JPH0193135A - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法

Info

Publication number
JPH0193135A
JPH0193135A JP62250980A JP25098087A JPH0193135A JP H0193135 A JPH0193135 A JP H0193135A JP 62250980 A JP62250980 A JP 62250980A JP 25098087 A JP25098087 A JP 25098087A JP H0193135 A JPH0193135 A JP H0193135A
Authority
JP
Japan
Prior art keywords
bonding
reference point
stage
wire bonding
position coordinates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62250980A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0482182B2 (enExample
Inventor
Takeo Sato
武雄 佐藤
Kazuo Numajiri
一男 沼尻
Kimio Yasuno
公朗 安野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP62250980A priority Critical patent/JPH0193135A/ja
Publication of JPH0193135A publication Critical patent/JPH0193135A/ja
Publication of JPH0482182B2 publication Critical patent/JPH0482182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP62250980A 1987-10-05 1987-10-05 ワイヤボンディング方法 Granted JPH0193135A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62250980A JPH0193135A (ja) 1987-10-05 1987-10-05 ワイヤボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62250980A JPH0193135A (ja) 1987-10-05 1987-10-05 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JPH0193135A true JPH0193135A (ja) 1989-04-12
JPH0482182B2 JPH0482182B2 (enExample) 1992-12-25

Family

ID=17215884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62250980A Granted JPH0193135A (ja) 1987-10-05 1987-10-05 ワイヤボンディング方法

Country Status (1)

Country Link
JP (1) JPH0193135A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7108167B2 (en) 2003-04-14 2006-09-19 Esec Trading Sa Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7108167B2 (en) 2003-04-14 2006-09-19 Esec Trading Sa Wire bonder with a device for determining the vectorial distance between the capillary and the image recognition system and method

Also Published As

Publication number Publication date
JPH0482182B2 (enExample) 1992-12-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees