JPH02106821U - - Google Patents
Info
- Publication number
- JPH02106821U JPH02106821U JP1466889U JP1466889U JPH02106821U JP H02106821 U JPH02106821 U JP H02106821U JP 1466889 U JP1466889 U JP 1466889U JP 1466889 U JP1466889 U JP 1466889U JP H02106821 U JPH02106821 U JP H02106821U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chamfers
- semiconductor devices
- chamfered
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1466889U JPH02106821U (ko) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1466889U JPH02106821U (ko) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106821U true JPH02106821U (ko) | 1990-08-24 |
Family
ID=31226076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1466889U Pending JPH02106821U (ko) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106821U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136423A1 (ja) * | 2007-04-27 | 2008-11-13 | Shibaura Mechatronics Corporation | 半導体ウェーハ処理装置、基準角度位置検出方法及び半導体ウェーハ |
-
1989
- 1989-02-10 JP JP1466889U patent/JPH02106821U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136423A1 (ja) * | 2007-04-27 | 2008-11-13 | Shibaura Mechatronics Corporation | 半導体ウェーハ処理装置、基準角度位置検出方法及び半導体ウェーハ |