JPH048633Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to the structure of an IC socket used for mounting or testing an IC package.

[Problems to be solved by conventional techniques and ideas]

Conventionally, this type of IC socket, for example,
Various IC packages P shown in Figures to Figures 12,
There is one that accommodates P ₁ and P ₂ . Among these, the IC socket 21 for the flat type IC package has a contact pin 29 that contacts the lead terminal R of the IC package P as shown in FIG.
The slit 2 of the socket body 21 corresponds to the position of
It is inserted in 7. Also, Figures 11 and 12
In the IC socket 21' for the dip-type IC package P' shown in the figure, a contact pin 29' into which the lead terminal R' of the IC package P' is inserted is arranged in the socket body 21' set on the printed circuit board B. It is set up.

However, these IC sockets 21, 2
The contact pins 29, 29' of 1' require plating after molding, making their manufacture cumbersome.
Further, the socket bodies 21, 21' require slits 27 for accommodating the contact pins 29, 29' separately, which makes the structure complicated and the work of inserting the contact pins 29, 29' into the slits 27 is complicated. It was hot.

In view of these circumstances, it is an object of the present invention to provide an IC socket whose socket body is simple in structure and easy to manufacture, and which facilitates the work of accommodating a connector in the socket body.

[Means and actions for solving problems]

The IC socket according to the present invention includes a conductive layer formed continuously corresponding to the lead terminals so that the connector of the lead terminals contacts each lead terminal of the IC package, and a conductive layer connected to the conductive layer and the substrate. It has conductive pins planted in it. The pins are set apart from each other at regular intervals by being planted on the substrate. Therefore, the socket main body does not require a slit for this purpose, and the work of inserting the socket into the slit can be eliminated. Note that since this pin has a simple rod shape, it can be easily inserted into an insertion hole of a printed circuit board, for example, and can be quickly attached to the printed circuit board.

〔Example〕

A first embodiment of the IC socket according to the present invention will be described below with reference to FIGS. 1 to 6. In the figure,
1 is a socket body fixed on a printed circuit board B on which a circuit for connection testing is formed; 2 is a corner window for accommodating an IC package P; 3 is a mounting part provided at each corner of the corner window 2; 4 is a recess for attaching the socket body 1 to the printed circuit board B with a bolt 5 through a bolt hole 4a. Reference numeral 6 denotes a connector placed on the above-mentioned mounting portion 3 (see FIG. 3), and as shown in FIGS. A conductive layer 8 is printed at a predetermined pitch corresponding to the conductive layer 8, a mounting hole 7a is formed on the substrate 7 for each conductive layer 8 and the entire structure is staggered, and the conductive layer 8 is planted through the mounting hole 7a.
It is comprised of a conductive pin 9 whose upper end is connected to the conductive layer 8 and whose lower end is inserted into the insertion hole _B1 of the printed circuit board B. When this connector 6 is used for mounting, the recess 7b is inserted after the pin 9 is inserted.
It is fixed to the board 7 by soldering. Further, as shown in FIG. 5, the manufacturing process is carried out by cutting out cutting notches 7c formed on the side surface of the substrate 7 so as to match the number of lead terminals R of various IC packages P. The pins 9a and 9b are inserted into the through holes 3a formed in the mounting section 3.
(See Figure 1)
This allows the connector 6 to connect to the socket body 1.
positioning is performed. Reference numeral 10 denotes a presser cover pivotally attached to one end of the socket body 1 via a shaft 11, and 12 is attached to the presser cover 10, and when the hook 12a engages with the hook 1a of the socket body 1, a lock lever 13 shown in FIG. 1 for holding the presser cover 10 in the closed position; a support base 13 shown in FIG. 1 on which a pad (to be described later) is fitted into a mounting hole 13a having a U-shaped cross section formed at its tip and fixed; Reference numeral 14 shown in FIGS. 1 and 2 includes a base 15 made of an elastic material such as rubber, a flexible printed film 16 attached to the base 15, and a conductive layer 8 of the connector 6 when the presser cover 10 is closed. It is a pad consisting of a conductive layer 17 formed on the printed film 16 so as to be in contact with it, and insulating layers 18 formed alternately with the conductive layer 17. This pad 14 is formed so that the pitch of the conductive layer 8 is shorter than the pitch of the lead terminals R, so that it can be used in various IC packages P.

