JPS61205158U - - Google Patents
Info
- Publication number
- JPS61205158U JPS61205158U JP8278285U JP8278285U JPS61205158U JP S61205158 U JPS61205158 U JP S61205158U JP 8278285 U JP8278285 U JP 8278285U JP 8278285 U JP8278285 U JP 8278285U JP S61205158 U JPS61205158 U JP S61205158U
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- optical semiconductor
- peltier
- optical
- heating surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000003381 stabilizer Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
Landscapes
- Control Of Temperature (AREA)
Description
第１図および第２図は本考案の温度安定化装置
の実施例を示し、第１図はその概略側面図、第２
図はその作用を示す説明図、第３図は発光素子の
発光スペクトルの温度変化を示す特性図、第４図
および第５図は、いずれも従来の発光素子の温度
安定化装置の回路図である。
１……光回路部品、２……ペルチエ素子、２ａ
……加熱面、２ｂ……冷却面、３……制御回路、
４……基板、５……温度センサ、６……電子部品
。
1 and 2 show an embodiment of the temperature stabilizing device of the present invention, FIG. 1 is a schematic side view thereof, and FIG.
The figure is an explanatory diagram showing its effect, Figure 3 is a characteristic diagram showing temperature changes in the emission spectrum of a light emitting element, and Figures 4 and 5 are circuit diagrams of a conventional temperature stabilizing device for a light emitting element. be. 1... Optical circuit component, 2... Peltier element, 2a
... Heating surface, 2b ... Cooling surface, 3 ... Control circuit,
4... Board, 5... Temperature sensor, 6... Electronic component.
Claims (1)
素子で構成される光回路部品をペルチエ素子の加
熱面に取り付け、このペルチエ素子には該素子に
設けた温度センサの検出信号に応じて該素子に所
要の電流を供給する制御回路を接続し、該ペルチ
エ素子をその冷却面を介して熱伝導性に優れかつ
発熱する電子部品が取り付けられた基板に装着し
たことを特徴とする光半導体素子等の温度安定化
装置。 An optical semiconductor element to be stabilized in temperature or an optical circuit component composed of the element is attached to the heating surface of the Peltier element. The temperature of an optical semiconductor device, etc., characterized in that the Peltier device is connected to a control circuit that supplies a current of Stabilizer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8278285U JPS61205158U (en) | 1985-05-31 | 1985-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8278285U JPS61205158U (en) | 1985-05-31 | 1985-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61205158U true JPS61205158U (en) | 1986-12-24 |
Family
ID=30630806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8278285U Pending JPS61205158U (en) | 1985-05-31 | 1985-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61205158U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006261581A (en) * | 2005-03-18 | 2006-09-28 | Sony Corp | Multi-chip module device and multi-chip shutdown control method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54111778A (en) * | 1978-02-21 | 1979-09-01 | Mitsubishi Electric Corp | Semiconductor photo element incorporating electronic cooling and heating element |
| JPS58153387A (en) * | 1982-03-08 | 1983-09-12 | Toshiba Corp | Temperature controlling device |
-
1985
- 1985-05-31 JP JP8278285U patent/JPS61205158U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54111778A (en) * | 1978-02-21 | 1979-09-01 | Mitsubishi Electric Corp | Semiconductor photo element incorporating electronic cooling and heating element |
| JPS58153387A (en) * | 1982-03-08 | 1983-09-12 | Toshiba Corp | Temperature controlling device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006261581A (en) * | 2005-03-18 | 2006-09-28 | Sony Corp | Multi-chip module device and multi-chip shutdown control method |
| JP4600753B2 (en) * | 2005-03-18 | 2010-12-15 | ソニー株式会社 | Multichip module device and multichip shutdown control method |
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