CN105750759B - A kind of copper base solder and preparation method and application - Google Patents
A kind of copper base solder and preparation method and application Download PDFInfo
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- CN105750759B CN105750759B CN201610185840.9A CN201610185840A CN105750759B CN 105750759 B CN105750759 B CN 105750759B CN 201610185840 A CN201610185840 A CN 201610185840A CN 105750759 B CN105750759 B CN 105750759B
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- parts
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- copper base
- powder
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention discloses a kind of copper base solder, the copper base solder is 0.1mm~0.3mm laminated structure, and its gross mass is in terms of 100 parts, by 8 parts~12 parts of manganese, 7 parts~11 parts of nickel, 2 parts~4 parts of chromium, 1 part~3 parts of silicon and 70 parts~82 parts of copper composition.Application the invention also discloses the preparation method of the copper base solder and its in vacuum brazing.The present invention with the addition of nickel, manganese, chromium and element silicon in solder, add wetability, intensity, fusing point and the corrosion resistance of solder, so as to improve the bonding strength of solder, Ti (C are successfully realized using the solder, N) based ceramic metal is reliably connected with steel, the peak shear strength of joint reaches 301.5MPa, and average shear strength reaches 276.8Mpa, and copper base solder its shear strength obtained than prior art improves about 30%.
Description
Technical field
The invention belongs to the preparation field of hard solder, more particularly, to a kind of copper base solder and preparation method thereof with answering
With.
Background technology
With requirement more and more higher of the industrial development to material property, metal material can not meet need under many circumstances
Ask.Ceramics can obtain the composite component for having ceramics and the respective excellent properties of metal material concurrently with being reliably connected for metal, make its tool
Have broad application prospects, vacuum brazing can effectively solve this problem.Wherein, copper base solder has wetability and filling
Ability is good, and cost is widely used in the welding of Ti (C, N) based ceramic metals and metal than silver-base solder low cost and other advantages
In technique.
However, copper base solder of the prior art usually contains Ag, Zn element, Ag improves solder due to price
Cost, and Zn saturated vapour pressure is big, it is volatile during vacuum brazing, cause the composition of solder to change, deteriorate the power of joint
Learn performance.Such as document《The vacuum brazing of Ti (C, N) based ceramic metals and 3Cr13 stainless steels》(Sichuan University's journal (engineering section
Learn version)》The S1 phases in 2012) in disclose a kind of copper base solder, the composition of this solder is Cu, Ag, Zn and Ni, and its maximum is cut
Shearing stress is 154Mpa.But on the one hand the solder is not formed reliably in Ti (C, N) based ceramic metals and Cu base solders side
Metallurgical bonding interface, on the other hand the Ag that wherein contains cause solder softer, intensity is not high, therefore its strength of joint is inadequate,
Quality of connection is unstable, so as to be difficult to meet requirement in many instances.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, the invention provides a kind of copper base solder and preparation method thereof
With application, its object is to the composition by improving copper base solder, so as to improve its strength of joint and quality.
To achieve the above object, according to one aspect of the present invention, there is provided a kind of copper base solder, using gross mass as 100
Part meter, by 8 parts~12 parts of manganese, 7 parts~11 parts of nickel, 2 parts~4 parts of chromium, 1 part~3 parts of silicon and 70 parts~82 parts
Copper forms.
Preferably, the copper base solder is thickness 0.1mm~0.3mm laminated structure.
It is another aspect of this invention to provide that providing the preparation method of above-mentioned copper base solder, comprise the following steps：
(1) in terms of mass fraction, by 8 parts~12 parts of manganese powder, 7 parts~11 parts of nickel powder, 2 parts~4 parts of chromium powder, 1 part
The metal dust of~3 parts of silica flour and 70 parts~82 parts of copper powder composition uniformly mixes；
(2) metal dust by the mixing obtained in the step (1) is compressed to pressed compact piece；
(3) the pressed compact piece obtained in the step (2) is sintered；
(4) solder for being thickness 0.1mm~0.3mm by the pressed compact piece Anneal Roll of the sintering obtained in the step (3)
Thin slice.
