JPH02108570U - - Google Patents
Info
- Publication number
- JPH02108570U JPH02108570U JP1989015005U JP1500589U JPH02108570U JP H02108570 U JPH02108570 U JP H02108570U JP 1989015005 U JP1989015005 U JP 1989015005U JP 1500589 U JP1500589 U JP 1500589U JP H02108570 U JPH02108570 U JP H02108570U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder wire
- wire
- cylindrical body
- feeding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000005476 soldering Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015005U JPH02108570U (cs) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015005U JPH02108570U (cs) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02108570U true JPH02108570U (cs) | 1990-08-29 |
Family
ID=31226683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989015005U Pending JPH02108570U (cs) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02108570U (cs) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0736474U (ja) * | 1993-12-20 | 1995-07-04 | 上田日本無線株式会社 | レーザビームを利用した半田付け装置 |
| JP2007067168A (ja) * | 2005-08-31 | 2007-03-15 | Fujifilm Corp | レーザはんだ付け方法及びレーザはんだ付け装置 |
| JP2011029659A (ja) * | 2010-09-30 | 2011-02-10 | Denso Corp | レーザはんだ付け方法 |
| JP2020192586A (ja) * | 2019-05-29 | 2020-12-03 | ファナック株式会社 | レーザー光にて半田付けを行う半田付け装置および半田付け装置を備えるロボット装置 |
-
1989
- 1989-02-10 JP JP1989015005U patent/JPH02108570U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0736474U (ja) * | 1993-12-20 | 1995-07-04 | 上田日本無線株式会社 | レーザビームを利用した半田付け装置 |
| JP2007067168A (ja) * | 2005-08-31 | 2007-03-15 | Fujifilm Corp | レーザはんだ付け方法及びレーザはんだ付け装置 |
| JP2011029659A (ja) * | 2010-09-30 | 2011-02-10 | Denso Corp | レーザはんだ付け方法 |
| JP2020192586A (ja) * | 2019-05-29 | 2020-12-03 | ファナック株式会社 | レーザー光にて半田付けを行う半田付け装置および半田付け装置を備えるロボット装置 |