JPH02301183A - Manufacture of mounting type circuit component - Google Patents

Manufacture of mounting type circuit component

Info

Publication number
JPH02301183A
JPH02301183A JP1121080A JP12108089A JPH02301183A JP H02301183 A JPH02301183 A JP H02301183A JP 1121080 A JP1121080 A JP 1121080A JP 12108089 A JP12108089 A JP 12108089A JP H02301183 A JPH02301183 A JP H02301183A
Authority
JP
Japan
Prior art keywords
electronic components
area
loaded
mounted
multilayer type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1121080A
Inventor
Megumi Aoyanagi
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1121080A priority Critical patent/JPH02301183A/en
Publication of JPH02301183A publication Critical patent/JPH02301183A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)

Abstract

PURPOSE:To increase the number of electronic components capable of being loaded and mounted so as to enable high density mounting circuit components to be obtained easily by forming a multilayer type printed circuit board with a pattern area, where required electronic components are loaded and mounted, as an inner layer, and loading and mounting other electronic components on the surface of this area insulating them electrically. CONSTITUTION:A multilayer type printed circuit board is formed with an inner layer pattern layer 1a, which has a pattern area where required electronic components are loaded and mounted, as an inner layer together with other inner pattern layer. Next, on the multilayer type printed board, required through hole processing and conductivity treatment by plating of this through hole are performed. The area corresponding to a pattern area where electronic components are loaded and mounted of this multilayer type printed board is cut selectively and is exposed. Required electronic components, for example, chip components 6 such as a capacitor, etc., are loaded and mounted on the exposed area 5. And the area 5 is filled with, for example, epoxy resin 4a, and this is hardened for electric insulation, and then other electronic components, for example, a flat package type semiconductor element (device) 7 is loaded and mounted on the surface of the area 5.
JP1121080A 1989-05-15 1989-05-15 Manufacture of mounting type circuit component Pending JPH02301183A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1121080A JPH02301183A (en) 1989-05-15 1989-05-15 Manufacture of mounting type circuit component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1121080A JPH02301183A (en) 1989-05-15 1989-05-15 Manufacture of mounting type circuit component

Publications (1)

Publication Number Publication Date
JPH02301183A true JPH02301183A (en) 1990-12-13

Family

ID=14802364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1121080A Pending JPH02301183A (en) 1989-05-15 1989-05-15 Manufacture of mounting type circuit component

Country Status (1)

Country Link
JP (1) JPH02301183A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4311266A1 (en) * 1992-04-13 1993-10-14 Mitsubishi Electric Corp Electroless solder plated circuit board mfg. process - avoids copper@ layer attack by solder plating soln.
JPH06120670A (en) * 1991-03-12 1994-04-28 Japan Radio Co Ltd Multilayer wiring board
JPH07254766A (en) * 1994-07-21 1995-10-03 Akai Electric Co Ltd Printed wiring board
EP0774888A3 (en) * 1995-11-16 1998-10-07 Matsushita Electric Industrial Co., Ltd Printing wiring board and assembly of the same
US5875100A (en) * 1996-05-31 1999-02-23 Nec Corporation High-density mounting method and structure for electronic circuit board
US6043987A (en) * 1997-08-25 2000-03-28 Compaq Computer Corporation Printed circuit board having a well structure accommodating one or more capacitor components
DE102006036049A1 (en) * 2006-08-02 2008-02-07 Adc Automotive Distance Control Systems Gmbh Electronic module for radiation sensor-component, has electronic components arranged in recess of printed circuit board as installation components such that electronic component do not project over board surface surrounding recess
DE102008021750A1 (en) * 2008-04-30 2009-11-05 Endress + Hauser Gmbh + Co. Kg Contactlessly identifiable electronic printed circuit board for measuring device, has radio frequency identification transponder inserted into recess, and electronic component comprising connection soldered on contact surface
JP2010004036A (en) * 2008-05-28 2010-01-07 Epcos Ag Apparatus for suspension and contacting of piezoelectric component

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120670A (en) * 1991-03-12 1994-04-28 Japan Radio Co Ltd Multilayer wiring board
DE4311266A1 (en) * 1992-04-13 1993-10-14 Mitsubishi Electric Corp Electroless solder plated circuit board mfg. process - avoids copper@ layer attack by solder plating soln.
JPH07254766A (en) * 1994-07-21 1995-10-03 Akai Electric Co Ltd Printed wiring board
EP0774888A3 (en) * 1995-11-16 1998-10-07 Matsushita Electric Industrial Co., Ltd Printing wiring board and assembly of the same
US6324067B1 (en) 1995-11-16 2001-11-27 Matsushita Electric Industrial Co., Ltd. Printed wiring board and assembly of the same
US5875100A (en) * 1996-05-31 1999-02-23 Nec Corporation High-density mounting method and structure for electronic circuit board
US6043987A (en) * 1997-08-25 2000-03-28 Compaq Computer Corporation Printed circuit board having a well structure accommodating one or more capacitor components
DE102006036049A1 (en) * 2006-08-02 2008-02-07 Adc Automotive Distance Control Systems Gmbh Electronic module for radiation sensor-component, has electronic components arranged in recess of printed circuit board as installation components such that electronic component do not project over board surface surrounding recess
DE102008021750A1 (en) * 2008-04-30 2009-11-05 Endress + Hauser Gmbh + Co. Kg Contactlessly identifiable electronic printed circuit board for measuring device, has radio frequency identification transponder inserted into recess, and electronic component comprising connection soldered on contact surface
JP2010004036A (en) * 2008-05-28 2010-01-07 Epcos Ag Apparatus for suspension and contacting of piezoelectric component

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