JPH02122530A - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法

Info

Publication number
JPH02122530A
JPH02122530A JP63277056A JP27705688A JPH02122530A JP H02122530 A JPH02122530 A JP H02122530A JP 63277056 A JP63277056 A JP 63277056A JP 27705688 A JP27705688 A JP 27705688A JP H02122530 A JPH02122530 A JP H02122530A
Authority
JP
Japan
Prior art keywords
wire
metal ball
bonding
diameter
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63277056A
Other languages
English (en)
Inventor
Hiroshi Takayama
洋 高山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP63277056A priority Critical patent/JPH02122530A/ja
Publication of JPH02122530A publication Critical patent/JPH02122530A/ja
Pending legal-status Critical Current

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、特に半導体ペレットとり−ド間を金属細線に
て接続して内部配線する際に好適なワイヤボンディング
方法に関するものである。
〔従来の技術〕
例えばＩＣ等の半導体装置においてリードフレームのベ
レットマウント部にマウントした半導体ペレットとリー
ドとを電気的に接続するに際してはＡｕ線或いはＡＩｌ
線等の金属細線（以下ワイヤと称す）を半導体ペレット
表面の電極パッドとリードフレームのリードの遊端部と
に順次押付け、この押付けと同時にボンディング面に平
行に超音波振動を加えて接合させるワイヤボンディング
装置が通常使用されている。
上記ワイヤボンディング装置によるワイヤボンディング
工程を第５図乃至第１０図に基づいて説明する。先ず、
第５図に示すように、超音波ホーン（図示せず）の遊端
部に取付けられたキャピラリ　（５）から少し引き出さ
れたワイヤ（４）の先端を水素ガストーチや放電加工等
の加熱手段によって加熱溶融して金属球（４ａ）を形成
する。次に、第６図に示すように、キャピラリ（５）を
第１の被接合部であってペレットマウント部（１）にマ
ウントされた半導体ペレット（２）の電極パッド上に移
動させた後、第７図に示すように、ワイヤ（４）をキャ
ピラリ（５）に引き込みながらキャピラリ　（５）を下
降させ、金属球（４ａ）をキャピラリ　（５）の先端に
よって半導体ペレット（２）の電極パッドに押付け、キ
ャピラリ　（５）から超音波振動を加えて金属球（４ａ
）を半導体ペレット（２）の電極パッドに接合する０次
いで、第８図に示すようにワイヤ（４）をキャピラリ（
５）から引出しながら上昇させ、更にキャピラリ　（５
）を平行移動させて第２の被接合部であるリード（３）
の遊端部上に位置させ、この位置で第９図に示すように
キャピラリ　（５）を下降させてその先端でワイヤ（４
）をリード（３）の遊端部に押付け、キャピラリ　（５
）から超音波振動を加えてワイヤ（４）をリード（３）
に接合する。この後、第１０図に示すように、ワイヤ（
４）をキャピラリ　（５）から引出しながらキャピラリ
　（５）を少しだけ上昇させた後、ワイヤ（４）をキャ
ピラリ　（５）に固定させ、更にキャピラリ　（５）を
上昇させて超音波ボンディングにより弱くなった部分を
引き切る。
以上の動作によって半導体ペレット（２）とリード（３
）とのワイヤ（４）による接続が終了する０次にワイヤ
（４）がその先端から少し引き出されているキャピラリ
　（５）は第５図に示すように加熱手段の位置に移動し
、ここでワイヤ（４）の先端に金属球（４ａ）を形成し
て次のワイヤボンディングに備える。
ここで、第１）図に示すように、半導体ペレット（２）
の表面の電極パッド（６）（６）・・・は、通常、周辺
部に金属球（４ａ）の断面積に略等しい大きさのものが
所定数だけ配設されており、例えば線径が３２μｍのワ
イヤ（４）に対し１００μｍ　の電極パッド（６）が必
要数だけある。
〔促−が解決しようとする課題〕
ところで、上述したワイヤボンディング工程において例
えば高集積度化に伴い電極パッド（６）の数がふえたり
、或いは微細化に伴いペレット表面梼が小さくなった場
合、パッド面積を小さくする必要がある。この時、ワイ
ヤ（４）が元のままであれば、ボンディング後に金属球
（４ａ）が電極パッド（６）から食み出し、隣の電極パ
ッド（６）やワイヤ（４）と短絡することがあるため、
ワイヤ（４）も同時に細くする必要がある。ところが、
ワイヤ径は電流容量等を考慮して設定されているため、
