JPH0140520B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates in particular to the radiation of heat generated by an electronic circuit device in which a module that is composed of, for example, a high-output active element or active circuit and generates heat is mounted on an electronic circuit device board.

Modules that are made up of electronic circuits and elements mounted on a module board sealed with a metal cover, especially modules that are made up of active elements and active circuits packaged in a transistor can type, are subject to temperature rise due to heat generation from the internally mounted circuits and elements. It is necessary to suppress the temperature and maintain it within a predetermined appropriate temperature range. For this purpose, heat is transferred directly from the module board to the electronic circuit device board/casing, or a heat radiating device having heat radiating fins, and the heat is radiated from these to the external space to achieve equilibrium so that the temperature is at an appropriate level.

By the way, even if metal materials with good thermal conductivity are used for heat dissipation by heat transfer to the electronic circuit device board, housing, heat dissipation device, etc., the cross-sectional area, surface area, amount of heat transfer, etc. for heat transfer and heat dissipation are There is a limit, and it is impossible to respond to heat generation exceeding a certain certain value.

Therefore, conventionally, modules are mounted in a distributed manner at intervals that allow heat radiation so that the electronic circuit device maintains a predetermined temperature range. On the other hand, from the functional and performance aspects of electronic circuit devices, it is preferable and desirable to mount such modules and related components in high density and close proximity. but,
There is a problem in that the degree of freedom in mounting design cannot be obtained due to the thermal conditions as described above.

In view of the above-mentioned problems, the present invention uses a heat pipe for heat dissipation, thereby providing an electronic circuit device that can realize highly efficient heat dissipation and high-density packaging. With the goal.

According to the configuration of the electronic circuit device of the present invention, the above object is an electronic circuit device in which a module that generates heat is mounted on the surface of an electronic circuit device board so that the module board is in thermal and electrical contact with the surface of the electronic circuit device. Either the module board is directly brought into close contact with the electronic circuit device board surface to achieve thermal and electrical contact, or a heat transfer board is interposed between the electronic circuit device board surface and the module board to bring them into close contact with each other to achieve thermal contact. and a heat pipe connection part is provided on the side of the module board or heat transfer board that is in close contact with the surface of the electronic circuit device board, so that heat is transferred between the connection part and the heat absorption part of the heat pipe. This is achieved by making the connections.

With the above configuration, the heat generated by the modules arranged in high density is connected to a heat pipe with extremely excellent heat transfer performance, and the other heat radiating part of the heat pipe is connected to a natural heat radiating means with high heat radiating performance,
By connecting to a higher performance heat dissipation device, such as a cooler or forced air cooler, and conductively cooling the generated heat, it is possible to maintain the temperature of the electronic circuit device board itself below a predetermined temperature.

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a perspective view of essential parts showing an embodiment of the present invention, and FIG. 2 shows a cross section taken along line AA in FIG. The figure shows the main parts of one unit forming the housing structure of a multiplex radio communication device using microwave bands.

The modules 1 and 2 constituting the electronic circuit device have high-frequency amplification circuits 14 and 24 (one 24 is not shown) mounted on the upper surfaces of module substrates 11 and 21, respectively, and are covered and sealed with metal covers 12 and 22. ing. These modules 1 and 2 are mounted and mounted on both sides of an electronic circuit device board (hereinafter abbreviated as carrier) 4 along with other circuit device components such as a circulator 7 and a filter 3 to form a circuit. The carrier, which is part of the housing,
Made of an aluminum alloy that is easy to process, handle, and has good thermal conductivity.

The lower surfaces of the module boards 11 and 21 are in electrical contact with the surface of the carrier 4 to prevent ultra-high frequencies (microwaves) from leaking from the contact gap on both surfaces and causing problems such as mutual induction and interference. Since it is necessary to attach the module boards 11 and 21, the carrier 4,
A microwave signal line 81 and a power supply line 8 each having a coaxial line configuration that penetrates through and connects to the back side of the carrier 4.
It has 2. Heat pipe connecting parts 13 and 23 are provided on the side of the module on the upper surface at a stepped part integrally formed with the module substrates 11 and 21.

The heat absorbing portion of the heat pipe 5 commonly contacts the connecting portions 13 and 23, and is pressed and fixed with a presser fitting 6, respectively. The direction of the arrow B of the heat pipe 5 is fixed in contact with another module that generates heat, if necessary, and the heat radiating portion at the tip thereof is connected to an appropriate heat radiating means (not shown).

With the above configuration, the high frequency amplifier circuits 14 and 2 of the modules 1 and 2 are
4 and other modules that generate heat (not shown) are transferred to the respective module boards 11 and 2.
1, the heat increases the temperature of the module substrate on average due to the module substrate made of a material such as copper (or aluminum, etc.) having excellent thermal conductivity. At the same time, the temperature of the stepped heat pipe connection parts 13 and 23, which have a large heat capacity, is also increased, so that the heat is efficiently transferred to the heat absorption part of the heat pipe 5 connected here, and is then transferred to the heat radiation part at the other end in the direction of arrow B. It heats up and is dissipated.

