JPH062150Y2 - IC Socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a socket for IC testing.

(Prior Art and Its Problems) FIG. 5 is a side view (partial cross section) of an example of a conventional test IC socket. ICs for flat packages
The socket includes a socket body 1 in which the contact pins 4 are arranged in the slit grooves 7 as shown in FIG.
It is composed of a pressing lid 5 for pressing the IC package placed so as to be connected to the contact piece 4a, and a lock piece 9 for locking the pressing lid 5. Here, the contact pin 4 includes an arm portion 4d placed on the base 1a of the socket body 1, a spring portion 4e provided at the tip of the arm portion 4d, and a contact piece 4a provided upward at the tip of the spring portion 4e. Further, a locking piece 4b is provided on the lower side of the arm portion 4d, and legs 4c and 4c 'for external connection are further provided below the locking piece 4b.

On the other hand, with the recent increase in the density of ICs, the package terminals are arranged close to the adjacent terminals, so that the contact pins 4 must be mounted close together. For this reason, the legs 4c and 4c 'of the contact pin 4 also come close to each other, so in the past, in order to separate the legs 4c and 4c' as much as possible, the mounting position on the arm portion 4d as shown by 4c and 4c 'in the same figure is set. The displaced contact pins are attached alternately. As a result, two types of contact pins are required, which causes a high cost.

Also, in the case of the contact pin 4, the legs 4c and 4c 'must be inserted into the insertion holes 10 for mounting to the socket body 1. Especially, the insertion holes 10 and the legs 4c and 4c' are small, and the legs 4c and 4c 'are also small. Since it is easily bent, the mounting work is complicated and it is difficult to shorten the working time.

Further, the contact pin 4 includes a contact piece 4a and legs 4c and 4c '.
Since and are formed on the opposite side to the arm portion 4d, it is difficult to downsize the socket body 1 to which the arm portion is mounted.

(Means for Solving the Problem) An object of the present invention is to solve the above problems and provide an IC socket in which contact pins can be easily mounted and can be miniaturized.

That is, a locking leg 24 is a locking portion provided on one side of the base portion 23 of the contact pin, and a plurality of connection terminals 26a, 26b provided on the opposite side to the locking leg 24 with respect to the base portion 23, This is an IC socket provided with a contact pin 14 in which the connection terminals 26a, 26b and a contact piece in the same direction are provided on the base portion 23.

(Operation) Since the contact piece 20 and the connection terminals 26a and 26b are in the same direction with respect to the base portion 23 and the locking legs 24 are in the opposite direction as described above, the mounting of the contact pin 14 on the socket body 1 is performed. Since the thin connection terminals cannot be inserted, work is easy.

Further, in the IC socket of the present invention, the contact of the IC and the connection with the external circuit can be made only by the mounting surface of the contact pin, so that the socket can be downsized.

(Embodiment) FIG. 1 is a plan view of an embodiment of the IC socket of the present invention, and FIG. 2 is a sectional view taken along line II of FIG. Although this embodiment is for an IC package with an optical sensor, it can also be used for an IC socket for a handler that automatically selects an IC package. In FIGS. 1 and 2, reference numeral 11 denotes a socket body for an IC package P provided with an IC and an optical sensor, which has an opening 12 for disposing the IC package P in the center and outer sides of four corners of the opening 12. And a tapered guide protrusion 13 for guiding the arrangement of the IC package P.
And a partition wall 15 for partitioning the contact pins 14 arranged in the insertion groove 16 and a pyramidal inclined wall 17 for irradiating an optical sensor provided in the IC package P.

The contact pin 14 is formed by punching and forming a metal plate and then plated. The contact pin 20 contacts the lead terminal R of the IC package P as shown in FIG.
An arm portion 21 that holds 20; a spring portion 22 that is connected to the arm portion 21 and the base portion 23 and that is curved to elastically press the lower surface of the terminal R of the IC package P on which the contact piece 20 is placed; and the base portion.
Two external connection terminals 26a and 26b planted on the 23 are provided. These external connection terminals 26a and 26b are 2 as described later.
Only one of the books is used, and a notch 27 is provided at each root for cutting out one unnecessary book.

The contact pin 14 is provided below the external connection terminals 26a and 26b.
Is provided with a locking leg 24, and the locking leg 24 is provided with a locking claw 25 for retaining. The locking leg 24 has a wide structure to prevent the contact pin 14 from swaying, and is short because it is not inserted as in the prior art.

Next, the assembly of the IC socket of this embodiment will be described. Insert the contact pin into the insertion groove 16 on the top of the socket body 11.
The 14 locking legs 24 are inserted, but one of the external connection terminals 26a or 26b is cut off at the notch 27 before insertion. As a result, two types of contact pins are molded.

Of the contact pins 14 cut in this way, the contact pins of 26a cut, 26b cut, 26a cut, and 26b cut are inserted in this order. At this time, the contact pin 14 is properly locked by only inserting the locking leg 24 into the insertion groove 16 by the locking action of the locking claw 25.

Although the above-mentioned embodiment is for an IC package with a photosensor, it is needless to say that it is not limited to such a type of socket and any socket of a single-sided connection type may be used.

(Effect of the Invention) As described above, since the contact leg can be shortened by shortening the locking leg, the entire IC socket can be downsized accordingly. This saves the molded substrate of the contact pin, and because it is small and short, the electrical resistance of the contact pin is small, which is advantageous in the test.

Also, when assembling the contact pin into the socket body,
Unlike the conventional case, the thin legs for external connection are not inserted into the socket body, so that the insertion work is easy.

Further, by cutting one external connection terminal with one type of contact pin, it is possible to use two types according to use.

[Brief description of drawings]

FIG. 1 is a plan view of an IC socket in which the contact pin of the present invention is inserted, FIG. 2 is a sectional view taken along the line II of FIG. 1, FIG. 3 is a side view of the contact pin, and FIG. 4 is an IC package. FIG. 5 is a side view (partial cross section) of an example of a conventional IC socket. 11: Socket body, 12: Opening part, 13: Guide protrusion, 14:
Contact pin, 15: partition wall, 16: insertion groove, 20: contact piece, 21: arm part, 22: spring part, 23: base part, 24: locking leg (locking part), 25: locking claw, 26a , 26b: External connection terminal, 27: Notch.

Claims (1)

[Scope of utility model registration request] 1. A contact piece for contacting a lead terminal of a mounted IC package, a spring portion for pressing the contact piece to the lead terminal, and a locking portion for inserting and locking the socket body. In an IC socket provided with a contact pin provided with a connection terminal for external connection, the contact pin has a locking portion provided on a lower side of a base thereof, and a contact portion of the base opposite to the locking portion. An IC socket, characterized in that a plurality of connection terminals, which are separated from each other and integrally formed, are provided.