JPH02111058A - Lead-forming apparatus of semiconductor element - Google Patents

Lead-forming apparatus of semiconductor element

Info

Publication number
JPH02111058A
JPH02111058A JP26539088A JP26539088A JPH02111058A JP H02111058 A JPH02111058 A JP H02111058A JP 26539088 A JP26539088 A JP 26539088A JP 26539088 A JP26539088 A JP 26539088A JP H02111058 A JPH02111058 A JP H02111058A
Authority
JP
Japan
Prior art keywords
lead
diode
parts
pressure
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26539088A
Other languages
Japanese (ja)
Inventor
Tadayoshi Saito
斉藤　忠義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP26539088A priority Critical patent/JPH02111058A/en
Publication of JPH02111058A publication Critical patent/JPH02111058A/en
Pending legal-status Critical Current

Links

Landscapes

  • Bending Of Plates, Rods, And Pipes (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To adjust a spring-back size after a forming operation by installing a roller part which is turned while a lead is pressed against a side face of a lead-pressure metal mold. CONSTITUTION:Lead-pressure protruding parts 2 installed at the tip of a lead- pressure metal mold 1 are placed on root parts of individual leads 6 of a diode 5; they are pressure-contacted by using lead-chuck pressure parts 3; the individual leads are fixed. After that, while rollers 4 are pressed against taper parts 8 of the lead pressure metal mold, they are turned toward tip parts of the leads 6. The diode 5 whose forming operation has been finished is bonded to a pasteboard 9. During this process, a displacement (l) which is caused after cutting the leads 6 of the diode 5 pasted on the pasteboard 9 can be adjusted by changing an angle (theta) of the taper parts 8. Accordingly, a spring back can be adjusted.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、２端子からなる半導体素子のリードフォーミ
ング装置に関し、特に２端子からなる半導体素子の縦形
リードフォーミングについて台紙から切離した后にリー
ド自身の弾性により生ずる変位（以下、スプリングバッ
ク寸法と記す）に関する。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a lead forming device for a semiconductor device consisting of two terminals, and in particular for vertical lead forming of a semiconductor device consisting of two terminals, the present invention relates to a device for forming a lead on a semiconductor device consisting of two terminals. It relates to the displacement caused by the elasticity of (hereinafter referred to as springback dimension).

〔従来の技術〕[Conventional technology]

従来、この種のり−ドフォーミング装置は、リード押え
金型が、半導体素子のリードの一部を固定する形状とな
っていた。第７図に従来技術を示す。リード押え金型１
７は、半導体素子のリード部の約１／３を固持する。こ
のリード６はローラー４により加圧され、リード先端に
むけて押し曲げられる。Conventionally, in this type of lead forming apparatus, the lead holding mold has a shape that fixes a portion of the lead of the semiconductor element. FIG. 7 shows the prior art. Lead presser mold 1
7 holds about 1/3 of the lead portion of the semiconductor element. This lead 6 is pressurized by the roller 4 and is pushed and bent toward the lead tip.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の半導体素子のリードフォーミング装置は
、リード押え金型が該リードの全面を押え付ける構造と
なっていないためステップバックに対して不充分である
との欠点がある。The conventional lead forming apparatus for semiconductor devices described above has a disadvantage in that the lead presser mold is not structured to press the entire surface of the lead, so that it is insufficient for step-back.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の半導体素子リードフォーミング装置は、２端子
からなる半導体素子のリードを装着する面にテーパーを
有するリード押え金型、半導体素子の各リードを固持す
るリードチャック押え金型、及びリードをリード押え金
型の側面に加圧しながら回転するローラー部とを有して
いる。さらに、このリードの曲げ開始の箇所に位置し、
リード押え金型に対向する様に摺動可能なリード加圧治
具を有するようにすることもできる。The semiconductor element lead forming apparatus of the present invention includes a lead holding mold having a tapered surface on which the lead of a semiconductor element consisting of two terminals is attached, a lead chuck holding mold for holding each lead of the semiconductor element, and a lead holding die for holding the leads. It has a roller part that rotates while applying pressure to the side surface of the mold. Furthermore, it is located at the point where the lead begins to bend.
It is also possible to have a lead pressing jig that is slidable so as to face the lead presser mold.

〔実施例〕〔Example〕

次に、本発明につ、いて図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は、本発明の一実施例に用いたり−Ｆ押え金型１
の縦断面図である。リード押え金型１の側面には角度θ
を付けたテーパ一部を形成している。この角度（θ）を
変えることにより、スプリングバックの調整が可能とな
る。FIG. 1 shows a F presser mold 1 used in an embodiment of the present invention.
FIG. An angle θ is set on the side surface of lead presser mold 1.
It forms a part of the taper. By changing this angle (θ), springback can be adjusted.