金属球（４ａ）を小さくしようとしてワイヤ（４）を細
（すると、電流容量も変わり、細くできない。そのため
、従来、第１２図に示すように、半導体ペレット（７）
の表面周辺部に元の面積のままの電極バンド（６）（６
）・・・を２列で千鳥足状に配設し、パッド数の増加や
パレット微細化に対応している。ところが、この時、電
極パッド（６）（６）・・・にワイヤ（４）（４）・・
・をボンディングした際、ワイヤ同士の間隔（１）（１
）・・・が狭くなってワイヤ間で短絡が生じるという不
具合があった。
〔課題を解決するための手段〕
本発明は、ボンディングツールがら引き出された金属細
線の先端部に金属球を形成し、その金属球を被ボンディ
ング面に押圧してワイヤボンディングするにあたり、上
記金属細線の先端部のみ縮径して上記金属球を形成し、
ワイヤボンディングする。
〔作用〕
上記技術的手段によれば、ボンディング用ワイヤの先端
部のみ縮径してワイヤ径が太くても、先端部に小さな金
属球を形成する。
〔実施例〕
本発明の実施例を第１図乃至第４図を参照して以下説明
する。まず第１図において（５）は従来と同じボンディ
ング装置におけるボンディングツールとしてのキャピラ
リ、（８）はキャピラリ　（５）のワイヤ挿・通孔（５
ａ）に挿通して下端部より引出されたボンディング用ワ
イヤ、（８ａ）はワイヤ（８）の先端部である。本発明
の特徴は、ボンディング前にワイヤ（８）のボンディン
グに係る先端部（８ａ）においてのみ径を下方に向かっ
て縮径して加熱熔融し、第２図に示すように、先端部（
８ａ）に小さな金属球（８ｂ）を形成するようにしたこ
とである。これにより、半導体ペレット表面の電極パッ
ド数が増加したり、ペレットが微細化してパッド面積が
小さ（なっても、元の太さのワイヤ（８）を用いて元の
電流容量を保持しながら、金属球（８ｂ）を小さくする
。そして、第１）図に示すように、ペレット表面の周辺
部にあって面積の小さくなった電極パッド（６）上に小
さな金属球（８ｂ）をボンディングし、パッドからの食
み出しを防止する。
ここで、上記先端部（８ａ）を縮径するに際しては、例
えば第３図及び第４図に示すように、一対のブレス治具
（９）　　（１０）の各内側面に、その衝合時に内径が
下方に向かって小さくなっていく貫通孔となる溝部（９
ａ）　　（１０ａ　）を形成し、ボンディング前に先端
部（８ａ）を治具（９）（１０）の各内側面で挟持して
プレスすればよい。
〔発明の効果〕
本発明によれば、ワイヤの先端部のみ縮径して金属球を
形成し、被ボンディング面に金属球を押圧してワイヤボ
ンディングするようにしたから、ワイヤ径が太くても小
さな金属球を形成することができ、被ボンディング面が
小さくなっても金属球の食み出しを防止することができ
て、特に半導体ペレットの電極パッド数の増加や、ペレ
ットの微細化に対応できる。
【図面の簡単な説明】
第１図と第２図は本発明に係るワイヤボンディング方法
の一通用例を示すボンディング用ワヤ先端部縮径用プレ
ス治具の側断面図と平断面図、第５図乃至第１０図は従
来のワイヤボンディング方法を示す各工程の側面図、第
１）図と第１２図は従来の半導体ペレット表面の電極バ
ッドの各配設状態を示す各平面図である。 （５）−ボンディングツール、 （８）　−全屈細線、　　　（８ａ）　−先端部、（８
ｂ）　−金属球。

Claims (1)

    【特許請求の範囲】
  1. （１）ボンディングツールから引き出された金属細線の
    先端部に金属球を形成し、その金属球を被ボンディング
    面に押圧してワイヤボンディングするにあたり、 上記金属細線の先端部を縮径して上記金属球を形成し、
    ワイヤボンディングすることを特徴とするワイヤボンデ
    ィング方法。
JP63277056A 1988-10-31 1988-10-31 ワイヤボンディング方法 Pending JPH02122530A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63277056A JPH02122530A (ja) 1988-10-31 1988-10-31 ワイヤボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63277056A JPH02122530A (ja) 1988-10-31 1988-10-31 ワイヤボンディング方法

Publications (1)

Publication Number Publication Date
JPH02122530A true JPH02122530A (ja) 1990-05-10

Family

ID=17578171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63277056A Pending JPH02122530A (ja) 1988-10-31 1988-10-31 ワイヤボンディング方法

Country Status (1)

Country Link
JP (1) JPH02122530A (ja)

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