JPH01244655A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH01244655A JPH01244655A JP7237388A JP7237388A JPH01244655A JP H01244655 A JPH01244655 A JP H01244655A JP 7237388 A JP7237388 A JP 7237388A JP 7237388 A JP7237388 A JP 7237388A JP H01244655 A JPH01244655 A JP H01244655A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- package body
- package
- outer leads
- surface side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 4
- 238000012360 testing method Methods 0.000 abstract description 7
- 239000011295 pitch Substances 0.000 abstract 2
- 241000272168 Laridae Species 0.000 abstract 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体素子を搭載するノ（ツケージに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cage for mounting a semiconductor element.
第２図は従来のノ（ツケージを示す斜視図であり、巾は
パッケージ本体、１２１はこれに取り付けられた外部リ
ードである。FIG. 2 is a perspective view showing a conventional package, where the width is the package body and 121 is the external lead attached to it.
次に動作について説明する。）くツケージ本体に取り付
けられた外部リード（２１によってプＩｌント基板やソ
ケット等と電気的に接続される。Next, the operation will be explained. ) It is electrically connected to a printed circuit board, a socket, etc. by an external lead (21) attached to the cage body.
従来のパッケージは以上のように構成されているので、
電気試験を行なう場合に外部リードと同じピッチのソケ
ットやプローブカードが必要で、また、Ｊリードやリー
ドレスタイプのパッケージでは表面側からの針当てが困
難であるなどの問題点があった。Conventional packages are structured as above, so
When conducting electrical tests, sockets and probe cards with the same pitch as the external leads are required, and J-lead and leadless type packages have problems such as difficulty in applying needles from the front side.
この発明は上記のような間ｆ点を解消するためになされ
たもので、外部リードより緩いピッチで、かつ表面側か
ら容易に電気試験が行なうことができるパッケージを得
ること全目的とする０
〔課蓋を解決するための手段〕
この発明に係るパッケージは、パッケージ本体表面に１
［極を設けたものである。This invention was made in order to eliminate the above-mentioned f-point, and its overall purpose is to obtain a package that has a looser pitch than the external leads and that allows easy electrical testing from the surface side. Means for Solving Problems] The package according to the present invention has one on the surface of the package body.
[It has poles.]
この発明における電極は、パッケージ本体表面に面状に
設けられることにより、ピッチが緩和され、かつ表面側
からの電気試験が容易に女る。By providing the electrodes in the present invention in a planar manner on the surface of the package body, the pitch is relaxed and electrical testing from the surface side can be easily performed.
以下、この発明の一実施例を図について睨明する。第１
図にお−で、…はパッケージ本体、（２）ぽこれに取り
付けられた外部リード、１３１はパッケージ本体…の表
面に設けられた電極である。An embodiment of the present invention will be explained below with reference to the drawings. 1st
In the figure, ... is the package body, (2) an external lead attached to the port, and 131 is an electrode provided on the surface of the package body.
次に動作について説明する。４１図において、パッケー
ジ本体（１１０表面に設けられた電極＋３１によって、
外部リードより緩いヒーツチで、かつ表面側から電気試
験を行なう。Next, the operation will be explained. In Figure 41, the electrode +31 provided on the surface of the package body (110)
Perform the electrical test from the surface side with a heat chain that is looser than the external lead.
なお、上記実施例を示す第１図では外部ｙ−ドげガルウ
ィングタイプであるが、Ｊリード。In addition, in FIG. 1 showing the above embodiment, the external Y-doggull wing type is used, but it is a J lead.
挿入ビン、リードレスタイプ等であってもよい。An insertion bottle, leadless type, etc. may be used.
また、第１図では電極（３１は円形であるが矩形でもよ
い。Further, although the electrode (31 is circular in FIG. 1), it may be rectangular.
以上のように、この発明によれば、パッケージ本体表面
Ｋ［極を設けたので、緩いピッチで、かつ表面側より容
易ＩＣ１１Ｅ気試験を行なうことができる効果がある。As described above, according to the present invention, since the poles are provided on the surface of the package body, the IC11E test can be easily performed at a loose pitch and from the surface side.
第１図はこの発明の一実施例によるパッケージを示す斜
視図、＠２図は従来のパッケージを示す斜視図である。
ｔｌｌ ｉｊパッケージ本体、（２１は外部リード、（
引げ電極である。
なお、図中、同一符号は同一、又は相当部分を示す＠FIG. 1 is a perspective view showing a package according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional package. tll ij package body, (21 is external lead, (
It is a pull electrode. In addition, in the figures, the same symbols indicate the same or equivalent parts@
Claims (1)
ジ本体表面に電極を設けたことを特徴とする半導体装置
。A semiconductor device characterized in that, in a package mounting a semiconductor element, electrodes are provided on the surface of the package body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7237388A JPH01244655A (en) | 1988-03-26 | 1988-03-26 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7237388A JPH01244655A (en) | 1988-03-26 | 1988-03-26 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01244655A true JPH01244655A (en) | 1989-09-29 |
Family
ID=13487437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7237388A Pending JPH01244655A (en) | 1988-03-26 | 1988-03-26 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01244655A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259367A (en) * | 1992-03-12 | 1993-10-08 | Nec Corp | Flat ic package |
| US5808357A (en) * | 1992-06-02 | 1998-09-15 | Fujitsu Limited | Semiconductor device having resin encapsulated package structure |
-
1988
- 1988-03-26 JP JP7237388A patent/JPH01244655A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259367A (en) * | 1992-03-12 | 1993-10-08 | Nec Corp | Flat ic package |
| US5808357A (en) * | 1992-06-02 | 1998-09-15 | Fujitsu Limited | Semiconductor device having resin encapsulated package structure |
| US6031280A (en) * | 1992-06-02 | 2000-02-29 | Fujitsu Limited | Semiconductor device having resin encapsulated package structure |
| US6271583B1 (en) | 1992-06-02 | 2001-08-07 | Fujitsu Limited | Semiconductor device having resin encapsulated package structure |
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