第２図は、ＤＨＤ型ダイオード（以下、グイ・オードと
略す）を縦形リードフォーミンダ装置（リード加工部）
に装着した構成図である。リード押え金型１の先端部に
設けられたリード押え凸部２にダイオードの各リードの
付根部をあて、リードチャック押え部３で圧接させるこ
とにより、各リードを固定する。その后、ローラー４を
リード押え金型のテーパ一部８に押し付けながらリード
先端にむけて回転させる。フォーミングを終了したダイ
オードは第５図に示す様に台紙９に接着される。第６図
は、−旦、台紙９に貼付けられたダイオードのリード６
を切断した後に生ずるリード６の変位（１）（ステップ
バック寸法と記す）を示す。スプリングバック寸法はリ
ード押え金型１のテーパ一部８の角度（θ）を変化させ
ることにより調整することが可能である。該角度（θ）
を１０′２０’、３０’の３水準とした際のスプリング
バック寸法との関係を第３図に示す。Figure 2 shows a DHD type diode (hereinafter abbreviated as gui-ode) in a vertical lead forminder device (lead processing section).
FIG. The base of each lead of the diode is placed on a lead presser convex portion 2 provided at the tip of a lead presser mold 1, and the leads are fixed by pressing them with a lead chuck presser 3. After that, the roller 4 is rotated toward the tip of the reed while pressing against the tapered part 8 of the reed presser mold. The diode that has been formed is adhered to the mount 9 as shown in FIG. Figure 6 shows the diode lead 6 attached to the mount 9 on -d.
The displacement (1) of the lead 6 (denoted as step-back dimension) that occurs after cutting is shown. The springback dimension can be adjusted by changing the angle (θ) of the tapered portion 8 of the lead presser mold 1. The angle (θ)
FIG. 3 shows the relationship between the springback dimension and the three levels of 10', 20', and 30'.

第４図は、本発明の他の実施例の縦断面図である。一実
施例にて用いたテーパ一部８を有するリード押え金型１
にダイオードを装着させる。ダイオードの各リード６を
ローラー４により曲げその后、リード６の９０”に曲げ
た近接箇所にリード加圧治具７、押し付はリード６の返
りを防止するものである。FIG. 4 is a longitudinal sectional view of another embodiment of the invention. Lead presser mold 1 having a tapered portion 8 used in one example
Attach a diode to the After each lead 6 of the diode is bent by a roller 4, a lead pressing jig 7 is pressed onto a portion of the lead 6 near the 90'' bend to prevent the lead 6 from curling.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、テーパ一部を有するリー
ド押え金型を用いて２端子からなる半導体素子の縦形リ
ードでは、フォーミング后のスプリングバック寸法の調
整が可能となり、ユーザーの要求するフォーミング規格
を実現できる効果がある。As explained above, the present invention makes it possible to adjust the springback dimension after forming for a vertical lead of a semiconductor device consisting of two terminals by using a lead holding mold having a tapered part, and to meet the forming standards required by the user. It has the effect of realizing

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本発明の一実施例のテーパーを有するリード
押え金型の縦断面図、第２図は一実施例で用いた縦形リ
ードフォーミング装置（リード加工部）にダイオードを
装着した構成図、第３図は、テーパ一部の角度θとスプ
リングバック寸法との相関図、第４図は、本発明の他の
実施例で用いた縦形リードフォーミング装置（リード加
工部）にダイオード装着した構成図、第５図は、縦型リ
ードフォーミング后のダイオードを台紙に装着した構成
図、第６図は、第５図のダイオードを切断した后にリー
ドの変形を示す図、第７図は、従来の縦形リードフォー
ミング装置（リード加工部）の断面図である。 ■・・・・・・リード押え金型、２・・・・・・リード
押え凸部、３・・・・・・リードチャック押え部、４・
・・・・・ローラー５・・・・・・ダイオードの本体部
、６・・・・・・ダイオードのリード、７・・・・・・
リード加圧治具、８・・・・・・テーパー部、９・・・
・・・台紙。Fig. 1 is a vertical cross-sectional view of a tapered lead presser mold according to an embodiment of the present invention, and Fig. 2 is a configuration diagram of a vertical lead forming device (lead processing section) used in an embodiment with a diode installed. , FIG. 3 is a correlation diagram between the angle θ of the taper part and the springback dimension, and FIG. 4 is a configuration in which a diode is installed in a vertical lead forming device (lead processing section) used in another embodiment of the present invention. Fig. 5 is a configuration diagram of a diode mounted on a mount after vertical lead forming, Fig. 6 is a diagram showing deformation of the lead after cutting the diode of Fig. 5, and Fig. 7 is a diagram showing the deformation of the lead after vertical lead forming. FIG. 2 is a sectional view of a vertical lead forming device (lead processing section) of FIG. ■...Lead presser mold, 2...Lead presser convex portion, 3...Lead chuck presser portion, 4.
...Roller 5... Diode body, 6... Diode lead, 7...
Lead pressure jig, 8...Tapered part, 9...
... Mount.

Claims (1)

【特許請求の範囲】[Claims] ２端子からなる半導体素子のリードを装着する面にテー
パーを有するリード押え金型、前記半導体素子の各リー
ドを固持するリードチャック押え金型、及び該リードを
前記リード押え金型の側面に加圧しながら回転するロー
ラー部を有することを特徴とする半導体素子リードフォ
ーミング装置A lead holding mold having a tapered surface on which a lead of a semiconductor element consisting of two terminals is mounted, a lead chuck holding mold that holds each lead of the semiconductor element, and a lead chuck holding mold that presses the leads against a side surface of the lead holding mold. A semiconductor device lead forming device characterized by having a roller part that rotates while
JP26539088A 1988-10-20 1988-10-20 Lead-forming apparatus of semiconductor element Pending JPH02111058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26539088A JPH02111058A (en) 1988-10-20 1988-10-20 Lead-forming apparatus of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26539088A JPH02111058A (en) 1988-10-20 1988-10-20 Lead-forming apparatus of semiconductor element

Publications (1)

Publication Number Publication Date
JPH02111058A true JPH02111058A (en) 1990-04-24

Family

ID=17416513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26539088A Pending JPH02111058A (en) 1988-10-20 1988-10-20 Lead-forming apparatus of semiconductor element

Country Status (1)

Country Link
JP (1) JPH02111058A (en)

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