JPH0195735U - - Google Patents
Info
- Publication number
- JPH0195735U JPH0195735U JP19235287U JP19235287U JPH0195735U JP H0195735 U JPH0195735 U JP H0195735U JP 19235287 U JP19235287 U JP 19235287U JP 19235287 U JP19235287 U JP 19235287U JP H0195735 U JPH0195735 U JP H0195735U
- Authority
- JP
- Japan
- Prior art keywords
- blocks
- dovetail groove
- seal
- ring
- chase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案に係る半導体装置の樹脂封止装
置を示す断面図、第２図は一実施例の部分拡大図
、第３図は従来の半導体装置の樹脂封止装置を示
す断面図、第４図はその下側の型板を示す平面図
である。図中、２３，２４……定盤、２５，２６
……キヤビテイ、２７，２８……チエイスブロツ
ク、２９，３０……シールブロツク、３１……環
状蟻溝、３２……シールリング。なお、各図中同
一符号は同一又は相当部分を示す。
FIG. 1 is a sectional view showing a resin sealing device for a semiconductor device according to the present invention, FIG. 2 is a partially enlarged view of one embodiment, and FIG. 3 is a sectional view showing a conventional resin sealing device for a semiconductor device. FIG. 4 is a plan view showing the lower template. In the figure, 23, 24...Surface plate, 25, 26
... Cavity, 27, 28 ... Chase block, 29, 30 ... Seal block, 31 ... Annular dovetail groove, 32 ... Seal ring. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
ジを形成するキヤビテイを有する上、下２つのチ
エイスブロツクと、これら両チエイスブロツクの
周囲に各々配設され、かつ前記両定盤に各々取り
付けられた環状のシールブロツクとを備え、これ
ら両シールブロツクの接合面の一方の接合面に環
状の蟻溝を形成し、この蟻溝にシールリングを介
装したことを特徴とする半導体装置の樹脂封止装
置。 An upper and a lower two chase blocks each having a cavity fixed to the surface plate and forming a package for sealing a semiconductor chip, each disposed around both of these chase blocks, and each attached to both of the surface plates. and an annular seal block, a ring-shaped dovetail groove is formed on one of the joint surfaces of the two seal blocks, and a seal ring is interposed in the dovetail groove. Stop device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19235287U JPH0195735U (en) | 1987-12-17 | 1987-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19235287U JPH0195735U (en) | 1987-12-17 | 1987-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195735U true JPH0195735U (en) | 1989-06-26 |
Family
ID=31483214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19235287U Pending JPH0195735U (en) | 1987-12-17 | 1987-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195735U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843900A (en) * | 1981-09-08 | 1983-03-14 | 三菱電機株式会社 | Control system of orbit of triaxial satellite |
| JPS5967031A (en) * | 1982-10-08 | 1984-04-16 | Hitachi Ltd | Molding machine |
| JPS6063122A (en) * | 1983-09-16 | 1985-04-11 | Michio Osada | Method and mold device for sealing semiconductor device in resin |
-
1987
- 1987-12-17 JP JP19235287U patent/JPH0195735U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843900A (en) * | 1981-09-08 | 1983-03-14 | 三菱電機株式会社 | Control system of orbit of triaxial satellite |
| JPS5967031A (en) * | 1982-10-08 | 1984-04-16 | Hitachi Ltd | Molding machine |
| JPS6063122A (en) * | 1983-09-16 | 1985-04-11 | Michio Osada | Method and mold device for sealing semiconductor device in resin |