JPH0194691A - プリント回路基板の製造方法 - Google Patents
プリント回路基板の製造方法Info
- Publication number
- JPH0194691A JPH0194691A JP25222887A JP25222887A JPH0194691A JP H0194691 A JPH0194691 A JP H0194691A JP 25222887 A JP25222887 A JP 25222887A JP 25222887 A JP25222887 A JP 25222887A JP H0194691 A JPH0194691 A JP H0194691A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit
- cavity
- resin
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 238000001746 injection moulding Methods 0.000 claims abstract description 19
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 8
- 239000000057 synthetic resin Substances 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920006269 PPS film Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25222887A JPH0194691A (ja) | 1987-10-06 | 1987-10-06 | プリント回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25222887A JPH0194691A (ja) | 1987-10-06 | 1987-10-06 | プリント回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0194691A true JPH0194691A (ja) | 1989-04-13 |
| JPH054836B2 JPH054836B2 (enrdf_load_stackoverflow) | 1993-01-20 |
Family
ID=17234298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25222887A Granted JPH0194691A (ja) | 1987-10-06 | 1987-10-06 | プリント回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0194691A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206989A (ja) * | 1990-11-30 | 1992-07-28 | Nitto Boseki Co Ltd | プリント配線体 |
| JPH11307884A (ja) * | 1998-04-22 | 1999-11-05 | Shin Etsu Polymer Co Ltd | 一体型プリント配線基板成形体 |
| JP2006190748A (ja) * | 2005-01-05 | 2006-07-20 | Kobe Steel Ltd | パターン電極を備えた多孔質誘電体基板の製造方法 |
-
1987
- 1987-10-06 JP JP25222887A patent/JPH0194691A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206989A (ja) * | 1990-11-30 | 1992-07-28 | Nitto Boseki Co Ltd | プリント配線体 |
| JPH11307884A (ja) * | 1998-04-22 | 1999-11-05 | Shin Etsu Polymer Co Ltd | 一体型プリント配線基板成形体 |
| JP2006190748A (ja) * | 2005-01-05 | 2006-07-20 | Kobe Steel Ltd | パターン電極を備えた多孔質誘電体基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH054836B2 (enrdf_load_stackoverflow) | 1993-01-20 |
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