JPH02127091U - - Google Patents
Info
- Publication number
- JPH02127091U JPH02127091U JP3664689U JP3664689U JPH02127091U JP H02127091 U JPH02127091 U JP H02127091U JP 3664689 U JP3664689 U JP 3664689U JP 3664689 U JP3664689 U JP 3664689U JP H02127091 U JPH02127091 U JP H02127091U
- Authority
- JP
- Japan
- Prior art keywords
- heat generating
- generating element
- device casing
- mounting structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 229920002379 silicone rubber Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の側面図、第２図は
従来の発熱素子実装構造の側面図である。 ３…シリコンラバー、４…プリント基板、５…
装置筐体、６…スペーサ、７…取付ねじ、１１…
発熱素子、１２…フイン。
従来の発熱素子実装構造の側面図である。 ３…シリコンラバー、４…プリント基板、５…
装置筐体、６…スペーサ、７…取付ねじ、１１…
発熱素子、１２…フイン。
Claims (1)
- 発熱素子が実装される基板を装置筐体から所定
に間隔を隔て配置する発熱素子実装構造において
、前記発熱素子を前記基板の前記装置筐体側に実
装すると共に、前記発熱素子と前記装置筐体とを
熱的に接続してあることを特徴とする発熱素子実
装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3664689U JPH02127091U (ja) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3664689U JPH02127091U (ja) | 1989-03-30 | 1989-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02127091U true JPH02127091U (ja) | 1990-10-19 |
Family
ID=31543059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3664689U Pending JPH02127091U (ja) | 1989-03-30 | 1989-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02127091U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007188998A (ja) * | 2006-01-12 | 2007-07-26 | Hitachi Communication Technologies Ltd | 電子機器の冷却構造 |
-
1989
- 1989-03-30 JP JP3664689U patent/JPH02127091U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007188998A (ja) * | 2006-01-12 | 2007-07-26 | Hitachi Communication Technologies Ltd | 電子機器の冷却構造 |
| JP4589239B2 (ja) * | 2006-01-12 | 2010-12-01 | 株式会社日立製作所 | 電子機器の冷却構造 |