Preferably, the particle diameter of metal dust is the mesh of 100 mesh~200 in the step (1).
Preferably, the step (1) is specially：Metal dust, abrading-ball are added in ball grinder and metal can be covered
The ethanol of powder and abrading-ball, abundant ball milling and the metal dust that mixing is obtained after drying.
As it is further preferred that the rotating speed of ball milling is 200rpm~220rpm, time 180min in the step (1)
~240min.
Preferably, the pressure of compacting is 300MPa~400Mpa in the step (2).
Preferably, the temperature of sintering is 810 DEG C~830 DEG C in the step (3), and the time is 20min~30min.
It is another aspect of this invention to provide that additionally provide application of the copper base solder in vacuum brazing.
Preferably, the copper base solder is used for soldering Ti based ceramic metals and steel.
Preferably, the brazing temperature of the copper base solder is 1050 DEG C~1070 DEG C, and the holding time is 25min~35min.
In general, have compared with prior art by the contemplated above technical scheme of the present invention following beneficial to effect
Fruit：
1st, the present invention with the addition of nickel element in copper base solder, for improving the resistance to elevated temperatures and corrosion resistance of solder
Energy；Manganese element is with the addition of, for improving the wetability and spreadability of solder；Chromium is with the addition of, for improving the intensity of solder
And corrosion resistance, while reduce the fusing point of solder；Element silicon is with the addition of, for preventing manganese element from aoxidizing, while improves solder
Mobility；So as to overall wetability, intensity, fusing point and the corrosion resistance for improving solder；
2nd, the copper base solder prepared using the present invention, is successfully realized Ti (C, N) based ceramic metals and is reliably connected with steel, connect
The peak shear strength of head reaches 301.5MPa, and average shear strength reaches 276.8Mpa, stronger than the shearing that prior art obtains
Degree improves about 30%.
Brief description of the drawings
Fig. 1 is the soldering processes curve map of the embodiment of the present invention 8.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Conflict can is not formed each other to be mutually combined.
The invention provides a kind of copper base solder, the copper base solder be 0.1mm~0.3mm laminated structure, its total matter
Measure as 100 parts of meters, by 8 parts~12 parts of manganese, 7 parts~11 parts of nickel, 2 parts~4 parts of chromium, 1 part~3 parts of silicon and 70 parts~
82 parts of copper composition.
Wherein, resistance to elevated temperatures and decay resistance of the nickel element for improving solder, but the nickel element of too high levels
The easily fusing point of rise solder；Wetability and spreadability of the manganese element for improving solder, but the manganese element meeting of too high levels
The plasticity of solder is set to be deteriorated；Chromium is with the addition of, for improving the intensity and corrosion resistance of solder, while reduces the molten of solder
Point, brazing temperature is set to be in the temperature range for being adapted to soldering Ti (C, N) based ceramic metals and steel；Element silicon is used to prevent manganese element
Oxidation, while improve the mobility of solder.
Present invention also offers the preparation method of above-mentioned copper base solder, comprise the following steps：
(1) metal dust, abrading-ball and the ethanol that metal dust and abrading-ball can be covered, abundant ball are added in ball grinder
Grind and the metal dust of mixing is obtained after drying, wherein, ethanol crosses metal dust poor fluidity at least, crosses at most metal dust and mixes
Close ineffective；The particle diameter of the metal dust is the mesh of 100 mesh~200, and its quality is in terms of number, by 8 parts~12 parts of manganese powder,
7 parts~11 parts of nickel powder, 2 parts~4 parts of chromium powder, 1 part~3 parts of silica flour and 70 parts~82 parts of copper powder composition；Ball milling
Rotating speed is 200rpm~220rpm, and the time is 180min~240min, ratio of grinding media to material 5:1~9:1；
(2) with 300MPa~400Mpa pressure, the metal dust of the mixing obtained in the step (1) is compressed to pressure
Blank, pressure is too small, and compact strength is not high, and the copper base solder intensity after heat treatment is not high, and pressure is excessive, can produce copper base solder
Raw elastic after effect；
(3) 810 DEG C~830 DEG C sintering 20min~30min of pressed compact piece that will be obtained in the step (2), so that increase is pressed
The intensity of blank；
(4) the solder thin slice for being 0.1mm~0.3mm by the pressed compact piece Anneal Roll of the sintering obtained in the step (3).
