JPH02101799A - Fixing equipment for high frequency output stage amplifier of vehicle-borne radio transceiver - Google Patents
Fixing equipment for high frequency output stage amplifier of vehicle-borne radio transceiverInfo
- Publication number
- JPH02101799A JPH02101799A JP25464488A JP25464488A JPH02101799A JP H02101799 A JPH02101799 A JP H02101799A JP 25464488 A JP25464488 A JP 25464488A JP 25464488 A JP25464488 A JP 25464488A JP H02101799 A JPH02101799 A JP H02101799A
- Authority
- JP
- Japan
- Prior art keywords
- output stage
- frequency output
- stage amplifier
- heat dissipation
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 230000005855 radiation Effects 0.000 claims description 16
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Mobile Radio Communication Systems (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は車載無線機の高周波出力段増幅器の取付装置に
関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mounting device for a high frequency output stage amplifier of a vehicle radio.
従来の技術
従来の車載無線機における高周波出力段増幅器の取付装
置を第３図、第４図に示す。2. Description of the Related Art A conventional mounting device for a high-frequency output stage amplifier in a vehicle-mounted radio is shown in FIGS. 3 and 4.
７は放熱フィンで筐体８の背面に設け、自然空冷するよ
うになっている。９は高周波出力段増幅器で、筺体８上
に取付けられている。１０は無線部プリント基板で、前
記高周波出力段増幅器９はこの無線部プリント基板ｌＯ
に接続されている。、筐体８の裏面側には制御部基板１
１を設けている。A radiation fin 7 is provided on the back side of the housing 8 for natural air cooling. Reference numeral 9 denotes a high frequency output stage amplifier, which is mounted on the housing 8. 10 is a wireless section printed circuit board, and the high frequency output stage amplifier 9 is connected to this wireless section printed circuit board lO.
It is connected to the. , the control board 1 is located on the back side of the housing 8.
1 is provided.
このように上記従来の取付装置においても、筺体８の肉
厚を厚くすれば、放熱フィンと連結されているので、放
熱効果が働き、小型実装を達成することができる。In this way, even in the above-mentioned conventional mounting device, if the wall thickness of the housing 8 is increased, since it is connected to the heat dissipation fin, the heat dissipation effect will work and a compact mounting can be achieved.
発明が解決しようとする課題
しかし、上記のような取付装置では筺体８の下面から放
熱フィン７部への筐体断面積が小さく、熱抵抗が増加す
るという欠点があった。また、この放熱作用を改善する
ためには筐体下面に放熱部を設ける必要があるが、無線
部プリント基板との関係及び制御部基板との配置等を考
慮しなければならず、機械的構造上問題がある。Problems to be Solved by the Invention However, the mounting device as described above has a disadvantage in that the cross-sectional area of the housing from the bottom surface of the housing 8 to the radiation fins 7 is small, resulting in increased thermal resistance. In addition, in order to improve this heat dissipation effect, it is necessary to provide a heat dissipation section on the bottom surface of the casing, but the relationship with the wireless section printed circuit board and the arrangement with the control section board must be considered, and the mechanical structure There is a problem above.
本発明の目的は上記のような従来の問題点を解決するも
のであり、従来の機械的構造を維持しながら放熱特性を
向」二することのできる車載無線機の筐体への高周波出
力段増幅器の取付装置を提供しようとするものである。The purpose of the present invention is to solve the above-mentioned conventional problems, and to provide a high-frequency output stage for the housing of an in-vehicle radio that can improve heat dissipation characteristics while maintaining the conventional mechanical structure. The present invention seeks to provide an amplifier mounting device.
課題を解決するための手段
上記目的達成のため本発明は、高周波出力段増幅器の温
度上界を筐体背面の放熱フィンにより自然空冷するよう
にした車載無線機において、前記放熱フィンと隣接して
無線部プリント基板に至る筐体底面に斜面部を設け、こ
の斜面部に前記高周波出力段増幅器を取付けることによ
り接触断面積を大きくし、放熱効率を高めた車載無線機
の高周波出力段増幅器の取付装置とした。Means for Solving the Problems To achieve the above object, the present invention provides an in-vehicle radio device in which the upper temperature limit of a high-frequency output stage amplifier is naturally cooled by heat radiation fins on the back side of the housing, in which the temperature limit of a high frequency output stage amplifier is naturally cooled by a heat radiation fin adjacent to the heat radiation fin. Installation of a high-frequency output stage amplifier for a vehicle-mounted radio device in which a slope is provided on the bottom of the casing leading to the radio section printed circuit board, and the high-frequency output stage amplifier is mounted on this slope to increase the contact cross-sectional area and improve heat dissipation efficiency. It was used as a device.
作用
本発明は上記のように放熱フィンから無線部プリント基
板に至る筐体底面に斜面部を設け、この斜面部に高周波
出力段増幅器を取付けたので、筐体と放熱フィンとの断
面積が大きく高周波出力段増幅器との接触面積が大きく
、熱抵抗の増加を防止することができ、効率的な放熱作
用を得られるようになった。Function As described above, the present invention provides a sloped portion on the bottom of the casing from the radiation fin to the wireless unit printed circuit board, and the high-frequency output stage amplifier is mounted on this sloped portion, so that the cross-sectional area between the housing and the radiation fin is large. The contact area with the high-frequency output stage amplifier is large, making it possible to prevent an increase in thermal resistance and achieve efficient heat dissipation.
