JPH02114697A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To improve a hybrid integrated circuit device of this design in the degree of integration by a method wherein the circuit device is provided with such a structure that two circuit substrates are laminated through the intermediary of insulating resin, a film like element is arranged on the joining faces of the substrates with insulating resin respectively, and components are mounted on the surfaces of the substrates opposite to those on which the film like elements are arranged. CONSTITUTION:Two circuit substrates 1 and 2 are bonded together into one piece with an insulating resin layer 4. The insulating resin layer 4 is formed in such manner that thermosetting epoxy resin or the like is applied onto either the first circuit substrate 1 or the second circuit substrate 2 through a screen printing and then heat- bonded with pressure and set. Or, film molding resin of 5-stage may be heat bonded with pressure being sandwiched between the substrates 1 and 2. A film resistor, element 5 and a film condenser element C are formed on the joining faces of the first circuit substrate 1 and the second circuit substrate 3 with the insulating resin layer 4 respectively. And, the faces of the substrates 1 and 2 opposite to those joined to the insulating resin layer 4 are made to serve as component mounting faces, and the component mounting faces and the film-like elements forming faces are electrically connected through through-holes 7.

Description

[Detailed description of the invention] Industrial applications The present invention relates to a hybrid integrated circuit device.

Conventional technology In recent years, as electronic devices have become smaller, lighter, and thinner, active components such as Il:j, ) lunge nut, and passive components such as resistors, capacitors, and coils have been housed in the same package. Hybrid integrated circuit devices are widely used and contribute greatly to the high-density packaging of electronic circuits.

A conventional hybrid integrated circuit device will be described below with reference to the drawings. FIG. 2 shows a cross-sectional view of an example of a conventional hybrid integrated circuit device. In FIG. 2, 13 is an insulating substrate, and generally a ceramic substrate such as 96% alumina is used. Reference numeral 14 denotes a conductor, which may be a thick film conductor formed by Nuclean printing or the like, or a thin film conductor deposited by vapor deposition Nuparitaring or the like. 16 is a film resistance element formed between the conductors on the surface of the insulating substrate, and this film resistance element 16 is formed by either a thick film method or a thin film method, depending on the type and manufacturing method of the conductor 14. Ru. For example, when using a Mug-Pd electrode as a conductor, Ru
Use an O2 resistor. 16 is a membrane capacitor element, and this membrane capacitor element 16 generally has a three-layer structure consisting of a lower conductor on the surface of the insulating substrate 13, a dielectric layer formed on top of the lower conductor, and an upper conductor further formed on top of the lower conductor. Like the resistor, it is formed by either the thick film method or the thin film method. Reference numeral 17 denotes a null hole that electrically connects the front conductor and back conductor of the insulating substrate 13.

Chip components 18. A mini-mold transistor 19, an SO type IO pad, a t-cage 2o, etc. are connected by soldering, and a clip-shaped lead terminal is inserted into the periphery of the insulating board 13 as an external extrusion terminal, and the solder 2
2, the structure is connected to the conductor 14. In addition to mounting components on both sides of the circuit board as described above, film resistance elements are also mounted on both sides of the circuit board.

High-density packaging is achieved by arranging membrane capacitor elements, membrane inductor elements, etc. on both sides of the circuit board. Regarding ICs, bare chips may be directly mounted on a substrate by a wire bonding method, a free/I-button lip method, or the like.

Problems to be Solved by the Invention However, since conventional hybrid integrated circuit devices have components, film resistance elements, and film capacitor elements arranged on both sides of the substrate, they are reaching a limit in terms of improving the degree of integration. Although it is possible to reduce the wiring area by creating fine lines or multilayering the conductor wiring using photolithography or the like, there is a problem in that the wiring becomes significantly high.

On the other hand, with high-density mounting technology in which circuit boards are stacked, insulation from soldering may remain in the gaps between circuit boards, or insulation may deteriorate due to moisture absorption during use. This may lead to a short circuit.

The present invention has been devised in view of the above points, and uses a simple manufacturing process without causing a large amount of complexity, and has a high-density hybrid integrated circuit device that significantly exceeds the degree of integration of conventional double-sided mount type hybrid integrated circuit devices. is intended to provide.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention has a structure in which two circuit boards are laminated with an insulating resin interposed therebetween, and the bonding of the two circuit boards with the insulating resin is provided. A film element is arranged on each surface, and components are mounted on the opposite surface of the two circuit boards to the surface on which the film element is formed.

Function The present invention reduces the board area in terms of projected area by arranging film elements on the bonding surfaces of two laminated circuit boards, instead of arranging them on the front or back surfaces of the circuit boards in conventional hybrid integrated circuit devices. This means that the area for two layers can be effectively used only in the substrate bonding portion. Furthermore, as a result of the film elements being housed in a bonded structure, the entire area of the front and back surfaces of the integrally bonded substrate can be used for mounting components such as chip components and ICs. As described above, two circuit boards are used to create a circuit board that has two layers on the inner layer film element forming surface bonded by insulating resin, and two layers on the front and back surfaces that serve as chip components and mounting surfaces. A hybrid integrated circuit device having a four-layer configuration is provided.