Above-mentioned copper base solder can be applied to vacuum brazing, the especially soldering between Ti based ceramic metals and steel, and its is specific
Step includes：
(1) it is cleaned and dried after the first matrix material to be welded, the second matrix material and copper base solder being polished, makes its table
Face becomes coarse；
(2) the first matrix material, copper base solder and the second matrix material are sequentially placed, and makes fully to contact between three
And relative position is fixed；
(3) less than 10-2Under Pa vacuum, with 1050~1070 DEG C of 25~35min of soldering, vacuum pricker is completed after cooling
Weldering, when brazing temperature is 1060 DEG C, soldering strength is optimal.
Embodiment 1
(1) by mass percentage：Cu powder 76%, Mn powder 10%, Ni powder 9%, Cr powder 3%, Si powder 2%, its granularity difference
Ball milling is carried out in comprehensive planetary ball mill for 100 mesh, 100 mesh, 100 mesh, 100 mesh, 100 mesh, ball-milling medium is to cover completely
The alcohol of lid metal dust and abrading-ball, ratio of grinding media to material 7:1, rotational speed of ball-mill 210rpm, Ball-milling Time 210min, it is being dried in vacuo
Dried in case, obtain 50g alloy powder；(2) by alloy powder, two-way compacting, pressing pressure are by the way of compression molding
350MPa, dwell time are 60 seconds；(3) the alloy pressed compact of compacting is put into vacuum sintering furnace, sintering temperature is 820 DEG C, is protected
The warm time is 25min；(4) by the block Anneal Roll of sintering into thickness be 200 μm, area 48mm2Solder paillon foil.
Embodiment 2
(1) by mass percentage：Cu powder 82%, Mn powder 8%, Ni powder 7%, Cr powder 2%, Si powder 1%, its granularity are respectively
200 mesh, 200 mesh, 200 mesh, 200 mesh, 200 mesh carry out ball milling in comprehensive planetary ball mill, and ball-milling medium is to be completely covered
The alcohol of metal dust and abrading-ball, ratio of grinding media to material 7:1, rotational speed of ball-mill 200rpm, Ball-milling Time 180min, in vacuum drying chamber
Middle drying, obtain 50g alloy powder；(2) by alloy powder, two-way compacting, pressing pressure are by the way of compression molding
300MPa, dwell time are 60 seconds；(3) the alloy pressed compact of compacting is put into vacuum sintering furnace, sintering temperature is 810 DEG C, is protected
The warm time is 20min；(4) by the block Anneal Roll of sintering into thickness be 300 μm, area 48mm2Solder paillon foil.
Embodiment 3
(1) by mass percentage：Cu powder 70%, Mn powder 12%, Ni powder 11%, Cr powder 4%, Si powder 3%, its granularity difference
Ball milling is carried out in comprehensive planetary ball mill for 100 mesh, 100 mesh, 100 mesh, 100 mesh, 100 mesh, ball-milling medium is to cover completely
The alcohol of lid metal dust and abrading-ball, ratio of grinding media to material 7:1, rotational speed of ball-mill 220rpm, Ball-milling Time 240min, it is being dried in vacuo
Dried in case, obtain 50g alloy powder；(2) by alloy powder, two-way compacting, pressing pressure are by the way of compression molding
400MPa, dwell time are 60 seconds；(3) the alloy pressed compact of compacting is put into vacuum sintering furnace, sintering temperature is 830 DEG C, is protected
The warm time is 30min；(4) by the block Anneal Roll of sintering into thickness be 100 μm, area 48mm2Solder paillon foil.
