JPH02107732A - High strength and high conductivity copper base alloy - Google Patents

High strength and high conductivity copper base alloy

Info

Publication number
JPH02107732A
JPH02107732A JP26123688A JP26123688A JPH02107732A JP H02107732 A JPH02107732 A JP H02107732A JP 26123688 A JP26123688 A JP 26123688A JP 26123688 A JP26123688 A JP 26123688A JP H02107732 A JPH02107732 A JP H02107732A
Authority
JP
Japan
Prior art keywords
alloy
strength
copper
based alloy
electrical conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26123688A
Other languages
Japanese (ja)
Other versions
JPH0778266B2 (en
Inventor
Toshihiro Kanzaki
神崎 敏裕
Akira Sugawara
章 菅原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP63261236A priority Critical patent/JPH0778266B2/en
Publication of JPH02107732A publication Critical patent/JPH02107732A/en
Publication of JPH0778266B2 publication Critical patent/JPH0778266B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To improve the strength, elasticity, electrical conductivity, heat resistance or the like of the title alloy by specifying Ni, Be, Zn, Ti, Cr, Zr, Fe, etc. CONSTITUTION:The title copper base alloy is formed with the compsn. constituted of, by weight, 0.05 to 5% Ni, 0.005 to 1.5% Be, 0.01 to 5% Zn and the balance Cu, or in addition to this, furthermore of 0.005 to 2% of one or more kinds among Ti, Cr, Zr, Fe, Co, Sn, Pb, Al, Bi and P. The above alloy has high strength, high elasticity and high electrical conductivity and has excellent stress relaxation characteristics and heat resistance. The alloy furthermore has sufficient solder weather ability.

Description

【発明の詳細な説明】 (イ)技術分野 本発明は、自動車部品の電装品等に用いられるワイヤー
ハーネスのターミナルに代表される電気・電子材料用と
して好適な高強度・高導電性銅基合金に関するものであ
る。
Detailed Description of the Invention (a) Technical field The present invention relates to a high-strength, high-conductivity copper-based alloy suitable for electrical and electronic materials such as wire harness terminals used in electrical components of automobile parts, etc. It is related to.

(ロ)従来技術 今日、自動車産業は周知の通り日本の基幹産業として大
きな役割を果すに至っており、その生産台数の増加は著
しく、また近時ではカーエレクトロニクスの発達により
、これに使用される伸銅品材料がますます増加している
(b) Prior art Today, as is well known, the automobile industry has come to play a major role as Japan's core industry, and the number of automobiles produced has increased significantly, and with the recent development of car electronics, Copper materials are becoming more and more popular.

従って、自動車の電装品の一翼を担うワイヤーハーネス
もこれにもれず、1台当り約I Kmの長さ9重量で約
20Kgが使用されるまでになった。
Therefore, wire harnesses, which play a role in the electrical equipment of automobiles, are no exception, and each vehicle now uses wire harnesses that are about 1 km long, 9 weight, and about 20 kg.

しかしながら、近時の自動車に対する要求は軽量化、高
信頼性および低コスト化とますます厳しいものになり、
従ってワイヤーハーネスも軽量化、高信頼性および低コ
スト化が要求されるようになって来ている。
However, the demands placed on cars these days are becoming increasingly strict, such as weight reduction, high reliability, and low cost.
Accordingly, wire harnesses are also required to be lighter in weight, more reliable, and lower in cost.

ここで、ワイヤーハーネスは電線とターミナルが一体と
なったものであり、軽量化と配線の高密度化のためには
、ターミナル材料の材料特性および信頼性の向上が必要
かつ不可欠である。
Here, a wire harness is a combination of electric wires and terminals, and in order to reduce weight and increase wiring density, it is necessary and essential to improve the material properties and reliability of the terminal material.

上記のような背景の下に、具体的にターミナル材料は薄
肉化され、また複雑な形状にプレス成形されることから
、強度9弾性、導電性およびプレス成形性が良好なこと
が必要である。
Under the above background, the terminal material is specifically made thinner and press-molded into a complicated shape, so it is necessary to have good strength, elasticity, conductivity, and press-formability.

