JPH0332443U - - Google Patents
Info
- Publication number
- JPH0332443U JPH0332443U JP9190989U JP9190989U JPH0332443U JP H0332443 U JPH0332443 U JP H0332443U JP 9190989 U JP9190989 U JP 9190989U JP 9190989 U JP9190989 U JP 9190989U JP H0332443 U JPH0332443 U JP H0332443U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- power element
- thermal conductivity
- control element
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す半導体装置の
横断面図、第２図は同じくその縦断面図、第３，
４図は半導体装置の縦断面図、第５図は半導体装
置の電気回路を示す図である。
１１……電力素子、１２……制御素子、１３…
…第一回路基板、１４……第二回路基板。
FIG. 1 is a cross-sectional view of a semiconductor device showing an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view thereof, and FIG.
FIG. 4 is a longitudinal sectional view of the semiconductor device, and FIG. 5 is a diagram showing an electric circuit of the semiconductor device. 11... Power element, 12... Control element, 13...
...first circuit board, 14...second circuit board.
Claims (1)
る制御素子とが設けられ、前記電力素子が第一回
路基板に搭載され、前記制御素子が第二回路基板
に搭載され、前記第一回路基板は、高熱伝導性材
料から構成され、前記第二回路基板は、低熱伝導
性材料から構成されたことを特徴とする半導体装
置。 A power element that generates high heat and a control element that controls the power element are provided, the power element is mounted on a first circuit board, the control element is mounted on a second circuit board, and the first circuit board is mounted on a second circuit board. . A semiconductor device, characterized in that the second circuit board is made of a material with high thermal conductivity, and the second circuit board is made of a material with low thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091909U JPH0719167Y2 (en) | 1989-08-03 | 1989-08-03 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091909U JPH0719167Y2 (en) | 1989-08-03 | 1989-08-03 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0332443U true JPH0332443U (en) | 1991-03-29 |
| JPH0719167Y2 JPH0719167Y2 (en) | 1995-05-01 |
Family
ID=31641368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989091909U Expired - Lifetime JPH0719167Y2 (en) | 1989-08-03 | 1989-08-03 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719167Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02291160A (en) * | 1989-04-28 | 1990-11-30 | Mitsubishi Electric Corp | Semiconductor device |
-
1989
- 1989-08-03 JP JP1989091909U patent/JPH0719167Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02291160A (en) * | 1989-04-28 | 1990-11-30 | Mitsubishi Electric Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719167Y2 (en) | 1995-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |