JPS6387888U - - Google Patents

Info

Publication number
JPS6387888U
JPS6387888U JP18221586U JP18221586U JPS6387888U JP S6387888 U JPS6387888 U JP S6387888U JP 18221586 U JP18221586 U JP 18221586U JP 18221586 U JP18221586 U JP 18221586U JP S6387888 U JPS6387888 U JP S6387888U
Authority
JP
Japan
Prior art keywords
electronic component
sensitive element
holding section
heat sink
heat sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18221586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18221586U priority Critical patent/JPS6387888U/ja
Publication of JPS6387888U publication Critical patent/JPS6387888U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す側面図、第2
図は同上の斜視図、第3図は本考案の異なる実施
例を示す側面図、第4図はその取付状態を示す斜
視図、第5図ないし第7図は本考案に対比される
従来例を示す斜視図である。 1……電子部品、2……放熱板、3……電子部
品の前面、4……感熱素子、5……接着剤、6…
…ビニルチユーブ、7……感熱素子保持部、8…
…電子部品取付面、9……ねじ、10……つめ部
、11……印刷配線板。
Figure 1 is a side view showing one embodiment of the present invention;
The figure is a perspective view of the same as the above, Figure 3 is a side view showing a different embodiment of the present invention, Figure 4 is a perspective view showing its installation state, and Figures 5 to 7 are conventional examples compared to the present invention. FIG. DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Heat sink, 3... Front surface of electronic component, 4... Heat sensitive element, 5... Adhesive, 6...
...Vinyl tube, 7...Thermosensitive element holding part, 8...
...Electronic component mounting surface, 9...Screw, 10...Claw portion, 11...Printed wiring board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品が固着される放熱板に感熱素子保持部
を設け、該保持部を介して感熱素子を電子部品に
近接して固定したことを特徴とする放熱板構造。
A heat sink structure characterized in that a heat sink to which an electronic component is fixed is provided with a heat sensitive element holding section, and the heat sensitive element is fixed close to the electronic component via the holding section.
JP18221586U 1986-11-26 1986-11-26 Pending JPS6387888U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18221586U JPS6387888U (en) 1986-11-26 1986-11-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18221586U JPS6387888U (en) 1986-11-26 1986-11-26

Publications (1)

Publication Number Publication Date
JPS6387888U true JPS6387888U (en) 1988-06-08

Family

ID=31127805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18221586U Pending JPS6387888U (en) 1986-11-26 1986-11-26

Country Status (1)

Country Link
JP (1) JPS6387888U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003319638A (en) * 2002-04-18 2003-11-07 Nissan Motor Co Ltd Circuit for driving gate of semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003319638A (en) * 2002-04-18 2003-11-07 Nissan Motor Co Ltd Circuit for driving gate of semiconductor element

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