Embodiment 4
Embodiment 1 is repeated with described same steps, difference is, Cu powder, Mn powder, Ni powder, Cr in the step (1)
The particle diameter of powder and Si powder is 150 mesh, ratio of grinding media to material 9:1.
Embodiment 5
Embodiment 1 is repeated with described same steps, difference is, the particle diameter of Cu powder and Mn powder in the step (1)
For 100 mesh, the particle diameter of Ni powder, Cr powder and Si powder is 150 mesh, ratio of grinding media to material 5:1.
Embodiment 6
(1) Ti (C, N) based ceramic metals and mild steel are cut into by long 24mm using the method for Wire EDM respectively, it is wide
8mm, high 6mm block, before vacuum brazing, then matrix material and the solder paillon foil metallographic liquid honing of embodiment 1 will
It is placed on progress ultrasonic wave cleaning in acetone soln, goes the removal of impurity and greasy dirt, time 30min, and temperature is 30 DEG C, is finally used
Alcohol rinse simultaneously dries up.
(2) Ti (C, N) based ceramic metal, solder paillon foil and mild steel are overlapped into placement successively, and in order to keep part to be welded
Completely attach to, placement~200g briquettings on the sample assembled.
(3) vacuum brazing furnace starts to warm up from room temperature, and first paragraph heating rate is 8 DEG C/min, is heated to 580 DEG C of insulations
20min；Second segment heating rate is 4 DEG C/min, is heated to 900 DEG C of insulation 15min；3rd section of heating rate is 4 DEG C/min, is added
Heat arrives 1050 DEG C of brazing temperature, soaking time 25min；Rate of temperature fall is 5 DEG C/min, cools to 400 DEG C of insulation 20min, so
Room temperature is furnace-cooled to naturally afterwards to come out of the stove.The shear strength value obtained under this process conditions is 263.8MPa.
(4) in Process of Vacuum Brazing, vacuum maintains 10-2Pa。
Embodiment 7
(1) Ti (C, N) based ceramic metals and mild steel are cut into by long 24mm using the method for Wire EDM respectively, it is wide
8mm, high 6mm block, before vacuum brazing, by matrix material and the solder paillon foil metallographic liquid honing of embodiment 2, then
Progress ultrasonic wave cleaning in acetone soln is placed it in, goes the removal of impurity and greasy dirt, time 30min, temperature is 30 DEG C, finally
With alcohol rinse and dry up.
(2) Ti (C, N) based ceramic metal, solder paillon foil and mild steel are overlapped into placement successively, and in order to keep part to be welded
Completely attach to, placement~200g briquettings on the sample assembled.
(3) vacuum brazing furnace starts to warm up from room temperature, and first paragraph heating rate is 12 DEG C/min, is heated to 620 DEG C of insulations
30min；Second segment heating rate is 7 DEG C/min, is heated to 900 DEG C of insulation 25min；3rd section of heating rate is 7 DEG C/min, is added
Heat arrives 1070 DEG C of brazing temperature, soaking time 35min；Rate of temperature fall is 7 DEG C/min, cools to 450 DEG C of insulation 30min, so
Room temperature is furnace-cooled to naturally afterwards to come out of the stove.The shear strength value obtained under this process conditions is 265.1MPa.
(4) in Process of Vacuum Brazing, vacuum maintains 10-2Pa。
Embodiment 8
(1) Ti (C, N) based ceramic metals and mild steel are cut into by long 24mm using the method for Wire EDM respectively, it is wide
8mm, high 6mm block, before vacuum brazing, the solder paillon foil prepared by matrix material and embodiment 3 is beaten with metallographic waterproof abrasive paper
Mill, progress ultrasonic wave cleaning in acetone soln is then placed it in, goes the removal of impurity and greasy dirt, time 30min, temperature 30
DEG C, finally with alcohol rinse and dry up.
(2) Ti (C, N) based ceramic metal, solder paillon foil and mild steel are overlapped into placement successively, and in order to keep part to be welded
Completely attach to, placement~200g briquettings on the sample assembled.