更に、耐食性、#応力腐食割れ性が良いことは勿論のこ
とで、エンジンルーム■辺や排ガス系統周辺では熱的な
負荷も加わることから、#応力緩和特性シこも優れてい
なければならない。
Furthermore, in addition to having good corrosion resistance and stress corrosion cracking resistance, it must also have excellent stress relaxation properties since thermal loads are applied around the engine room and exhaust gas system.

しか[7ながら、従来において上記のような諸特性を同
時に兼備し、かつ安価な材料は得られなかった。
However, in the past, it has not been possible to obtain a material that simultaneously has the above-mentioned properties and is inexpensive.

(ハ)発明の開示 本発明は、カーエレクトロニクスの発達に伴なって、ワ
イヤーハーネスのターミナル材料に要求される上記のよ
うな諸特性を兼備した銅基合金1 さらに詳しくは強度
1弾性および電気伝導性に優れ、かつプレス成形性、#
応力緩和特性等に優れたワイヤーハーネスのターミナル
用材料として好適な銅基合金を開発すべく鋭意研究の結
果、開発されたものであって、次記の銅基合金を提供す
るものである。
(C) Disclosure of the Invention With the development of car electronics, the present invention provides a copper-based alloy 1 which has the above-mentioned properties required for a terminal material for a wire harness. Excellent properties and press formability, #
The following copper-based alloy was developed as a result of intensive research to develop a copper-based alloy suitable as a wire harness terminal material with excellent stress relaxation properties.

即ち、まず第1の発明は、N i : 0.05〜5.
0賛七%、 B e : 0.005〜1.5 wt%
、Z n : 0.01〜5.0wt%、残部がCuお
よび不可避不純物からなる高強度高導電性銅基合金であ
る。
That is, in the first invention, Ni: 0.05 to 5.
0 support 7%, B e: 0.005-1.5 wt%
, Zn: 0.01 to 5.0 wt%, the balance being Cu and unavoidable impurities.

また、第2の発明は、N i : 0.05〜5.0w
t%、B e : 0.005〜1.5 wt%、Z 
n : 0.01〜5.0wt%を含み、更に、Ti、
Cr、Zr、Fe、Co。
Moreover, the second invention provides Ni: 0.05 to 5.0w.
t%, B e : 0.005 to 1.5 wt%, Z
n: 0.01 to 5.0 wt%, further containing Ti,
Cr, Zr, Fe, Co.

Sn、Pb、A文、Bi 、Pから成る群より選ばれた
1種又は2種以上を合計で0.005〜2.0wt%含
み、残部がCuおよび不可避不純物からなることを特徴
とする高強度高導電性鋼基合金である。
A high-quality aluminum alloy containing a total of 0.005 to 2.0 wt% of one or more selected from the group consisting of Sn, Pb, A, Bi, and P, with the balance consisting of Cu and unavoidable impurities. It is a steel-based alloy with high strength and high conductivity.

本発明に係る銅基合金は、Ni、Be、Znの適漬の添
加により、ワイヤーハーネスのターミナル用材料として
好適な銅基合金に必要なL記諸特性を発現せしめた点に
基本的な特徴がある。
The basic feature of the copper-based alloy according to the present invention is that through the addition of Ni, Be, and Zn, the copper-based alloy exhibits the characteristics listed in L that are necessary for a copper-based alloy suitable as a terminal material for wire harnesses. There is.

次に、本発明に係る銅基合金の成分組成範囲を上記の通
りに限定した理由について説明する。
Next, the reason why the composition range of the copper-based alloy according to the present invention is limited as described above will be explained.

(1)Ni Niは、Beと化合物を形成し、強度1弾性耐熱性およ
び耐応力緩和特性等の向」二に寄与する元2Vである。
(1) Ni Ni is an element 2V that forms a compound with Be and contributes to properties such as strength, elasticity, heat resistance, and stress relaxation resistance.

また、鋳造M1織および熱間加工組織を微細化し、かつ
溶体化処理時の結晶粒の粗大化を防IFする効果がある
Further, it has the effect of refining the cast M1 weave and hot worked structure and preventing coarsening of crystal grains during solution treatment.

このような効果を発揮させるためには、Ni含有値が0
.05wt%未満では所望の効果が得られず、一方5.
0wt%を越えて含有させると電気伝導性の低下が顕著
となり、また経済的にも不利となることから、その含有
量は0.05wt%〜5.0wt%の範囲とする。
In order to exhibit such an effect, the Ni content value must be 0.
.. If it is less than 0.05 wt%, the desired effect cannot be obtained;
If the content exceeds 0 wt%, the electrical conductivity will drop significantly and it will also be economically disadvantageous, so the content should be in the range of 0.05 wt% to 5.0 wt%.