The IC socket according to the present invention is constructed as described above. Therefore, the socket body 1 does not require a large number of slits as in the prior art, and is extremely simple in structure and easy to manufacture. Here, connector 6
can easily be provided with the desired number of conductive layers 8 and pins 9 by cutting them off at the positions of the notches 7c provided in accordance with the various lead terminals R having different numbers of terminals as shown in FIG. It will be completed. The connector 6 is attached to the socket body 1 by inserting the pins 9a and 9b of the connector 6 into the through holes 3a of the mounting portion 3, and then the pins 9 are inserted into the insertion holes formed on the printed circuit board B. hole
By inserting into B ₁ , the socket body 1 is positioned with respect to the printed circuit board B. or,
The socket body 1 is fixed to the printed circuit board B by soldering S ₂ (see FIG. 6) to the base of the pin 9 protruding from the back surface of the printed circuit board B, and the socket body 1 is formed on the printed circuit board B via the pin 9. The connection between the printed circuit (not shown) and each conductive layer 8 is ensured.

Next, in actual use, the IC package P is connected to the IC socket thus installed on the printed circuit board B.
The package P is inserted into the socket body 1.
The lead terminals R are accurately placed on the corresponding conductive layer 8 by being guided by the square window 2 of the lead terminal R. After this, when the presser cover 10 is closed and the lever 10 is held in the closed position by the lock lever 12, the pad 14 presses the lead terminal R with an appropriate force due to the elasticity of the base body 15. in this case,
Since the lead terminal R and the conductive layer 8 of the connector 6 are connected in parallel by direct contact between the two and indirect connection via the conductive layer 17 of the part 14, a good connection state is ensured.

Since the pin 9 provided on the connector 6 is inserted into the insertion hole _B1 of the printed circuit board B, the connection work between the two by soldering etc. can be easily performed and the electrical connection is also reliable. be. or,
Since the lead terminals R and the printed circuit board B are connected via the connector 6 and the pad 14 without using conventional contact pins, the work of arranging the connector 6 in the socket body 1 is easily performed.

FIG. 7 shows a second embodiment. In this example, the pad 14 is connected to the conductive layer 8 of the connector 6.
The support base 13 presses the lead terminal R placed on the pad 14 so as to be in contact with each conductive layer 17 and placed in the square window 2 in advance so that the conductive layers 17 of the lead terminals are aligned with each other. It's becoming like that. In this case as well, a reliable connection is made between the lead terminal R and the printed circuit board B side via the pad 14 and the pin 9, and the work of arranging the connector such as the pad 14 becomes easy.

[Effect of idea]

As described above, according to the present invention, the structure of the socket body can be simplified, making it easy to manufacture.
At the same time, assembly into the socket body becomes easy. or,
There are advantages such as ease of mounting the socket body onto the printed circuit board.

[Brief explanation of drawings]

1 to 6 relate to the first embodiment of the IC socket of the present invention, FIG. 1 is an exploded perspective view showing the overall structure, FIG. 2 is a perspective view of the pad, and FIG. 3 is a connector. A partial perspective view of the assembled socket main body, Fig. 4 is a longitudinal sectional view of the connecting member, Fig. 5 is a perspective view of the base body for forming the connector, and Fig. 6 is a longitudinal sectional view of the proposed IC socket housing the IC package. figure,
FIG. 7 is a vertical sectional view of an IC socket according to the second embodiment, FIGS. 8 to 12 are related to conventional IC sockets, and FIG. 8 is an IC socket for a flat type IC package.
9 and 10 are perspective views showing a flat type IC package, Figure 11 is a vertical sectional view of an IC socket that accommodates a dip type IC package, and Figure 12 is for a dip type IC package. FIG. 2 is a perspective view showing an example of an IC socket set on a printed circuit board. DESCRIPTION OF SYMBOLS 1... Socket body, 2... Square window, 3... Placement part, 4... Recessed part, 6... Connector, 7... Board,
8... Conductive layer, 9... Pin, 10... Presser cover, 12... Lock lever, 13... Support stand, 1
4... Pad, 15... Base, 16... Printed film, 17... Conductive layer, 18... Insulating layer, B... Printed circuit board, P... IC package, R... Lead terminal, S ₁ , S ₂ ...Soldering.

Claims (1)

[Scope of utility model registration request] In an IC socket that includes a socket body that accommodates an IC package and a connector that contacts the lead terminals of the accommodated IC package, the connector is mounted on a board separate from the socket body and corresponds to each of the lead terminals. The presser cover screwed onto the socket body has a conductive layer integrally formed with the substrate and a conductive pin implanted in the substrate and connected to the conductive layer. An IC socket comprising a part provided with a conductive layer and an insulating layer, and having a structure in which when the presser cover is closed, the conductive layer of the part presses against the contact portion between the lead terminal and the conductive layer of the connector.