実施例
第１図は本発明の一実施例を示すもので、ｌは放熱フィ
ンで、筺体２の背面側で一体的に構成されている。筐体
２の底面両側には無線部プリント基板３と制御部プリン
ト基板４が固定されている。５は高周波出力段増幅器で
、筺体２の放熱フィンｌに隣接した斜面部６に直接取付
けられている。このように上記実施例によれば、放熱フ
ィン５と筺体２の斜面部６の断面積が大きいので、熱抵
抗を小さくすることができ、部品の実装効率をほとんど
下げることなしに、放熱効率を著しく高めることができ
る。Embodiment FIG. 1 shows an embodiment of the present invention, in which l represents a radiation fin, which is integrally formed on the back side of the housing 2. As shown in FIG. A wireless section printed circuit board 3 and a control section printed circuit board 4 are fixed to both sides of the bottom surface of the casing 2. Reference numeral 5 denotes a high-frequency output stage amplifier, which is directly attached to the slope portion 6 adjacent to the heat dissipation fins l of the housing 2. As described above, according to the above embodiment, since the cross-sectional areas of the radiation fins 5 and the slope portion 6 of the housing 2 are large, the thermal resistance can be reduced, and the heat radiation efficiency can be increased without almost reducing the mounting efficiency of the components. can be significantly increased.
発明の効果
本発明は上記のように、放熱フィンと隣接する無線部プ
リント基板の斜面部に高周波出力段増幅器を設けたので
、放熱フィンと隣接する斜面部の断面積が大きくなり、
無線部及び制御部の部品実装効率をほとんど下げずに、
放熱効率を著しく高めることができるようになった。Effects of the Invention As described above, in the present invention, the high frequency output stage amplifier is provided on the sloped portion of the wireless unit printed circuit board adjacent to the radiation fin, so that the cross-sectional area of the sloped portion adjacent to the radiation fin is increased.
without reducing the component mounting efficiency of the radio section and control section.
It has become possible to significantly increase heat dissipation efficiency.
第１図は本発明の一実施例における車載無線機の高周波
出力段増幅器の取付装置を示す斜視図、第２図は同縦断
面図、第３図は従来例を示す斜視図、第４図は同縦断面
図である。
ｌ・・・放熱フィン ２・・・筐体
３・・・無線部プリント基板
５・・・高周波出力段増幅器 ６・・・斜面部１：放
熱フィン
５：高周波出力段増幅器FIG. 1 is a perspective view showing a mounting device for a high-frequency output stage amplifier of an in-vehicle radio according to an embodiment of the present invention, FIG. 2 is a longitudinal cross-sectional view of the same, FIG. 3 is a perspective view showing a conventional example, and FIG. 4 is a longitudinal sectional view of the same. l...Radiation fin 2...Casing 3...Wireless part printed circuit board 5...High frequency output stage amplifier 6...Slope part 1: Heat radiation fin 5: High frequency output stage amplifier
Claims (1)
フィンにより自然空冷するようにした車載無線機におい
て、前記放熱フィンと隣接して無線部プリント基板に至
る筐体底面に斜面部を設け、この斜面部に前記高周波出
力段増幅器を取付けることにより接触断面積を大きくし
、放熱効率を高めたことを特徴とする車載無線機の高周
波出力段増幅器の取付装置。(1) In an in-vehicle radio device in which the temperature rise of the high-frequency output stage amplifier is naturally cooled by heat radiation fins on the back of the housing, a sloped portion is provided on the bottom of the housing adjacent to the heat radiation fins and leading to the radio unit printed circuit board. . A mounting device for a high-frequency output stage amplifier of a vehicle-mounted radio, characterized in that the high-frequency output stage amplifier is mounted on the sloped portion to increase a contact cross-sectional area and improve heat dissipation efficiency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25464488A JPH02101799A (en) | 1988-10-07 | 1988-10-07 | Fixing equipment for high frequency output stage amplifier of vehicle-borne radio transceiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25464488A JPH02101799A (en) | 1988-10-07 | 1988-10-07 | Fixing equipment for high frequency output stage amplifier of vehicle-borne radio transceiver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101799A true JPH02101799A (en) | 1990-04-13 |
Family
ID=17267884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25464488A Pending JPH02101799A (en) | 1988-10-07 | 1988-10-07 | Fixing equipment for high frequency output stage amplifier of vehicle-borne radio transceiver |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101799A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003258465A (en) * | 2002-03-04 | 2003-09-12 | Denso Corp | Electronic circuit unit |
-
1988
- 1988-10-07 JP JP25464488A patent/JPH02101799A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003258465A (en) * | 2002-03-04 | 2003-09-12 | Denso Corp | Electronic circuit unit |
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