JPH02127058U - - Google Patents
Info
- Publication number
- JPH02127058U JPH02127058U JP3613989U JP3613989U JPH02127058U JP H02127058 U JPH02127058 U JP H02127058U JP 3613989 U JP3613989 U JP 3613989U JP 3613989 U JP3613989 U JP 3613989U JP H02127058 U JPH02127058 U JP H02127058U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- substrate
- terminal lands
- terminal
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Description
第１図は本考案の一実施例である電子回路装置
２０の端子用ランド周辺部の構造を示す平面図、
第２図は基板２１上に形成される電子回路部分２
５，３１の簡略化した構成を示すブロツク図、第
３図は端子用ランド上に形成されるスルーホール
の構造を示す平面図、第４図は第３図の切断面線
−から見た断面図、第５図は従来からの電子
回路装置の製造工程の一部を示す平面図、第６図
は従来の電子回路装置における電子回路部分５，
６の簡略化した構成を示すブロツク図、第７図は
基板１上に実装される端子用ランド周辺部を示す
平面図である。
２０…電子回路装置、２１…基板、２２ａ，２
２ｂ，Ａ１０〜Ａ４０，Ｂ１０…端子用ランド、
２３…端子、２４…一方表面、２５，３１…電子
回路部分、３０…他方表面、３２…抵抗、３３，
３４…スルーホール、３５…直流電源、３６…電
圧計。
FIG. 1 is a plan view showing the structure of the terminal land periphery of an electronic circuit device 20 which is an embodiment of the present invention;
FIG. 2 shows an electronic circuit portion 2 formed on a substrate 21.
5 and 31, FIG. 3 is a plan view showing the structure of the through hole formed on the terminal land, and FIG. 4 is a cross section taken along the cutting plane line - in FIG. 3. 5 is a plan view showing a part of the manufacturing process of a conventional electronic circuit device, and FIG. 6 is a plan view showing a part of the manufacturing process of a conventional electronic circuit device.
6 is a block diagram showing a simplified configuration of No. 6, and FIG. 7 is a plan view showing the peripheral portion of a terminal land mounted on the substrate 1. 20...Electronic circuit device, 21...Substrate, 22a, 2
2b, A10 to A40, B10...terminal land,
23... Terminal, 24... One surface, 25, 31... Electronic circuit portion, 30... Other surface, 32... Resistor, 33,
34...Through hole, 35...DC power supply, 36...Voltmeter.
Claims (1)
子回路部分をそれぞれ形成し、 それらの電子回路部分に接続される端子用ラン
ドを前記両表面にそれぞれ形成し、 前記基板の少なくとも一方表面に、レーザ光で
除去されてインピーダンスが調整されるべきイン
ピーダンス素子を、その一方表面の電子回路部分
の構成要素として形成し、 前記両表面の端子用ランドは、基板の厚み方向
に貫通するスルーホールによつて接続し、 基板の両表面の端子用ランドに端子群を共通に
半田付けすることを特徴とする電子回路装置。[Claims for Utility Model Registration] Electronic circuit parts that cooperate with each other are formed on both surfaces of a ceramic substrate, terminal lands connected to the electronic circuit parts are formed on both surfaces, and the An impedance element whose impedance is to be adjusted by being removed by a laser beam is formed on at least one surface of the substrate as a component of an electronic circuit portion on the one surface, and terminal lands on both surfaces are arranged in the thickness direction of the substrate. An electronic circuit device characterized in that a group of terminals are commonly soldered to terminal lands on both surfaces of a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3613989U JPH02127058U (en) | 1989-03-28 | 1989-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3613989U JPH02127058U (en) | 1989-03-28 | 1989-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02127058U true JPH02127058U (en) | 1990-10-19 |
Family
ID=31542115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3613989U Pending JPH02127058U (en) | 1989-03-28 | 1989-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02127058U (en) |
-
1989
- 1989-03-28 JP JP3613989U patent/JPH02127058U/ja active Pending
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