(3) vacuum brazing furnace starts to warm up from room temperature, and first paragraph heating rate is 10 DEG C/min, is heated to 600 DEG C of insulations
25min；Second segment heating rate is 6 DEG C/min, is heated to 910 DEG C of insulation 17min；3rd section of heating rate is 6 DEG C/min, is added
Heat arrives 1060 DEG C of brazing temperature, soaking time 30min；Rate of temperature fall is 6 DEG C/min, cools to 425 DEG C of insulation 25min, so
It is furnace-cooled to room temperature naturally afterwards to come out of the stove, its temperature curve is as shown in Figure 1.The shear strength value obtained under this process conditions is
301.5MPa。
(4) in Process of Vacuum Brazing, vacuum maintains 10-2Pa。
Embodiment 9
With with the identical method of embodiment 8, using embodiment 4- embodiments 5 as solder, carry out Ti (C, N) based ceramic metal
Welding between mild steel, also can obtain the result similar with embodiment 6- embodiments 8, shear strength value for 263.8MPa~
301.5Mpa。
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., all should be included
Within protection scope of the present invention.
Claims (10)
- A kind of 1. copper base solder for the weldering of cermet and drill rod, it is characterised in that counted using gross mass as 100 parts, by 8 parts~ 12 parts of manganese, 7 parts~11 parts of nickel, 2 parts~4 parts of chromium, 1 part~3 parts of silicon and 70 parts~82 parts of copper composition.
- 2. copper base solder as claimed in claim 1, it is characterised in that the copper base solder is thickness 0.1mm~0.3mm piece Shape structure.
- 3. the preparation method of copper base solder as claimed in claim 1 or 2, it is characterised in that comprise the following steps：(1) in terms of mass fraction, by 8 parts~12 parts of manganese powder, 7 parts~11 parts of nickel powder, 2 parts~4 parts of chromium powder, 1 part~3 parts Silica flour and 70 parts~82 parts copper powder composition metal dust uniformly mix；(2) metal dust by the mixing obtained in the step (1) is compressed to pressed compact piece；(3) the pressed compact piece obtained in the step (2) is sintered；(4) the solder thin slice for being 0.1mm~0.3mm by the pressed compact piece Anneal Roll of the sintering obtained in the step (3).
- 4. method as claimed in claim 3, it is characterised in that the step (1) is specially：Metal powder is added in ball grinder End, abrading-ball and the ethanol that metal dust and abrading-ball can be covered, abundant ball milling and the metal dust that mixing is obtained after drying.
- 5. method as claimed in claim 4, it is characterised in that in the step (1) rotating speed of ball milling be 200rpm~ 220rpm, time are 180min~240min.
- 6. method as claimed in claim 3, it is characterised in that in the step (2) pressure of compacting for 300MPa~ 400Mpa。
- 7. method as claimed in claim 3, it is characterised in that the temperature of sintering is 810 DEG C~830 DEG C in the step (3), Time is 20min~30min.
- 8. method as claimed in claim 3, it is characterised in that in the step (1) particle diameter of metal dust be 100 mesh~ 200 mesh.
- 9. application of the copper base solder as claimed in claim 1 or 2 in vacuum brazing.
- 10. application as claimed in claim 9, it is characterised in that for soldering Ti (C, N) based ceramic metals and steel.
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109531457B (en) * | 2018-12-29 | 2021-07-02 | 郑州机械研究所有限公司 | Powdered active brazing filler metal for diamond grinding tool |
| CN114571129A (en) * | 2021-09-30 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing filler metal and preparation method and application thereof |
| CN115041865B (en) * | 2022-04-27 | 2023-06-16 | 西安交通大学 | Cu-based brazing filler metal for high-activity, multipurpose and rapid brazing and preparation method thereof |
| CN114571137A (en) * | 2022-05-09 | 2022-06-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-based brazing paste, copper-based pre-alloy and preparation method thereof |
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| JPH0778266B2 (en) * | 1988-10-17 | 1995-08-23 | 同和鉱業株式会社 | High strength and high conductivity copper base alloy |
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