Furthermore, since the gap between the two circuit boards is completely filled with insulating resin, it is possible to prevent flux from entering the gap or moisture from entering the gap, reducing insulation properties and causing short circuits. can.

EXAMPLE Hereinafter, an example of the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view of a hybrid integrated circuit device in one practical example of the present invention.

The first circuit board 1 and the second circuit board 2 are each an inorganic insulating board made of sintered ceramic or the like.
% alumina is used. A conductor 3 having a predetermined wiring pattern is formed on the surface thereof, and these two circuit boards 1 and 2 are joined together by an insulating resin layer 4. The insulating resin layer 4 is formed on the first circuit board 1 by using a thermosetting epoxy resin or the like using a Nuclean printing method. It is obtained by bonding and curing by heat-pressing bonding to either one of the second circuit boards 2. Alternatively, the film-molded resin in the B stage state may be sandwiched between two circuit boards 1.2 and bonded under heat and pressure. Alternatively, an adhesive-coated polyimide film obtained by coating both sides of a polyimide film with an adhesive such as epoxy may be used. Said first circuit board 1. A membrane resistive element 6 and a membrane capacitor element 6 are formed at the junctions of the second circuit board 2 and the insulating resin layer 4, respectively. In addition, the opposite surface of each circuit board 1.2 to the bonding surface with the insulating resin layer 4 is used as a component mounting surface, and the component mounting surface and the membrane element forming surface are connected to each other by the null hole 7. We are communicating with each other. On the component mounting surface of the first circuit board 1, chip components 8 such as a chip capacitor and a chip coil, and a mini mold transistor 9 are mounted by soldering.

Furthermore, a chip component 8 and an IC 10 are similarly mounted on the component mounting surface of the second circuit board 2 by soldering. The above-described mounting components are mounted on each circuit board 1.2 by a reflow method, a solder dipping method, or the like before the two circuit boards 1.2 are joined together. Reference numeral 11 denotes a clip-shaped lead terminal, which is connected to the first circuit board 1. It is inserted so as to sandwich the second circuit board 2, and is connected by solder 12 to a terminal land on the component mounting surface of each circuit board 1.2. Furthermore, chestnut 1. The pull-shaped lead terminal 11 is formed through a predetermined cutting process and forming process after soldering. In addition, exterior resin molding or coating may be applied to improve moisture resistance and automatic mounting performance.

Using this embodiment with the above configuration, a concrete hybrid integrated circuit device was prototyped, and the results of comparison with the conventional example will be described below. Table 1 is a table showing the results of trial manufacturing of a small signal circuit for consumer equipment using this embodiment and a conventional example. When a circuit consisting of a total of 74 built-in components was created using a conventional double-sided mounting board, a board area of 20 lff x 30 I'll was required, resulting in an integration density of 12.3 points/lri.

The board used has a wiring width of 200μm and a wiring spacing of 200μm.
A double-sided mounting board made of a copper thick film ceramic board is used. In contrast to the conventional example, in this example, 38 film resistance elements and 20 film capacitor elements are arranged on the bonding surface with the insulating resin layer, thereby reducing the substrate area by 2.
It can be reduced to 0m x 16m, and the integration density can be reduced to 23.1 points/d. The design rules and substrate material used were the same as the conventional example.

As described above, the hybrid integrated circuit device according to this example uses two circuit boards, and by arranging the membrane resistor element and the membrane capacitor element on the joint surface with the insulating resin layer,
Approximately twice the packaging density can be achieved.

(Left below) Furthermore, two circuit boards are bonded via an insulating resin layer,
Since it is completely integrated, there is no residual moisture left in the gaps between the circuit boards, no moisture absorption, and no seats between terminals.

In this embodiment, component mounting is performed before the circuit board bonding process, but depending on the manufacturing process, it may be performed after the board bonding process.

Further, each first circuit board 1. Although the second circuit board 2 uses a ceramic board with a single layer conductor, it goes without saying that the same effect can be obtained even if a multilayer board with a printing method or a green sheet method is used.

As described in detail, according to the present invention, two circuit boards are bonded via an insulating resin layer, and film elements such as resistors, capacitors, and inductances are arranged on the bonded surface.
An integrated circuit device with a four-layer structure can be created, greatly improving packaging density. Furthermore, since the insulating resin layer is interposed, short circuits between terminals caused by leakage or water intrusion between two circuit boards are also eliminated.

As described above, the present invention can provide a high-density hybrid integrated circuit device through a simple manufacturing process without causing a large amount of noise, and therefore has significant practical effects.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a hybrid integrated circuit device according to an embodiment of the present invention, and FIG. 2 is a sectional view of an example of a conventional hybrid integrated circuit device. DESCRIPTION OF SYMBOLS 1...First circuit board, 2...Second circuit board, 3...Conductor, 4...Insulating resin layer, 6... ...Membrane resistor element, 6...Membrane capacitor element, 7...Null-hole, 8...
...Chip parts, 9...Mini mold transistor, 10...C111...Clean knob-shaped lead terminal, 12...Solder.

Claims (1)

[Claims] It has a structure in which two circuit boards are laminated with an insulating resin interposed therebetween, and a film-like element is arranged on the bonding surface of the two circuit boards with the insulating resin, and A hybrid integrated circuit device in which components are mounted on the opposite side to the surface on which film elements are formed.