JPH02110349U - - Google Patents
Info
- Publication number
- JPH02110349U JPH02110349U JP1989019464U JP1946489U JPH02110349U JP H02110349 U JPH02110349 U JP H02110349U JP 1989019464 U JP1989019464 U JP 1989019464U JP 1946489 U JP1946489 U JP 1946489U JP H02110349 U JPH02110349 U JP H02110349U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- connection
- bump electrodes
- connection means
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989019464U JPH02110349U (enExample) | 1989-02-21 | 1989-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989019464U JPH02110349U (enExample) | 1989-02-21 | 1989-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110349U true JPH02110349U (enExample) | 1990-09-04 |
Family
ID=31235000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989019464U Pending JPH02110349U (enExample) | 1989-02-21 | 1989-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110349U (enExample) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5339068A (en) * | 1976-09-22 | 1978-04-10 | Hitachi Ltd | Semiconductor device |
| JPS5866347A (ja) * | 1981-10-16 | 1983-04-20 | Nec Corp | 複合半導体ペレツト |
| JPS58154254A (ja) * | 1982-03-10 | 1983-09-13 | Hitachi Ltd | 半導体装置 |
| JPS5929036B2 (ja) * | 1973-06-29 | 1984-07-17 | 株式会社日立製作所 | 半導体通話路スイツチ |
| JPS60150660A (ja) * | 1984-01-17 | 1985-08-08 | Mitsubishi Electric Corp | 半導体装置 |
-
1989
- 1989-02-21 JP JP1989019464U patent/JPH02110349U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5929036B2 (ja) * | 1973-06-29 | 1984-07-17 | 株式会社日立製作所 | 半導体通話路スイツチ |
| JPS5339068A (en) * | 1976-09-22 | 1978-04-10 | Hitachi Ltd | Semiconductor device |
| JPS5866347A (ja) * | 1981-10-16 | 1983-04-20 | Nec Corp | 複合半導体ペレツト |
| JPS58154254A (ja) * | 1982-03-10 | 1983-09-13 | Hitachi Ltd | 半導体装置 |
| JPS60150660A (ja) * | 1984-01-17 | 1985-08-08 | Mitsubishi Electric Corp | 半導体装置 |