JPH0195791U - - Google Patents
Info
- Publication number
- JPH0195791U JPH0195791U JP19142787U JP19142787U JPH0195791U JP H0195791 U JPH0195791 U JP H0195791U JP 19142787 U JP19142787 U JP 19142787U JP 19142787 U JP19142787 U JP 19142787U JP H0195791 U JPH0195791 U JP H0195791U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- radiator
- electrical component
- plunger
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の電気部品用放熱器の一実施例
の縦断面図、第２図はプランジヤの正面図、第３
図は本考案の使用例を示す一部の断面図である。
１……プランジヤ、１ａ……溝、１ｂ……雌ね
じ、１ｃ……通孔、１ｄ……先端面、２……Ｏリ
ング、３……シリンダ、４……熱伝導性コンパウ
ンド、１１……放熱器、１２……筐体、１３……
プリント基板、１４……発熱素子、１５……カバ
ー、１６……ねじ。
Fig. 1 is a longitudinal sectional view of one embodiment of the heat sink for electrical components of the present invention, Fig. 2 is a front view of the plunger, and Fig.
The figure is a partial sectional view showing an example of the use of the present invention. 1...Plunger, 1a...Groove, 1b...Female thread, 1c...Through hole, 1d...Tip surface, 2...O ring, 3...Cylinder, 4...Thermal conductive compound, 11...Heat radiation Container, 12... Housing, 13...
Printed circuit board, 14...heating element, 15...cover, 16...screw.
Claims (1)
筐体との間に介挿して電気部品の熱を筐体に伝熱
させる放熱器であつて、容器状をしたシリンダと
、このシリンダ内にＯリングを介して内挿された
プランジヤと、前記シリンダ、Ｏリング及びプラ
ンジヤ間に充填された熱伝導性コンパウンドとを
備え、前記プランジヤはシリンダ内で上下移動及
び傾動可能に内挿されるとともに、プランジヤ内
外を連通する通孔を開設したことを特徴とする電
気部品用放熱器。 This is a heat radiator that is inserted between a heat-generating electrical component and a casing in which the electrical component is mounted to transfer the heat of the electrical component to the casing. A plunger is inserted through a ring, and a thermally conductive compound is filled between the cylinder, the O-ring, and the plunger. A radiator for electrical components, characterized by having a through hole that communicates with the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19142787U JPH0195791U (en) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19142787U JPH0195791U (en) | 1987-12-18 | 1987-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195791U true JPH0195791U (en) | 1989-06-26 |
Family
ID=31482339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19142787U Pending JPH0195791U (en) | 1987-12-18 | 1987-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195791U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06342987A (en) * | 1993-06-01 | 1994-12-13 | Ike Denki Seisakusho:Yugen | Waterproofing structure for electric component and insert molding method for forming the same structure |
-
1987
- 1987-12-18 JP JP19142787U patent/JPH0195791U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06342987A (en) * | 1993-06-01 | 1994-12-13 | Ike Denki Seisakusho:Yugen | Waterproofing structure for electric component and insert molding method for forming the same structure |
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