅの表面にサーミスク２を装
着することは、サーミスタ２が、絶縁基板１における熱
の発生源である発熱部１ａから離れ、大気空気の温度の
影響を受けることになるから、正確な温度制御を行うこ
とができないのである。Furthermore, as in the latter case, forming an extension 1e on the insulating substrate 1 and mounting the thermistor 2 on the surface of the extension 1e has the advantage of simplifying the circuit configuration; Since the extension portion 1e for attaching the insulating substrate 1 must be integrally formed, the insulating substrate 1 becomes large and increases the cost. Extraordinary extension part 1
By molding e and attaching the thermistor 2 to the surface of this extension 1e, the thermistor 2 is separated from the heat generating part 1a, which is the source of heat in the insulating substrate 1, and is affected by the temperature of the atmospheric air. Therefore, accurate temperature control cannot be performed.
本発明は、これら従来の問題を解消したサーマルヘッド
を提供することを目的とするものである。An object of the present invention is to provide a thermal head that solves these conventional problems.
この目的を達成するため本発明は、細幅状の絶縁基板の
表面に、当該絶縁基板の長平方向に沿って適宜長さ寸法
の発熱部を複数一直線状に並べて形成すると共に、当該
絶縁基板の長手力向に延びる共通導体を形成し、更に、
前記絶縁基板の表面に、前記各発熱部と絶縁基板の長手
力向に沿って設けた複数の駆動用ＩＣ搭載部との相互間
を各々連絡する多数本の個別導体を形成して成るサーマ
ルヘソドにおいて、前記各駆動用！Ｃ搭載部の相互間に
おける各ピッチ間隔のうち少なくとも一つのピッチ間隔
を除く他の各ピッチ間隔を、前記発熱部の長さ寸法より
も小さい寸法に、前記少なくとも一つのピッチ間隔を、
発熱部の長さ寸法より大きい寸法に構成して、この大き
くした少なくとも一つのピッチ間隔の部位に、サーミス
タを装着する構成にした。In order to achieve this object, the present invention forms a plurality of heat-generating portions having appropriate lengths in a straight line along the longitudinal direction of the insulating substrate on the surface of the narrow insulating substrate, and forming a common conductor extending in the longitudinal direction;
In a thermal hesode, a number of individual conductors are formed on the surface of the insulating substrate to connect each of the heat generating parts and a plurality of driving IC mounting parts provided along the longitudinal direction of the insulating substrate. , for each drive mentioned above! C, each pitch interval other than at least one pitch interval between the mounting parts is set to a dimension smaller than the length dimension of the heat generating part, and the at least one pitch interval is set to a dimension smaller than the length dimension of the heat generating part,
The length is larger than the length of the heat generating part, and a thermistor is attached to the area having at least one of the increased pitches.
このように構成すると、サーミスタを、絶縁基板の表面
のうち各駆動用ＩＣ搭載部の間の部位で、熱の発生源で
ある発熱部の近い部位に装着できるから、サーミスタに
対する大気空気の温度の影響を低減することができる。With this configuration, the thermistor can be mounted on the surface of the insulating substrate between the driving IC mounting parts, close to the heat generating part that is the source of heat, so that the temperature of the atmospheric air relative to the thermistor can be adjusted. The impact can be reduced.
従って本発明によると、サーミスタによるサーマルヘッ
ドの温度制御を、正確に行うことができるのであり、し
かも、サーミスタを、絶縁基板の表面のうち各駆動用ｉ
ｃＷＩＢ部の間の部位に装着することにより、前記従来
のように、絶縁基板の一端部にサーミスタを装着するた
めの延長部を設ける必要がないから、絶縁基板を小型化
でき、これに加えてサーミスタに対する回路構造も節単
になるので、サーマルヘッドのコストを大幅に低減でき
るのである。Therefore, according to the present invention, it is possible to accurately control the temperature of the thermal head using the thermistor, and furthermore, the thermistor is placed on each driving i of the surface of the insulating substrate.
By mounting the thermistor between the cWIB parts, there is no need to provide an extension part for mounting the thermistor at one end of the insulating board as in the conventional case, so the insulating board can be made smaller. Since the circuit structure for the thermistor is also simplified, the cost of the thermal head can be significantly reduced.
その上、前記のように、各駆動用ｒｃ搭載部の相互間に
おける各ピッチ間隔のうち少なくとも一つのピッチ間隔
を除く他の各ピッチ間隔を、発熱部の長さ寸法よりも小
さい寸法に、前記少なくとも一つのピッチ間隔を、発熱
部の長さ寸法より大きい寸法に構成して、この大きくし
た少なくとも一つのピッチ間隔の部位に、サーミスタを
装着する構成にしたことにより、前記大きくした少なく
とも一つのピッチ間隔の部位に、サーミスタに加えて、
他の電子部品を装着することが可能である効果をも有す
る。Moreover, as described above, each pitch interval except for at least one of the pitch intervals between the driving RC mounting parts is set to a dimension smaller than the length dimension of the heat generating part. At least one pitch interval is configured to be larger than the length dimension of the heat generating part, and a thermistor is attached to a portion of the increased at least one pitch interval. In addition to the thermistor at the interval site,
It also has the effect of allowing other electronic components to be attached.
以下、本発明の実施例を図面（第１図）について説明す
ると、図において符号Ａは、サーマルヘノドを示し、該
サーマルヘッドＡは、細幅状の絶縁基板１０の表面に、
当該絶縁基板１０の長手力向に沿って適宜長さ寸法Ｌに
した複数個（本実施例では、６個）の発熱部ｌ１を一直
線状に並べて形成すると共に、当該絶縁基板１の長手方
向に延びる共通導体１２を形成し、更に、前記絶縁基坂
１の表面に、前記各発熱部１１と絶縁基板ｌの長手方向
に沿って設けた複数個（６個）の駆動用ＩＣ搭載部１３
ａ，１３ｂ，１３ｃ，１３ｄ，１３ｅ，１３ｆとの相互
間を各々連絡する多数本の個別導体１４を形成したもの
に構成されている。Hereinafter, an embodiment of the present invention will be described with reference to the drawing (FIG. 1). In the drawing, the symbol A indicates a thermal head, and the thermal head A is attached to the surface of a narrow insulating substrate 10.
A plurality of (six in this example) heat generating parts l1 having an appropriate length L are formed in a straight line along the longitudinal direction of the insulating substrate 1, and An extending common conductor 12 is formed, and a plurality of (six) driving IC mounting portions 13 are provided on the surface of the insulating base slope 1 along the longitudinal direction of each of the heat generating portions 11 and the insulating substrate l.
A, 13b, 13c, 13d, 13e, and 13f are formed with a large number of individual conductors 14 that communicate with each other.
そして、前記各駆動用ｒｃ搭載部１３ａ，１３ｂ，
１ ３ ｃ， １ ３ ｄ， １ ３ ｅ， １
３ ｆのうち、第１番目のＩＣ搭載部１３ａと第２番
目のＩＣ搭載部１３ｂとの間におけるピッチ間隔Ｐ１、
第２番目のＩＣ搭載部１３ｂと第３番目のＩＣ搭載部１
３ｃとの間におけるピ・ノチ間隔Ｐ２、第４番目のＩＣ
搭載部１３ｄと第５番目のＩＣ搭載部１３８との間にお
けるピソチ間隔Ｐ４、及び第５番目のＩＣ搭載部１３ｅ
と第６番目のｒｃ搭載部１３『との間におけるピッチ間
隔Ｐ５を、それぞれ、前記発熱部１１における長さ寸法
Ｌより小さい寸法にすることによって、第３番目のＩＣ
搭載部１３Ｃと第４番目のＩＣ搭載部１３ｄとの間にお
けるピッチ間隔Ｐ３を、前記発熱部における長さ寸法Ｌ
より大きい寸法に広げて、この第３番目のＩＣ搭載部１
３ｃと第４番目のＩＣ搭載部１３ｄとの間の部位に、サ
ーミスタ１５を装着する。And each of the driving rc mounting parts 13a, 13b,
1 3 c, 1 3 d, 1 3 e, 1
3f, the pitch interval P1 between the first IC mounting section 13a and the second IC mounting section 13b,
Second IC mounting section 13b and third IC mounting section 1
3c, pitch-notch interval P2, 4th IC
Pisochi interval P4 between the mounting section 13d and the fifth IC mounting section 138, and the fifth IC mounting section 13e
By making the pitch interval P5 between the RC mounting portion 13 and the sixth RC mounting portion 13 smaller than the length L of the heat generating portion 11, the third IC
The pitch interval P3 between the mounting section 13C and the fourth IC mounting section 13d is defined as the length dimension L of the heat generating section.
Expand this third IC mounting part 1 to a larger size.
A thermistor 15 is mounted between the IC mounting section 3c and the fourth IC mounting section 13d.
このように構成すると、サーミスタｌ５を、絶縁基板１
０の表面のうち第３番目のｒｃ搭ｆ２部１３ｃと第４番
目のｒｃ搭載部１３ｄとの間の部位で、熱の発生源であ
る発熱部ｌ１の近い部位に装着できるから、サーミスタ
１５に対する大気空気の温度の影響を低減できると共に
、絶縁基板１０の長平方向の端部に、サーミスタを装着
するための延長部を造形することを回避することができ
る。With this configuration, the thermistor l5 is connected to the insulating substrate 1.
