JPS6423598A - Multilayer circuit board - Google Patents

Abstract

PURPOSE:To relatively enhance the characteristic impedance of wiring conductors for signals and to reduce the irregularity by laminating one or both of a signal layer section, a ground layer section and a power supply layer section through an insulating layer section, and regularly arranging a plurality of component attaching through holes which penetrates the layer sections in a matrix disposition. CONSTITUTION:A power supply layer section 11 is disposed at the center, a ground layer 13 of two layers are laminated above and below the section 11 through an insulating layer section 15, and a signal layer section 17 of two layers are laminated above and below the section 13 through the section 15. Further, the section 15 is also provided above and below the section 17, and a conductor 19 is disposed at a predetermined pattern on the section 15 covering the section 17. The sections 11, 13, 17, 15 thus laminated are penetrated in the thicknesswise direction. A plurality of component attaching through holes 21 are formed, and the inner periphery is covered with a conductor 23. Both the ends of the conductor 23 are formed with a through hole land conductors 31 on the section 15 disposed with the conductor 19.