(2)Be Beは、その含有量が0.005 vt%未満ではNi
との共存下でも強度1弾性、耐熱性および耐応力緩和特
性等について所望の効果が得られず、一方Be含右量が
1.5 wt%を越えると電気伝導性が低下すると共に
、プレス成形性が著しく低下し、また経済的にも不利と
なることから、その含有量は0.005〜1.5 wt
%の範囲とする。
(2) Be Be is less than Ni when its content is less than 0.005 vt%.
Even when the Be content coexists with Be, the desired effects cannot be obtained in terms of strength, elasticity, heat resistance, stress relaxation resistance, etc. On the other hand, when the Be content exceeds 1.5 wt%, electrical conductivity decreases and press forming The content is 0.005 to 1.5 wt because it significantly reduces the properties and is also economically disadvantageous.
% range.

(3)Zn Znは、Cuマトリックス中に固溶して加工性及び電気
伝導性を大きく損なうことなしに強度及び弾性を向ヒさ
せる。また、熱処理時の溶着を効果的に防1卜する元素
であり、更に溶解、鋳造時には脱酸剤として機能し、熱
間圧延や熱処理後の酸洗時の酸化膜除去についても効果
的に作用する。
(3) Zn Zn forms a solid solution in the Cu matrix and improves strength and elasticity without significantly impairing workability and electrical conductivity. It is also an element that effectively prevents welding during heat treatment, and also functions as a deoxidizing agent during melting and casting, and is also effective in removing oxide films during hot rolling and pickling after heat treatment. do.

加えて、本発明に係る銅基合金の半田メツキの耐候性に
も効果がある。また、ワイヤーハーネスのターミナル材
料は塩水に暴露される可能性が大きく、このようなとき
はターミナル材料である銅合金からCuイオンが溶出し
、回路の短絡を起こす欠点があるが、Znを含有するこ
とによってCuイオンの溶出を効果的に抑制する。従っ
て、短絡現象も抑制される。
In addition, the weather resistance of the copper-based alloy solder plating according to the present invention is also effective. In addition, there is a high possibility that the terminal material of the wire harness will be exposed to salt water, and in such a case, Cu ions will be eluted from the copper alloy that is the terminal material, causing a short circuit. This effectively suppresses the elution of Cu ions. Therefore, the short circuit phenomenon is also suppressed.

このような効果を発揮させるためには、0.01wt%
以七の含有量が必要であるが、一方5.Q wt%を越
えて含有すると、電気伝導性の低下が顕著となり、また
耐応力腐食割れ性が低下する。
In order to exhibit such an effect, 0.01wt%
The following content is required, but on the other hand, 5. If the content exceeds Q wt%, the electrical conductivity will be significantly lowered and the stress corrosion cracking resistance will also be lowered.

従って、Znの含有酸は0.O1〜5.0wt%の範囲
とする。
Therefore, the acid content of Zn is 0. O is set in the range of 1 to 5.0 wt%.

(り副成分 更に、副成分としてTi、Cr、Zr、Fe。(Subcomponent Furthermore, Ti, Cr, Zr, and Fe are added as subcomponents.

Co 、 S n 、 P b 、 A l 、B i
 * Pからなる群より選ばれた1種又は2種以上をN
i、Be、Znを含有する第1の発明の銅基合金に含有
させることにより、第1発明の合金の加工性及び電気伝
導性を大きく損なうことなしに、第1発明の銅基合金の
強度9弾性、#熱性及び耐応力緩和特性等の開時性をよ
り一層向上させることができる。また上記の副成分は、
鋳造、熱間圧延、熱処理時の結晶の微細化にも寄与する
ものである。
Co, Sn, Pb, Al, Bi
*N is one or more types selected from the group consisting of P.
By incorporating i, Be, and Zn into the copper-based alloy of the first invention, the strength of the copper-based alloy of the first invention can be improved without significantly impairing the workability and electrical conductivity of the alloy of the first invention. 9. The opening properties such as elasticity, thermal properties, and stress relaxation properties can be further improved. In addition, the above subcomponents are
It also contributes to the refinement of crystals during casting, hot rolling, and heat treatment.

このような効果を充分に発揮させるためには、L記副成
分から選ばれた1種又は2種以上を合計で0.005 
wt%以上を含有させる必要があり、一方2、0wt%
を越えて含有すると、加工性及び電気伝導性の低下が顕
著となり、鋳造時の湯流れ性の低下や、熱処理時に強固
な酸化被膜を生成するなど、製造上の問題も生じ、経済
的にも不利となる。
In order to fully exhibit such effects, one or more selected from the subcomponents listed in L must be added in a total of 0.005%.
It is necessary to contain 2.0 wt% or more, while 2.0 wt%
If it is contained in excess of It will be disadvantageous.

従って、上記副成分の含有量の範囲は、1種或は2種以
上を合計で0.005〜2.0wt%とする。
Therefore, the range of content of the above-mentioned subcomponents is 0.005 to 2.0 wt% in total of one or more kinds.

次に1本発明を実施例により具体的に説明する。Next, one embodiment of the present invention will be specifically explained using examples.

(ニ)実施例 実施例1 第1表に化学成分値(重量%)を示す銅基合金No、 
1−No、 14を高周波誘導溶解炉を用いて溶製し、
20 X 50 X 220 (am)の鋳塊に鋳造し
た。
(D) Examples Example 1 Copper-based alloy No. whose chemical composition values (wt%) are shown in Table 1,
1-No. 14 was melted using a high frequency induction melting furnace,
It was cast into an ingot measuring 20 x 50 x 220 (am).

ただし、溶解鋳造時の雰囲気はArガスシールとし、鋳
造後直ちに水冷した。各鋳塊を面削後。
However, the atmosphere during melting and casting was set to an Ar gas seal, and water cooling was performed immediately after casting. After facing each ingot.

冷間圧延と焼鈍を繰返し、厚さ0.8 amまで冷間圧
延した。
Cold rolling and annealing were repeated until the thickness was 0.8 am.

その後、815℃の温度で10分間熱処理後、水急冷を
行ない、さらに酸洗を施した。
Thereafter, after heat treatment at a temperature of 815° C. for 10 minutes, quenching with water was performed, and further acid washing was performed.

上記のようにして得られた熱処理材を厚さ0.3mlま
で冷間圧延し、500℃の温度で30分間の熱処理を施
し、試験材とした。
The heat-treated material obtained as described above was cold-rolled to a thickness of 0.3 ml, and heat-treated at a temperature of 500° C. for 30 minutes to obtain a test material.

得られた試験材を用いて、各所定の試験片を作成し、引
張強さ、導電率およびハンダ#候性を測定した。その結
果を第1表に示す。
Each predetermined test piece was prepared using the obtained test material, and the tensile strength, electrical conductivity, and solder resistance were measured. The results are shown in Table 1.

測定法としては、引張強さ、導電率の測定はJ l5−
Z−2241、JIS−H−0505+、:従って行な
った。
As for the measurement method, tensile strength and conductivity are measured using J15-
Z-2241, JIS-H-0505+: Accordingly.

また、ハンダ耐候性は試験片に溶融ハンダメツキ(Sn
−40wt%Pb、デ4−/プ、260℃×5sec、
弱活性ロジンフラックス使用)を行ない、150℃の温
度で300時間大気中に保持後、試験片を90°W曲げ
し、曲げ部の観察を行なった。′M1察の結果、メツキ
が密着しているものは○印、剥離しているものはX印と
して、第1表に示した。
In addition, the solder weather resistance was determined by applying molten solder plating (Sn) to the test piece.
-40wt%Pb, De4-/P, 260°C x 5sec,
After holding in the atmosphere at a temperature of 150° C. for 300 hours, the test piece was bent by 90° W and the bent portion was observed. 'The results of M1 inspection are shown in Table 1 with the marks ○ indicating that the plating is adhered, and the marks X indicating that the plating has peeled off.

第1表に示した結果から、本発明に係るNo、  1〜
9の銅基合金は、引張強さ、導電率のバランスに優れ、
かつハンダ耐候性も良好である。従って、ワイヤーハー
ネスのターミナル等の電気電子用材料として好適な非常
に優れた特性を有する銅基合金である。
From the results shown in Table 1, No. 1 to 1 according to the present invention
The copper-based alloy No. 9 has an excellent balance of tensile strength and electrical conductivity,
It also has good solder weather resistance. Therefore, it is a copper-based alloy that has very excellent properties and is suitable as an electrical and electronic material such as a terminal for a wire harness.

