JPH0197572U - - Google Patents
Info
- Publication number
- JPH0197572U JPH0197572U JP19417587U JP19417587U JPH0197572U JP H0197572 U JPH0197572 U JP H0197572U JP 19417587 U JP19417587 U JP 19417587U JP 19417587 U JP19417587 U JP 19417587U JP H0197572 U JPH0197572 U JP H0197572U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- circuit board
- ceramic green
- view
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 10
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
図面は本考案の実施例に係り、第１図はその一
実施例のセラミツク回路基板を横向きにして回路
基板に取り付けた場合の側面図、第２図はそのセ
ラミツク回路基板を縦向きにして回路基板に取り
付けた場合の斜視図、第３図ないし第５図は本実
施例のセラミツク回路基板の製造要領の説明に供
する図であり、第３図は下金型と上金型と、それ
らの間に入れられたセラミツクグリーンシートと
の断面図、第４図は第３図の金型で形成されたセ
ラミツクグリーンシートの斜視図、第５図は階段
状テーブルとそのテーブルによりチツプ回路部品
をマウントされるときのセラミツクグリーンシー
トとの側面図、第６図は他の実施例のセラミツク
回路基板の側面図である。
２…セラミツク回路基板、６…回路配線、８，
２０…回路部品。
The drawings relate to an embodiment of the present invention, and FIG. 1 is a side view of the ceramic circuit board of the embodiment installed horizontally on a circuit board, and FIG. 2 is a side view of the ceramic circuit board of the embodiment installed vertically. Figures 3 to 5, which are perspective views when attached to a board, are diagrams used to explain the manufacturing procedure of the ceramic circuit board of this embodiment. Figure 3 shows the lower mold, the upper mold, and their parts. Fig. 4 is a cross-sectional view of the ceramic green sheet inserted between the two, Fig. 4 is a perspective view of the ceramic green sheet formed with the mold shown in Fig. 3, and Fig. 5 is a stepped table and a chip circuit component mounted by the table. FIG. 6 is a side view of the ceramic circuit board of another embodiment. 2... Ceramic circuit board, 6... Circuit wiring, 8,
20...Circuit parts.
Claims (1)
形成された１枚または複数枚からなるセラミツク
グリーンシートを備え、このセラミツクグリーン
シートは波型に構成された後に焼成されて、かつ
その面上には回路部品を取り付けられていること
を特徴とするセラミツク回路基板。 The ceramic green sheet is composed of one or more ceramic green sheets on which circuit wiring, etc. are printed on at least one or both sides. A ceramic circuit board characterized by being attached with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19417587U JPH0197572U (en) | 1987-12-21 | 1987-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19417587U JPH0197572U (en) | 1987-12-21 | 1987-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197572U true JPH0197572U (en) | 1989-06-29 |
Family
ID=31484919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19417587U Pending JPH0197572U (en) | 1987-12-21 | 1987-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197572U (en) |
-
1987
- 1987-12-21 JP JP19417587U patent/JPH0197572U/ja active Pending