JPH0537437Y2 - - Google Patents

Description

[Detailed explanation of the idea] (Industrial application field) The present invention relates to an IC socket.

(Prior Art and its Problems) Conventionally, a socket for IC testing as shown in a sectional view in FIG. 4 has been proposed. In such an IC socket, a plurality of probes 2 are installed in a socket body 1 at regular intervals. Further, a floating plate 4 is provided above the socket main body 1, through which a probe 2 is inserted, and which is positioned by a guide pin 3. The floating plate 4 can slide vertically while its lateral position is restricted by the guide pin 3, and is normally pressed against the head 3a of the guide pin 3 by a spring 5. Further, a recess 4a for positioning the IC 6 is provided on the upper surface of the floating plate 4.

This IC socket is made by placing the IC 6 in the recess 4a of the floating plate 4, placing the heat dissipation plate 7 above it, and pressing both ends with the presser members 8.
The structure is such that the connection terminal of the IC 6 is brought into contact with the contact end of the probe 2.

An IC socket with such a structure is installed on the circuit board 11.
When mounting on the circuit board 11, insert the entire lower connecting end of the probe 2 into the hole 12 of the circuit board 11, pass the screw 14 through the through hole 13a of the fixing leg 13, and fix it to the circuit board 11. Solder the connection end of probe 2 to the circuit.

However, in this case, the probe 2 is
Since the spacing is the same as that of the connecting terminals of In order to connect the IC to the circuit board 11, the holes 12 in the circuit board 11 must also have the same spacing between the terminals of the IC. Therefore, the circuit board 11
The printed pattern near the hole 12 must be extremely fine, and the patterns of the round parts for soldering around the hole 12 may also be connected to each other, making production difficult. There was a problem.

The present invention solves the above-mentioned problems and creates a pattern that is easy to manufacture without making the pattern around the hole 12 of the circuit board 11 finer and preventing the patterns from connecting with each other. The purpose is to provide an IC socket that can be used even in

(Means for Solving the Problem) In order to achieve the above-mentioned object, the present invention has an arrangement in which the contact ends at the upper end of the probe are arranged at the same spacing as the terminals of the IC 6 to be mounted, and the contact ends are connected to the circuit board 11 at the lower end. Some or all of the ends are arranged at intervals larger than the upper contact ends, and the upper contact end and the lower connection end of the probe are bent and connected in the middle between the upper and lower surfaces of the socket body. It is something.

The bent portions include the shortened probe 21 that has no connecting end at the lower end of the probe, the lead piece 22 that has no contact end at the upper end, and the connecting piece 23 that connects the shortened probe 21 and the lead piece 22. Alternatively, the probe may be bent at the middle part of the probe, and the upper and lower portions of the bent part may be formed in parallel to each other.

(Function) When mounting on the circuit board 11 as described above, since the pattern of the circuit board 11 is not arranged in a fine arrangement like the terminals of the IC 6, connection is extremely easy.

(Example) Fig. 1 is a sectional view of the main part showing the first embodiment of the present invention, and Fig. 2 is an enlarged perspective view of the probe. , the explanation is omitted.

The probe portion is substantially the same as the conventional probe 2, and has shortened probes 21 which do not have a connection end connected to the circuit board 11, that is, do not protrude from the mounting surface M of the socket body 1, and are arranged at the same spacing as the terminals 6a of the IC 6. ing. In addition, even if there is no contact end that contacts the terminal 6a of the IC 6, that is, the floating plate 4 is pushed down to the lowest end,
Lead pieces 22 whose upper ends do not protrude above the upper surface of the floating plate 4 are arranged parallel to the shortening probe 21 and spaced apart from each other as appropriate. Of these shortened probes 21 and lead pieces 22, the corresponding one
Connection pieces 23 are connected to each other by soldering or the like to provide electrical continuity between the pairs.

Note that the above-mentioned shortened probe 21 and lead piece 22
is fixed on the lower surface of the socket body 1 with an adhesive 25, and the connecting piece 23 is attached to the adhesive 25.
It is embedded and fixed on the bottom surface of the , or flush with the bottom surface.

In addition, if it is not necessary to arrange the probe 2 so that it contacts all the terminals of the IC 6, it is necessary to arrange the probe 2 only at the necessary places, so the adjacent probe 2
The conventional probe 2 may be used in areas where the distance is large, or the bent probe of the present invention may be used only in adjacent areas where the distance is small.

FIG. 3 shows a second embodiment of the present invention, which is a bent probe 24 that integrates the shortened probe 21, the lead piece 22 and the connecting piece 23, and connects the upper contact end side and the lower side of this bent part. The ends are bent so that they are parallel to each other. In this embodiment, the bent portion of the probe is made to be in a fixed position with the adhesive 25 of FIG.

(Effect of the invention) When the IC socket is mounted on the circuit board 11 as described above, the pattern of the circuit board 11 does not need to be made as small as the terminal spacing of the IC 6, so manufacturing of the circuit board 11 becomes easier. Not, but
Even when mounting an IC socket, installation is easy and reliable.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of the main parts of an IC socket according to the first embodiment of the present invention, Fig. 2 is an enlarged perspective view of the probe of Fig. 1, and Fig. 3 is a perspective view of the bending probe of the second embodiment. , FIG. 4 is a sectional view of a conventional IC socket. 1...Socket body, 2...Probe, 6...
IC, 21... shortened probe, 22... lead piece,
23... Connection piece, 24... Bent probe.

Claims (1)

[Scope of claims for utility model registration] 1. Placed on the top surface of the floating plate.
An IC with multiple probes embedded in the socket body whose upper contact ends contact the IC terminals from below.
In the socket, the upper contact ends of the probes are arranged at the same spacing as the terminals of the IC to be placed, and some or all of the lower end connection ends connected to the circuit board are arranged at larger intervals than the upper contact ends. The upper contact end and the lower connecting end of the probe are bent and connected in the middle between the upper and lower surfaces of the socket body.
IC socket. 2. The bent portion is formed by a shortened probe having no connecting end at the lower end of the probe, a lead piece having no contact end at the upper end, and a connecting piece connecting between the shortened probe and the lead piece. An IC socket as described in Claim 1 of the Utility Model Registration Claim. 3. The IC socket according to claim 1, wherein the bent portion is bent at the intermediate portion of the probe, and upper and lower portions of the bent portion are parallel to each other.