JPH02100279A - Socket for semiconductor device - Google Patents

Abstract

PURPOSE:To obtain easy and stable electric contact by providing a pair of electrodes electrically connecting while holding between top and bottom of the respective leads projected from a semiconductor device to the end parts of a pair of switchably connected socket segments every side independently. CONSTITUTION:Two pieces of socket segments 1a and 1b of an IC socket body 1 provided corresponding to each side of an IC 6 are pushopened resisting a spring 2 for opening electrodes 3 and 4 making a pair, leads 7 are accepted into the sockets 1c to insert the leads 7 between the electrodes 3 and 4 while releasing external force from the socket segments 1a and 1b for using spring force of a spring 2 to hold the leads 7 of the IC 6 between from up and down with the electrodes 3 and 4 making a pair to take electric contact. This operation is separately and independently performed respectively to the leads 7 of each side of the IC 6 in order to take electric contact to the leads 7 of all sides of the IC 6 with four pieces of separate and independent IC socket bodies 1 for connecting the wirings 5 of each IC socket body 1 to an IC tester or the like. Thereby, easy and stable electric contact can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a socket for a semiconductor device, and particularly to a socket for a semiconductor device in which a flat package type semiconductor device having leads laterally protruding from each side is mounted.

[Conventional technology]

Conventionally, this type of semiconductor device socket (hereinafter referred to as "socket") has been used.

When a flat packaged semiconductor device (hereinafter referred to as an IC) is mounted in an IC socket, it is necessary to make electrical contact with the leads of the IC.
Electrical contact was maintained only when the side leads were simultaneously secured onto the IC socket electrodes.

[Problem to be solved by the invention]

In the conventional IC socket described above, electrical contact between the IC leads and the electrodes of the IC socket is maintained only when all the leads on the four sides of the IC are fixed at the same time.
Multi-pin ICs often have the disadvantage of causing poor contact. Another drawback is that if the number of IC leads is different, a corresponding IC socket must be created.

An object of the present invention is to provide a socket for a semiconductor device that solves the above problems.

[Differences between the invention and the prior art]

In contrast to the conventional IC socket described above, the present invention
The difference is that when mounted on a C socket, the leads on the four sides of the IC maintain electrical contact with the IC socket independently, and can be mounted on all multi-pin flat package ICs.

[Means to solve division problems]

In order to achieve the above object, the present invention provides a socket for a semiconductor device in which a flat package type semiconductor device having leads extending on each side is mounted, in which the semiconductor device is mounted at the ends of a pair of socket segments connected to be openable and closable. It is equipped with a pair of electrodes that are electrically connected to each other by sandwiching the top and bottom of each lead protruding from the device independently on each side.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

(Example 1) FIG. 1 is a diagram showing a first embodiment of the present invention.

In the figure, a flat package type IC 6 generally has a square outer shape, and has a lead 7 extending laterally from each side of the square. Therefore, the present invention is provided with separate and independent IC socket bodies 1 for each side of the socket C6. As shown in FIG. 1, the IC socket main body 1 consists of two socket segments la and lb that are connected so as to be openable and closable, and the two socket segments la and lb are biased in the closing direction by a spring 2. There is. The connecting ends of the socket segments la and lb are provided with sockets 1c and lc for the leads 7 corresponding to the pitch of the leads 7 of the IC6, forming a pair that sandwich the leads 7 from above and below. The pair of electrodes 3, 4 is provided in the socket lc by supporting the electrodes 3, 4 at the tips of the socket segments la, lb, respectively. Reference numeral 5 denotes wiring connected to the electrodes 3 and 4 through the inside of the IC socket main body 1, and for keeping the picture electrodes 3 and 4 at the same electrical potential.

In the embodiment, as shown in FIG. 2, the two socket segments la and lb of the IC socket body 1 provided corresponding to each side of the IC 6 are pushed apart against the spring 2 to form a pair of electrodes 3. , 4 are opened, the lead 7 of the IC 6 is received in the socket lc, and the lead 7 is inserted between the pair of electrodes 3 and 4, the external force is released from the socket segments la and lb, and the spring force of the spring 2 is released. I at the pair of electrodes 3 and 4 using
The lead 7 of C6 is held between the top and bottom to establish electrical contact.

The above operation is performed separately and independently for the leads 7 on each side of the IC 6, and electrical contact is made by the four independent IC socket bodies 1 to the leads 7 on all sides of the IC 6, and each IC The wiring 5 of the socket body 1 is connected to an IC tester or the like.

(Example 2) FIG. 3 is a plan view showing a second embodiment of the present invention.

In this embodiment, four IC sockets 1 are connected to each other by four IC socket bodies 1.
The side glues 7 are held in electrical contact with the electrodes. In this embodiment, the IC socket main body 1 has an I
It has more pairs of electrodes 3゜4 than the number of leads 7 of the C6, and is suitable for multiple types of IC6 with different numbers of leads 7.
This has the advantage that the C socket main body 1 can be used in common.

〔Effect of the invention〕

As described above, the present invention has the advantage that when mounting an IC, a plurality of independent IC socket bodies are used for the leads on each side of the IC, and it is possible to easily and stably realize electrical contact.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing Embodiment 1 of the present invention, and FIG. 2 is an IC
FIG. 3 is a plan view showing a second embodiment of the present invention. 1... IC socket body 2... Spring 3.4
...Electrode 5...Wiring 6...IC
? ...Lead

Claims (1)

[Claims] (1) In a semiconductor device socket for mounting a flat package type semiconductor device having leads extending from each side, each lead projects from the semiconductor device at the end of a pair of socket segments connected in an openable/closable manner. A socket for a semiconductor device, characterized in that it is equipped with a pair of electrodes that are electrically connected by sandwiching the upper and lower sides of the socket independently on each side.