これに対して、Znを含まない比較合金No、  10
および本発明の成分組成範囲よりNi贋の多い比較合金
No、14ではハンダ耐候性が劣化している。
On the other hand, comparative alloy No. 10 that does not contain Zn
Comparative alloy No. 14, which contains more Ni than the composition range of the present invention, has poor solder weather resistance.

また、本発明の成分績rs、1iii囲よりZn量が多
い比較合金No、13やNiiが多いNo、14テは導
電率が低く、引張強さの向上も認められない。
Comparative alloys No. 13 and No. 14 Te, which have a larger amount of Zn than the compositions rs and 1iii of the present invention, and No. 14 te, which have a larger amount of Nii, have low electrical conductivity and no improvement in tensile strength is observed.

更に、Niを含まない比較合金No、12では引張強度
が本発明合金に比して低く、Beを含まない比較合金N
o、11は、引張強さ、導TL率共に低い。
Furthermore, the tensile strength of comparative alloys No. 12, which does not contain Ni, is lower than that of the alloy of the present invention;
o, 11 has low tensile strength and TL ratio.

(以下余白) 実施例2 実施例1の第1表中に示す本発明合金No、  1と市
販のリン青銅2種(C5191−H)について、硬度、
引張強さ、ばね限界値、導電率、耐応力緩和特性及び耐
熱性を試験測定した。その結果を第2表に示す。
(The following is a blank space) Example 2 The hardness,
Tensile strength, spring limit value, electrical conductivity, stress relaxation properties, and heat resistance were tested and measured. The results are shown in Table 2.

引張強さ、導電率の測定試験は実施例1と同様の測定法
であり、硬度およびばね限界値の測定はそれぞれJ l
5−Z−2244およびJIS−H3130に従って行
なった。
The measurement tests for tensile strength and electrical conductivity were the same as in Example 1, and the hardness and spring limit values were measured using J l
5-Z-2244 and JIS-H3130.

また、応力緩和試験は試験片の中央部の応力が40Kg
f/mmzになるようにU字曲げを行ない150℃の温
度で200時間保持後の曲げぐせを応力緩和率として、
次式により算出した。
In addition, in the stress relaxation test, the stress at the center of the test piece was 40 kg.
U-shaped bending is performed so that f/mmz is obtained, and the bending after holding at a temperature of 150°C for 200 hours is taken as the stress relaxation rate.
Calculated using the following formula.

応力緩和率(X)= [(LI   L2 ) /(LI  LO)IXlo
oLo :治具の長さ(■腸) Ll :開始時の試料長さ(II+1)Lz :処理後
の試料端間の水平距離(mm)更に耐熱性試験は、試料
の硬度が初期硬度の8O%になるときの温度(30分間
保持)とした。
Stress relaxation rate (X) = [(LI L2 ) / (LI LO) IXlo
oLo: Length of jig (■intestinal) Ll: Sample length at start (II+1) Lz: Horizontal distance between sample ends after processing (mm) Furthermore, in the heat resistance test, the hardness of the sample is 8O of the initial hardness. % (held for 30 minutes).

(以下余白) 第2表に示す結果から、本発明の銅基合金は。(Margin below) From the results shown in Table 2, the copper-based alloy of the present invention.

従来の代表的なワイヤーハーネスのターミナル等の電気
電子用材料であるリン青銅に比較して、導電率、耐応力
緩和特性ならびに耐熱性が格段に向ヒしていることが分
る。従って、本発明銅基合金は高度な耐環境性を有し、
信頼性に極めて優れていることが明らかである。
It can be seen that the conductivity, stress relaxation properties, and heat resistance are significantly improved compared to phosphor bronze, which is a typical conventional electrical and electronic material such as wire harness terminals. Therefore, the copper-based alloy of the present invention has high environmental resistance,
It is clear that the reliability is extremely high.

