JPH02110352U - - Google Patents

Info

Publication number
JPH02110352U
JPH02110352U JP1989019129U JP1912989U JPH02110352U JP H02110352 U JPH02110352 U JP H02110352U JP 1989019129 U JP1989019129 U JP 1989019129U JP 1912989 U JP1912989 U JP 1912989U JP H02110352 U JPH02110352 U JP H02110352U
Authority
JP
Japan
Prior art keywords
signal processing
processing section
integrated circuit
grounded
digital signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989019129U
Other languages
English (en)
Other versions
JPH0810209Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989019129U priority Critical patent/JPH0810209Y2/ja
Priority to KR1019900000311A priority patent/KR0150206B1/ko
Priority to GB9003510A priority patent/GB2228381B/en
Priority to US07/482,085 priority patent/US5023615A/en
Priority to DE4005489A priority patent/DE4005489C2/de
Publication of JPH02110352U publication Critical patent/JPH02110352U/ja
Application granted granted Critical
Publication of JPH0810209Y2 publication Critical patent/JPH0810209Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図、第２図及び第３図は夫々本考案の一実
施例を示す構成図である。 １０はＬＳＩ、１１はデイジタル信号処理部、
１２はアナログ信号処理部、１３は分離用接地電
極、１４及び１５は接地電極である。

Claims (1)

  1. 【実用新案登録請求の範囲】 デイジタル信号処理部とアナログ信号処理部と
    を１チツプ内に内蔵する集積回路において、 基板電位を接地電位とし、上記デイジタル信号
    処理部と上記アナログ信号処理部とを独立に接地
    すると共に、上記両信号処理部の境界部を上記各
    信号処理部とは別に接地するようにしたことを特
    徴とする集積回路。
JP1989019129U 1989-02-21 1989-02-21 集積回路 Expired - Lifetime JPH0810209Y2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1989019129U JPH0810209Y2 (ja) 1989-02-21 1989-02-21 集積回路
KR1019900000311A KR0150206B1 (ko) 1989-02-21 1990-01-12 디지탈/아날로그 변환기
GB9003510A GB2228381B (en) 1989-02-21 1990-02-15 Digital-to-analog converters
US07/482,085 US5023615A (en) 1989-02-21 1990-02-20 Large scale integrated circuit for converting pulse code modulated data to an analog signal
DE4005489A DE4005489C2 (de) 1989-02-21 1990-02-21 Schaltungsanordnung für einen Digital/Analog-Wandler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989019129U JPH0810209Y2 (ja) 1989-02-21 1989-02-21 集積回路

Publications (2)

Publication Number Publication Date
JPH02110352U true JPH02110352U (ja) 1990-09-04
JPH0810209Y2 JPH0810209Y2 (ja) 1996-03-27

Family

ID=11990855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989019129U Expired - Lifetime JPH0810209Y2 (ja) 1989-02-21 1989-02-21 集積回路

Country Status (1)

Country Link
JP (1) JPH0810209Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04251970A (ja) * 1991-01-09 1992-09-08 Toshiba Corp アナログ・デジタル混載半導体集積回路装置
US6219909B1 (en) 1990-11-28 2001-04-24 Hitachi, Ltd. Method of mounting disk drive apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167361A (en) * 1980-05-26 1981-12-23 Mitsubishi Electric Corp Semiconductor integrated circuit device
JPS5870565A (ja) * 1981-10-23 1983-04-27 Hitachi Ltd 集積回路の電源供給回路
JPS5984542A (ja) * 1982-11-08 1984-05-16 Nec Corp 高周波半導体集積回路
JPS59193046A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd 半導体集積回路装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167361A (en) * 1980-05-26 1981-12-23 Mitsubishi Electric Corp Semiconductor integrated circuit device
JPS5870565A (ja) * 1981-10-23 1983-04-27 Hitachi Ltd 集積回路の電源供給回路
JPS5984542A (ja) * 1982-11-08 1984-05-16 Nec Corp 高周波半導体集積回路
JPS59193046A (ja) * 1983-04-15 1984-11-01 Hitachi Ltd 半導体集積回路装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6219909B1 (en) 1990-11-28 2001-04-24 Hitachi, Ltd. Method of mounting disk drive apparatus
US6856482B2 (en) 1990-11-28 2005-02-15 Hitachi, Ltd. Disk drive apparatus and method of mounting same
US7227712B2 (en) 1990-11-28 2007-06-05 Hitachi Global Storage Technologies Japan, Ltd. Disk drive apparatus and method of mounting same
JPH04251970A (ja) * 1991-01-09 1992-09-08 Toshiba Corp アナログ・デジタル混載半導体集積回路装置

Also Published As

Publication number Publication date
JPH0810209Y2 (ja) 1996-03-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term