JPS6387888U - - Google Patents
Info
- Publication number
- JPS6387888U JPS6387888U JP18221586U JP18221586U JPS6387888U JP S6387888 U JPS6387888 U JP S6387888U JP 18221586 U JP18221586 U JP 18221586U JP 18221586 U JP18221586 U JP 18221586U JP S6387888 U JPS6387888 U JP S6387888U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- sensitive element
- holding section
- heat sink
- heat sensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す側面図、第２
図は同上の斜視図、第３図は本考案の異なる実施
例を示す側面図、第４図はその取付状態を示す斜
視図、第５図ないし第７図は本考案に対比される
従来例を示す斜視図である。
１……電子部品、２……放熱板、３……電子部
品の前面、４……感熱素子、５……接着剤、６…
…ビニルチユーブ、７……感熱素子保持部、８…
…電子部品取付面、９……ねじ、１０……つめ部
、１１……印刷配線板。
Figure 1 is a side view showing one embodiment of the present invention;
The figure is a perspective view of the same as the above, Figure 3 is a side view showing a different embodiment of the present invention, Figure 4 is a perspective view showing its installation state, and Figures 5 to 7 are conventional examples compared to the present invention. FIG. DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Heat sink, 3... Front surface of electronic component, 4... Heat sensitive element, 5... Adhesive, 6...
...Vinyl tube, 7...Thermosensitive element holding part, 8...
...Electronic component mounting surface, 9...Screw, 10...Claw portion, 11...Printed wiring board.
Claims (1)
を設け、該保持部を介して感熱素子を電子部品に
近接して固定したことを特徴とする放熱板構造。 A heat sink structure characterized in that a heat sink to which an electronic component is fixed is provided with a heat sensitive element holding section, and the heat sensitive element is fixed close to the electronic component via the holding section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18221586U JPS6387888U (en) | 1986-11-26 | 1986-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18221586U JPS6387888U (en) | 1986-11-26 | 1986-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6387888U true JPS6387888U (en) | 1988-06-08 |
Family
ID=31127805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18221586U Pending JPS6387888U (en) | 1986-11-26 | 1986-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6387888U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003319638A (en) * | 2002-04-18 | 2003-11-07 | Nissan Motor Co Ltd | Circuit for driving gate of semiconductor element |
-
1986
- 1986-11-26 JP JP18221586U patent/JPS6387888U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003319638A (en) * | 2002-04-18 | 2003-11-07 | Nissan Motor Co Ltd | Circuit for driving gate of semiconductor element |