JPH0189778U - - Google Patents
Info
- Publication number
- JPH0189778U JPH0189778U JP18611187U JP18611187U JPH0189778U JP H0189778 U JPH0189778 U JP H0189778U JP 18611187 U JP18611187 U JP 18611187U JP 18611187 U JP18611187 U JP 18611187U JP H0189778 U JPH0189778 U JP H0189778U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- signal pattern
- wiring board
- radio waves
- waves radiated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Description
第1図はこの考案の一実施例を示す図、第2図
は従来の積層プリント配線板の構成を示す斜視図
。
1は導電体層、2は絶縁層、3はそれぞれ信号
パターン層、4は電源層、5はグランド層、丸穴
は7。なお、各図中同一符号は同一又は相当部分
を示すものとする。
FIG. 1 is a diagram showing an embodiment of this invention, and FIG. 2 is a perspective view showing the structure of a conventional laminated printed wiring board. 1 is a conductive layer, 2 is an insulating layer, 3 is a signal pattern layer, 4 is a power layer, 5 is a ground layer, and the round hole is 7. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
層された積層プリント配線板において、 信号パターン層の両側に絶縁体層を介して導電
体層を設け、 上記信号パターン層上の信号パターンからの放
射電波を上記導電体層でシールドすることを特徴
とする積層プリント配線板。 (2) 信号パターンからの放射電波をシールドす
る導電体層は、放射電波の波長の1/10以下の
直径の穴を有することを特徴とする実用新案登録
請求の範囲第1項記載の積層プリント配線板。[Scope of Claim for Utility Model Registration] (1) In a laminated printed wiring board in which a ground layer, a power supply layer, and a signal pattern layer are laminated, a conductor layer is provided on both sides of the signal pattern layer with an insulating layer interposed therebetween, and the above-mentioned signal A laminated printed wiring board characterized in that radio waves radiated from a signal pattern on a pattern layer are shielded by the conductor layer. (2) The laminate print according to claim 1 of the utility model registration claim, wherein the conductor layer that shields the radio waves radiated from the signal pattern has holes with a diameter of 1/10 or less of the wavelength of the radio waves radiated. wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18611187U JPH0189778U (en) | 1987-12-07 | 1987-12-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18611187U JPH0189778U (en) | 1987-12-07 | 1987-12-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0189778U true JPH0189778U (en) | 1989-06-13 |
Family
ID=31477358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18611187U Pending JPH0189778U (en) | 1987-12-07 | 1987-12-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0189778U (en) |
-
1987
- 1987-12-07 JP JP18611187U patent/JPH0189778U/ja active Pending
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