0 between the third RC mounting part 13c and the fourth RC mounting part 13d on the surface of the RC mounting part 13c, it can be mounted near the heat generating part l1 which is the source of heat. The influence of atmospheric air temperature can be reduced, and it is also possible to avoid forming an extension part for mounting a thermistor on the end of the insulating substrate 10 in the longitudinal direction.
なお、前記実施例は、各駆動用ＩＣ搭載部１３ａ，１３
ｂ，１３ｃ，１３ｄ，１３ｅ １３ｆの相互間におけ
る各ビソチ間隔ＰＩ，Ｐ２，Ｐ３，Ｐ４．Ｐ５のうち、
中央に位置する少なくとも一つのピノチ間隔Ｐ３を除く
他の各ビソチ間隔Ｐｌ，Ｐ２．Ｐ４，Ｐ５を、発熱体１
１の長さ寸法Ｌより小さい寸法に、前記少なくとも一つ
のピッチ間隔Ｐ３を、発熱体１１の長さ寸法Ｌより大き
い寸法に構成することにより、サーミスタ１５を、絶縁
基板１０の長平方向の略中央部に装着する場合を示した
が、本発明は、これに限らず、例えば、各ピッチ間隔Ｐ
Ｌ，Ｐ２，Ｐ３，Ｐ４，Ｐ５のうち、ピッチ間隔Ｐ１を
除く他の各ピッチ間隔Ｐ２Ｐ３，Ｐ４，Ｐ５を小さい寸
法に、前記ピッチ間隔Ｐ１を大きい寸法に構成すること
によって、サーミスタ１５を、第１番目のＩＣ搭載部１
３ａと第２番目のＩＣ搭載部１３ｂとの間の部位に装着
すると云うように、サーミスタｌ４を、各ＩＣ搭載部１
３ａ，１３ｂ，１３ｃ，１３ｄ，１３ｅ１３ｆの相互間
のうち、任意の部位に装着する、ように構成しても良い
のであり、また、前記サーミスタ１５に並べて、他の電
子部品１６を装着することもできるのである。Note that in the above embodiment, each driving IC mounting portion 13a, 13
b, 13c, 13d, 13e 13f, each bisochi interval PI, P2, P3, P4. Of P5,
Except for at least one Pinotti interval P3 located in the center, each of the other Binotti intervals Pl, P2 . P4, P5, heating element 1
By configuring the at least one pitch interval P3 to be larger than the length L of the heating element 11, the thermistor 15 is positioned approximately at the center of the insulating substrate 10 in the longitudinal direction. However, the present invention is not limited to this, and for example, the present invention is applicable to each pitch interval P.
Among L, P2, P3, P4, and P5, the thermistor 15 is constructed by configuring the pitch intervals P2, P3, P4, and P5 other than the pitch interval P1 to be small, and the pitch interval P1 to be large. 1st IC mounting part 1
A thermistor 14 is attached to each IC mounting part 1, such as to be mounted between the second IC mounting part 13a and the second IC mounting part 13b.
3a, 13b, 13c, 13d, 13e13f, it may be configured to be attached to an arbitrary position, and other electronic components 16 may be attached in line with the thermistor 15. It can be done.
第１図は本発明の実施例によるサーマルヘノドの平面図
、第２図は従来のサーマルヘソドの平面図である。
Ａ・・・・サーマルヘッド、１０・・・・絶縁基板、ｌ
ｌ・・・・発熱部、１２・・・・共通導体、１３ａ，１
３ｂ．１３ｃ，１３ｄ，１３ｅ． １３ｆ−−−・駆
動用ＩＣ搭載部、１４・・・・共通導体、１５・・・・
サーミスタ、１６・・・・他の電子部品、Ｌ・・・・発
熱部の長さ寸法、Ｐｌ，Ｐ２，Ｐ３．Ｐ４，Ｐ５・・・
；駆動用ＩＣ搭載部のピッチ間隔。FIG. 1 is a plan view of a thermal hemlock according to an embodiment of the present invention, and FIG. 2 is a plan view of a conventional thermal hemlock. A: Thermal head, 10: Insulating substrate, l
l... Heat generating part, 12... Common conductor, 13a, 1
3b. 13c, 13d, 13e. 13f----Drive IC mounting part, 14... Common conductor, 15...
Thermistor, 16...Other electronic components, L...Length dimension of heat generating part, Pl, P2, P3. P4, P5...
; Pitch interval of the drive IC mounting section.
