JPH02120841U - - Google Patents

Info

Publication number
JPH02120841U
JPH02120841U JP3063789U JP3063789U JPH02120841U JP H02120841 U JPH02120841 U JP H02120841U JP 3063789 U JP3063789 U JP 3063789U JP 3063789 U JP3063789 U JP 3063789U JP H02120841 U JPH02120841 U JP H02120841U
Authority
JP
Japan
Prior art keywords
mold
resin
container
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3063789U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0723963Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989030637U priority Critical patent/JPH0723963Y2/ja
Publication of JPH02120841U publication Critical patent/JPH02120841U/ja
Application granted granted Critical
Publication of JPH0723963Y2 publication Critical patent/JPH0723963Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1989030637U 1989-03-16 1989-03-16 混成集積回路の封止容器用金型 Expired - Lifetime JPH0723963Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989030637U JPH0723963Y2 (ja) 1989-03-16 1989-03-16 混成集積回路の封止容器用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989030637U JPH0723963Y2 (ja) 1989-03-16 1989-03-16 混成集積回路の封止容器用金型

Publications (2)

Publication Number Publication Date
JPH02120841U true JPH02120841U (pt) 1990-09-28
JPH0723963Y2 JPH0723963Y2 (ja) 1995-05-31

Family

ID=31255873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989030637U Expired - Lifetime JPH0723963Y2 (ja) 1989-03-16 1989-03-16 混成集積回路の封止容器用金型

Country Status (1)

Country Link
JP (1) JPH0723963Y2 (pt)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224949A (ja) * 1986-03-27 1987-10-02 S M C:Kk Ｉｃパツケ−ジ
JPS63129653A (ja) * 1986-11-20 1988-06-02 Sankyo Kasei Kk 熱可塑性合成樹脂製回路板およびその製法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224949A (ja) * 1986-03-27 1987-10-02 S M C:Kk Ｉｃパツケ−ジ
JPS63129653A (ja) * 1986-11-20 1988-06-02 Sankyo Kasei Kk 熱可塑性合成樹脂製回路板およびその製法

Also Published As

Publication number Publication date
JPH0723963Y2 (ja) 1995-05-31

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