JPH0196008A - 溶融球状シリカ及びその製造方法 - Google Patents
溶融球状シリカ及びその製造方法Info
- Publication number
- JPH0196008A JPH0196008A JP25164087A JP25164087A JPH0196008A JP H0196008 A JPH0196008 A JP H0196008A JP 25164087 A JP25164087 A JP 25164087A JP 25164087 A JP25164087 A JP 25164087A JP H0196008 A JPH0196008 A JP H0196008A
- Authority
- JP
- Japan
- Prior art keywords
- silica
- specific surface
- surface area
- spherical silica
- fused spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25164087A JPH0196008A (ja) | 1987-10-07 | 1987-10-07 | 溶融球状シリカ及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25164087A JPH0196008A (ja) | 1987-10-07 | 1987-10-07 | 溶融球状シリカ及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0196008A true JPH0196008A (ja) | 1989-04-14 |
| JPH0466809B2 JPH0466809B2 (enExample) | 1992-10-26 |
Family
ID=17225827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25164087A Granted JPH0196008A (ja) | 1987-10-07 | 1987-10-07 | 溶融球状シリカ及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0196008A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7265167B2 (en) | 2002-11-12 | 2007-09-04 | Nitto Denko Corporation | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
| JP2013203641A (ja) * | 2012-03-29 | 2013-10-07 | Mitsubishi Materials Corp | 合成非晶質シリカ粉末及びその製造方法 |
-
1987
- 1987-10-07 JP JP25164087A patent/JPH0196008A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7265167B2 (en) | 2002-11-12 | 2007-09-04 | Nitto Denko Corporation | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
| JP2013203641A (ja) * | 2012-03-29 | 2013-10-07 | Mitsubishi Materials Corp | 合成非晶質シリカ粉末及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0466809B2 (enExample) | 1992-10-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |