JPH02120841U - - Google Patents

Info

Publication number
JPH02120841U
JPH02120841U JP3063789U JP3063789U JPH02120841U JP H02120841 U JPH02120841 U JP H02120841U JP 3063789 U JP3063789 U JP 3063789U JP 3063789 U JP3063789 U JP 3063789U JP H02120841 U JPH02120841 U JP H02120841U
Authority
JP
Japan
Prior art keywords
mold
resin
container
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3063789U
Other languages
Japanese (ja)
Other versions
JPH0723963Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989030637U priority Critical patent/JPH0723963Y2/en
Publication of JPH02120841U publication Critical patent/JPH02120841U/ja
Application granted granted Critical
Publication of JPH0723963Y2 publication Critical patent/JPH0723963Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例を示す断面図、第２図
は一般的な混成集積回路を示す断面図、第３図は
従来例を示す断面図である。 FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view showing a general hybrid integrated circuit, and FIG. 3 is a sectional view showing a conventional example.

Claims (1)

【実用新案登録請求の範囲】 (1) 第１の金型と第２の金型とで所定の空間が
形成され、前記第１及び第２の金型より形成され
た少なくとも１ケ所以上の樹脂注入口から前記空
間内に樹脂が注入される混成集積回路の封止容器
用金型において、 第２の金型の表面に複数の凸部を設けたことを
特徴とする混成集積回路の封止容器用金型。 (2) 前記樹脂はガラス繊維を含んだ熱可塑性樹
脂を用いることを特徴とする請求項１記載の混成
集積回路の封止容器用金型。[Claims for Utility Model Registration] (1) A predetermined space is formed by a first mold and a second mold, and at least one or more places of resin are formed by the first and second molds. A mold for a sealing container of a hybrid integrated circuit in which resin is injected into the space from an injection port, characterized in that a plurality of convex portions are provided on the surface of the second mold. Container mold. (2) The mold for a sealed container of a hybrid integrated circuit according to claim 1, wherein the resin is a thermoplastic resin containing glass fiber.
JP1989030637U 1989-03-16 1989-03-16 Mold for sealing container of hybrid integrated circuit Expired - Lifetime JPH0723963Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989030637U JPH0723963Y2 (en) 1989-03-16 1989-03-16 Mold for sealing container of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989030637U JPH0723963Y2 (en) 1989-03-16 1989-03-16 Mold for sealing container of hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPH02120841U true JPH02120841U (en) 1990-09-28
JPH0723963Y2 JPH0723963Y2 (en) 1995-05-31

Family

ID=31255873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989030637U Expired - Lifetime JPH0723963Y2 (en) 1989-03-16 1989-03-16 Mold for sealing container of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPH0723963Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224949A (en) * 1986-03-27 1987-10-02 S M C:Kk Ic package
JPS63129653A (en) * 1986-11-20 1988-06-02 Sankyo Kasei Kk Circuit board made of thermoplastic resin and manufacture thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224949A (en) * 1986-03-27 1987-10-02 S M C:Kk Ic package
JPS63129653A (en) * 1986-11-20 1988-06-02 Sankyo Kasei Kk Circuit board made of thermoplastic resin and manufacture thereof

Also Published As

Publication number Publication date
JPH0723963Y2 (en) 1995-05-31

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