Claims (1)
手方向に沿って適宜長さ寸法の発熱部を複数一直線状に
並べて形成すると共に、当該絶縁基板の長手方向に延び
る共通導体を形成し、更に、前記絶縁基板の表面に、前
記各発熱部と絶縁基板の長手方向に沿って設けた複数の
駆動用ＩＣ搭載部との相互間を各々連絡する多数本の個
別導体を形成して成るサーマルヘッドにおいて、前記各
駆動用ＩＣ搭載部の相互間における各ピッチ間隔のうち
少なくとも一つのピッチ間隔を除く他の各ピッチ間隔を
、前記発熱部の長さ寸法よりも小さい寸法に、前記少な
くとも一つのピッチ間隔を、発熱部の長さ寸法より大き
い寸法に構成して、この大きくした少なくとも一つのピ
ッチ間隔の部位に、サーミスタを装着したことを特徴と
するサーマルヘッド。(1) On the surface of a narrow insulating substrate, a plurality of heat-generating portions with appropriate length dimensions are formed in a straight line along the longitudinal direction of the insulating substrate, and a common conductor extends in the longitudinal direction of the insulating substrate. Further, a large number of individual conductors are formed on the surface of the insulating substrate to connect each of the heat generating parts and a plurality of driving IC mounting parts provided along the longitudinal direction of the insulating substrate. In the thermal head, each of the pitch intervals between the drive IC mounting parts, excluding at least one pitch interval, is set to be smaller than the length of the heat generating part; A thermal head characterized in that the at least one pitch interval is configured to be larger than the length dimension of the heat generating part, and a thermistor is attached to a portion of the increased at least one pitch interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11653989A JPH02295762A (en) | 1989-05-09 | 1989-05-09 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11653989A JPH02295762A (en) | 1989-05-09 | 1989-05-09 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02295762A true JPH02295762A (en) | 1990-12-06 |
| JPH0417798B2 JPH0417798B2 (en) | 1992-03-26 |
Family
ID=14689627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11653989A Granted JPH02295762A (en) | 1989-05-09 | 1989-05-09 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02295762A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04284264A (en) * | 1991-03-13 | 1992-10-08 | Rohm Co Ltd | Thermal head |
| JPH0584952A (en) * | 1991-09-30 | 1993-04-06 | Rohm Co Ltd | Printing head substrate, printing head equipped therewith and printer using them |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731072U (en) * | 1980-07-28 | 1982-02-18 |
-
1989
- 1989-05-09 JP JP11653989A patent/JPH02295762A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731072U (en) * | 1980-07-28 | 1982-02-18 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04284264A (en) * | 1991-03-13 | 1992-10-08 | Rohm Co Ltd | Thermal head |
| JPH0584952A (en) * | 1991-09-30 | 1993-04-06 | Rohm Co Ltd | Printing head substrate, printing head equipped therewith and printer using them |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0417798B2 (en) | 1992-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02295762A (en) | Thermal head | |
| US6404453B1 (en) | Thermal printhead and clip pin used for the same | |
| JP7310082B2 (en) | Driver IC for thermal print head and thermal print head | |
| JP3167262B2 (en) | Line type thermal print head | |
| EP0491388B1 (en) | Thermal printing head | |
| KR970004235B1 (en) | Thermal print head | |
| JP3234003B2 (en) | Thermal head | |
| WO1996011109A1 (en) | Ic for driving printer and print head | |
| JP2562880B2 (en) | Thermal head | |
| JP2746358B2 (en) | Thermal head | |
| JP3340841B2 (en) | Drive IC for thermal print head and thermal print head | |
| KR940008891A (en) | Thermal recording element with multiple common wirings | |
| JPH02286261A (en) | Thermal head | |
| JPH0584946A (en) | Thermal printing head substrate and production thereof | |
| JP2749293B2 (en) | Thermal head wiring connection method and wiring connection structure | |
| JP2878631B2 (en) | Thermal head | |
| JPH0596766A (en) | Wiring pattern of thermal head | |
| JPS60217174A (en) | Thermal printing head | |
| JPS6168259A (en) | Thermal head | |
| JP2005319680A (en) | Manufacturing method for thermal head, thermal head and printing apparatus | |
| JPH03161361A (en) | Thermal head | |
| JPH02128863A (en) | Thermal head array | |
| JPS58138635U (en) | thermal head | |
| JPH06270470A (en) | Optical printing head | |
| JPH0623753U (en) | Thermal head |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080326 Year of fee payment: 16 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090326 Year of fee payment: 17 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090326 Year of fee payment: 17 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100326 Year of fee payment: 18 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100326 Year of fee payment: 18 |