Therefore, although the heat from the module substrates 11 and 21 is transferred to the carrier 4, most of the heat is transferred to the heat pipe 5, which has high heat transfer efficiency, so the temperature of the carrier including the module is maintained at an extremely low temperature. Therefore, high-density packaging and miniaturization of electronic circuit devices are easily possible in an extremely favorable manner.

The heat pipe connecting parts 13 and 23 of the module boards 11 and 21 are not simply placed with the heat pipe 5 and fixed by pressing with the holding metal fittings 6, but are designed to have the same cross section as the heat pipe 5, as shown in FIG. To fit together as a semicircular groove with a diameter. It is also possible to press and fix the heat pipe from the upper part with a metal block holding fitting having a similar semicircular groove, so that the heat pipe is closely inserted into the substantially circular hole.

Furthermore, if a well-known heat conductive compound or the like is interposed, the heat transfer efficiency will be extremely increased.

Further, the heat pipe connection point is not limited to the illustrated direction, but can be set on any side other than the contact surface with the carrier, such as the side surface of the connection portions 13 and 23, for example.

As a second embodiment, the present invention can also be applied to a module-mounted electronic circuit device having a conventional flange-shaped substrate, as shown in the cross section of FIG. 3, which is similar to FIG. That is, as shown in the figure, the high frequency amplifier circuit 1 is mounted on the module board 11' of the module 1'.
4 is mounted, and a module board 11' is covered and sealed with a metal cover 12. A heat transfer substrate 15 is interposed and sandwiched between the module substrate 11' and the carrier 4, and a heat pipe connection portion 13' is integrally formed on the side of the module 1' in the heat transfer substrate 15. A heat pipe 5 is connected to this heat pipe connecting portion 13' in the same manner as shown in FIG. 2, and is pressed and fixed with a presser metal fitting 6.

The lower surface of the module substrate 11' and the surface of the carrier 4 are in close contact with each other via both surfaces of the heat transfer substrate 15, which means that, as in the first embodiment, the microwaves from these contact gaps are They are electrically pressed together in close electrical contact to prevent the passage of electricity.

In this embodiment, the signal line 81 and the power line 82 are connected to the carrier 4, the heat transfer board 15, and the module board 1.
1' and are connected to the circulator 7 and the power supply line on the back surface of the carrier 4.

As described above, the heat generated from the high frequency amplifier circuit 14 is transferred to the module board 11', and then from the heat transfer board 15 made of copper (or aluminum, etc.) with good thermal conductivity to the heat pipe via the heat pipe connection part 13'. Heat is absorbed by the heat absorbing part 5 and the heat is dissipated and cooled. Of course, some of the heat is transferred to the carrier 4.

According to the second embodiment, the overall height is increased by the thickness of the heat transfer substrate 15 compared to the first embodiment, but conventional module units can be used, and the module 1' and By combining it with the heat transfer substrate 15, it can be handled as a single unit, making it substantially equivalent to FIGS. 1 and 2.

As explained above, the electronic circuit device according to the present invention uses a module board and a heat transfer board that can directly connect the heat generated by the module to a heat pipe, and by using such an integrated structure, it can be used as a heat transfer for heat dissipation. Direct cooling from the module board and heat transfer board is possible to improve heat efficiency.

In addition, the module board is electrically and thermally in close contact with the electronic circuit board surface, either directly or via a heat transfer board, so it is electrically stable, and heat transfer cooling is also possible using heat pipe connections with large heat capacity. By providing this, in combination with the highly efficient heat conduction of the heat pipe, the electronic circuit device can be cooled and operated stably. Therefore, it exhibits excellent practical features such as high-density packaging and miniaturization of electronic circuit devices.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing only essential parts of an electronic circuit device mounted according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 3 is a cross-sectional view of the second embodiment. In the figure, 1, 1', 2 are modules, 11,
11', 21 are module boards, 12, 22 are metal covers, 13, 13', 23 are heat pipe connection parts, 3 is a filter, 4 is a carrier, 5 is a heat pipe, 6 is a presser metal fitting, 7 is a circulator, 1
4 and 24 are high frequency amplifier circuits, 15 is a heat transfer board, 8
1 is a coaxial line, and 82 is a power supply line.

Claims (1)

[Scope of Claims] 1. In an electronic circuit device in which a module that generates heat is mounted on the surface of an electronic circuit device substrate so that the module substrate is in thermal and electrical contact with the module substrate, the module substrate is mounted on the surface of the electronic circuit device substrate. Either the electronic circuit device board surface and the module board are brought into direct contact with each other in thermal and electrical contact, or a heat transfer board is interposed between the electronic circuit device board surface and the module board so that they are brought into close contact with each other and are in thermal and electrical contact. An electronic circuit characterized in that a heat pipe connection part is provided on the side of a module board or a heat transfer board that is in close contact with the surface of the electronic circuit device board, and the connection part and the heat absorption part of the heat pipe are connected for heat transfer. Device.