JPH03116089U - - Google Patents
Info
- Publication number
- JPH03116089U JPH03116089U JP2541290U JP2541290U JPH03116089U JP H03116089 U JPH03116089 U JP H03116089U JP 2541290 U JP2541290 U JP 2541290U JP 2541290 U JP2541290 U JP 2541290U JP H03116089 U JPH03116089 U JP H03116089U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor circuit
- wiring board
- printed wiring
- view
- control element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例によるサーボアン
プ装置の断面側面図、第２図は第１図の一部の詳
細断面図、第３図はこの考案の一実施例によるサ
ーボアンプの外観を示す斜視図、第４図は従来の
サーボアンプ装置の側面図、第５図は従来のサー
ボアンプ装置の外観を示す斜視図、第６図は従来
の実施例を示す正面図である。
図において、１……トランジスタモジユール、
２……ダイオードモジユール、３……主回路素子
、４……制御素子、５……制御素子用放熱フイン
、７……放熱フイン、１２……ケース、１３……
カバー、１４……放熱フイン、１５……リキツド
ヒートシンク、１６……熱伝導性ラバー、１７…
…熱伝導性シリコングリスである。なお、図中、
同一符号は同一、または相当部分を示す。
Fig. 1 is a cross-sectional side view of a servo amplifier device according to an embodiment of this invention, Fig. 2 is a detailed sectional view of a part of Fig. 1, and Fig. 3 is an external view of a servo amplifier according to an embodiment of this invention. FIG. 4 is a side view of a conventional servo amplifier device, FIG. 5 is a perspective view of the appearance of a conventional servo amplifier device, and FIG. 6 is a front view of a conventional embodiment. In the figure, 1...transistor module,
2... Diode module, 3... Main circuit element, 4... Control element, 5... Heat dissipation fin for control element, 7... Heat dissipation fin, 12... Case, 13...
Cover, 14... Heat dissipation fin, 15... Liquid heat sink, 16... Thermal conductive rubber, 17...
...It is thermally conductive silicone grease. In addition, in the figure,
The same reference numerals indicate the same or equivalent parts.
Claims (1)
路の動作を制御する制御素子を配設したプリント
配線板とを備えた半導体回路において、上記半導
体回路及び上記プリント配線板をケースで覆い外
気から遮断することを特徴とする半導体回路装置
。 In a semiconductor circuit comprising a semiconductor circuit constituting a main circuit and a printed wiring board on which a control element for controlling the operation of the semiconductor circuit is arranged, the semiconductor circuit and the printed wiring board are covered with a case and isolated from the outside air. A semiconductor circuit device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2541290U JPH03116089U (en) | 1990-03-13 | 1990-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2541290U JPH03116089U (en) | 1990-03-13 | 1990-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03116089U true JPH03116089U (en) | 1991-12-02 |
Family
ID=31528347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2541290U Pending JPH03116089U (en) | 1990-03-13 | 1990-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116089U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009099155A (en) * | 2008-12-02 | 2009-05-07 | Top:Kk | Product sample advertisement sheet for vending machine |
-
1990
- 1990-03-13 JP JP2541290U patent/JPH03116089U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009099155A (en) * | 2008-12-02 | 2009-05-07 | Top:Kk | Product sample advertisement sheet for vending machine |