(ホ)発明の効果 以ヒの実施例から明らかなように、本発明に係る銅基合
金は、高強度、高弾性、高電気伝導性を有12、かつ耐
応力緩和特性および耐熱性に優れており、更に充分なハ
ンダ耐候性を有しているので、ワイヤーハーネスのター
ミナル等の電気電子用材料として最適なものである。
(E) Effects of the Invention As is clear from the following Examples, the copper-based alloy according to the present invention has high strength, high elasticity, and high electrical conductivity12, and has excellent stress relaxation resistance and heat resistance. Furthermore, it has sufficient solder weather resistance, making it ideal as a material for electrical and electronic applications such as wire harness terminals.

しかも、本発明合金は、近年の自動車用電装品の小型軽
量化と配線の高c&′度化に充分対応できるターミナル
用として好適な画期的な銅基合金である。
Moreover, the alloy of the present invention is an epoch-making copper-based alloy suitable for terminals, which can fully respond to the recent trend toward smaller and lighter automotive electrical components and higher c&' temperature wiring.

Claims (2)

【特許請求の範囲】[Claims] (1)Ni:0.05〜5.0wt%、 Be:0.005〜1.5wt%、 Zn:0.01〜5.0wt%、 残部:Cuおよび不可避不純物, からなることを特徴とする高強度高導電性銅基合金。(1) Ni: 0.05 to 5.0 wt%, Be: 0.005-1.5wt%, Zn: 0.01-5.0wt%, Remainder: Cu and inevitable impurities, A high-strength, high-conductivity copper-based alloy characterized by comprising: (2)Ni:0.05〜5.0wt%、 Be:0.005〜1.5wt%、 Zn:0.01〜5.0wt%、 を含み、更にTi,Cr,Zr,Fe,Co,Sn,P
b,Al,Bi,Pから成る群より選ばれた1種又は2
種以上を合計で0.005〜2.0wt%含み、残部が
Cuおよび不可避不純物からなることを特徴とする高強
度高導電性銅基合金。
(2) Contains Ni: 0.05 to 5.0 wt%, Be: 0.005 to 1.5 wt%, Zn: 0.01 to 5.0 wt%, and further contains Ti, Cr, Zr, Fe, Co, Sn,P
One or two selected from the group consisting of b, Al, Bi, and P
1. A high-strength, high-conductivity copper-based alloy comprising a total of 0.005 to 2.0 wt% of at least one species, with the remainder consisting of Cu and unavoidable impurities.
JP63261236A 1988-10-17 1988-10-17 High strength and high conductivity copper base alloy Expired - Lifetime JPH0778266B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63261236A JPH0778266B2 (en) 1988-10-17 1988-10-17 High strength and high conductivity copper base alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63261236A JPH0778266B2 (en) 1988-10-17 1988-10-17 High strength and high conductivity copper base alloy

Publications (2)

Publication Number Publication Date
JPH02107732A true JPH02107732A (en) 1990-04-19
JPH0778266B2 JPH0778266B2 (en) 1995-08-23

Family

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Country Status (1)

Country Link
JP (1) JPH0778266B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001196A (en) * 1996-10-28 1999-12-14 Brush Wellman, Inc. Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
EP1507267A1 (en) * 2002-05-17 2005-02-16 Idemitsu Kosan Company Limited Wiring material and wiring board using the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105750759B (en) * 2016-03-29 2018-02-27 华中科技大学 A kind of copper base solder and preparation method and application

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63109132A (en) * 1986-10-28 1988-05-13 Furukawa Electric Co Ltd:The High-strength conductive copper alloy and its production
JPH01168831A (en) * 1987-12-25 1989-07-04 Nippon Mining Co Ltd Electric conductive material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63109132A (en) * 1986-10-28 1988-05-13 Furukawa Electric Co Ltd:The High-strength conductive copper alloy and its production
JPH01168831A (en) * 1987-12-25 1989-07-04 Nippon Mining Co Ltd Electric conductive material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001196A (en) * 1996-10-28 1999-12-14 Brush Wellman, Inc. Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
EP1507267A1 (en) * 2002-05-17 2005-02-16 Idemitsu Kosan Company Limited Wiring material and wiring board using the same
EP1507267A4 (en) * 2002-05-17 2006-02-08 Idemitsu Kosan Co Wiring material and wiring board using the same
CN100365737C (en) * 2002-05-17 2008-01-30 出光兴产株式会社 Wiring material and wiring board using the same
EP2161726A1 (en) * 2002-05-17 2010-03-10 Idemitsu Kosan Co., Ltd. Wiring material and wiring board using the same

Also Published As

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