JPH0184434U - - Google Patents

Info

Publication number
JPH0184434U
JPH0184434U JP1987181716U JP18171687U JPH0184434U JP H0184434 U JPH0184434 U JP H0184434U JP 1987181716 U JP1987181716 U JP 1987181716U JP 18171687 U JP18171687 U JP 18171687U JP H0184434 U JPH0184434 U JP H0184434U
Authority
JP
Japan
Prior art keywords
substrate
tunnel portion
transfer device
mounting member
cassette
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987181716U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0617295Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987181716U priority Critical patent/JPH0617295Y2/ja
Priority to US07/275,525 priority patent/US4923054A/en
Publication of JPH0184434U publication Critical patent/JPH0184434U/ja
Application granted granted Critical
Publication of JPH0617295Y2 publication Critical patent/JPH0617295Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Pile Receivers (AREA)
  • Specific Conveyance Elements (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP1987181716U 1987-11-27 1987-11-27 基板受け渡し装置 Expired - Lifetime JPH0617295Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1987181716U JPH0617295Y2 (ja) 1987-11-27 1987-11-27 基板受け渡し装置
US07/275,525 US4923054A (en) 1987-11-27 1988-11-22 Wafer transfer apparatus having an improved wafer transfer portion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987181716U JPH0617295Y2 (ja) 1987-11-27 1987-11-27 基板受け渡し装置

Publications (2)

Publication Number Publication Date
JPH0184434U true JPH0184434U (US06826419-20041130-M00005.png) 1989-06-05
JPH0617295Y2 JPH0617295Y2 (ja) 1994-05-02

Family

ID=16105615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987181716U Expired - Lifetime JPH0617295Y2 (ja) 1987-11-27 1987-11-27 基板受け渡し装置

Country Status (2)

Country Link
US (1) US4923054A (US06826419-20041130-M00005.png)
JP (1) JPH0617295Y2 (US06826419-20041130-M00005.png)

Families Citing this family (52)

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Publication number Priority date Publication date Assignee Title
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US5168887A (en) * 1990-05-18 1992-12-08 Semitool, Inc. Single wafer processor apparatus
US5168886A (en) * 1988-05-25 1992-12-08 Semitool, Inc. Single wafer processor
US5230743A (en) * 1988-05-25 1993-07-27 Semitool, Inc. Method for single wafer processing in which a semiconductor wafer is contacted with a fluid
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
DE4103479C2 (de) * 1991-02-06 1995-04-20 Tetra Pak Gmbh Vorrichtung zum Verstellen des Aufnahmevolumens eines Gutträgers
JPH04269139A (ja) * 1991-02-19 1992-09-25 Sony Corp ワーク保持装置
US5160567A (en) * 1991-04-15 1992-11-03 Allied-Signal Inc. System and method for manufacturing copper clad glass epoxy laminates
JP2947380B2 (ja) * 1992-01-22 1999-09-13 東京応化工業株式会社 プラズマ処理装置
JP2571754Y2 (ja) * 1992-04-14 1998-05-18 株式会社ヒロテック 把持具交換装置
US5404894A (en) * 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
US5387067A (en) * 1993-01-14 1995-02-07 Applied Materials, Inc. Direct load/unload semiconductor wafer cassette apparatus and transfer system
US5745946A (en) * 1994-07-15 1998-05-05 Ontrak Systems, Inc. Substrate processing system
US5762084A (en) * 1994-07-15 1998-06-09 Ontrak Systems, Inc. Megasonic bath
US5548505A (en) * 1994-07-15 1996-08-20 Oktrak Systems, Inc. Scrubber control system
DE4425208C2 (de) * 1994-07-16 1996-05-09 Jenoptik Technologie Gmbh Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen
US5507614A (en) * 1995-03-02 1996-04-16 Cybeq Systems Holder mechanism for simultaneously tilting and rotating a wafer cassette
US5825470A (en) * 1995-03-14 1998-10-20 Nikon Corporation Exposure apparatus
US5746565A (en) * 1996-01-22 1998-05-05 Integrated Solutions, Inc. Robotic wafer handler
US5924154A (en) * 1996-08-29 1999-07-20 Ontrak Systems, Inc. Brush assembly apparatus
JP3774283B2 (ja) * 1996-11-19 2006-05-10 東京エレクトロン株式会社 処理システム
US6280134B1 (en) * 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
US6073501A (en) * 1997-06-20 2000-06-13 Advanced Micro Devices, Inc. Apparatus and method for semiconductor wafer processing which facilitate determination of a source of contaminants or defects
KR100466308B1 (ko) * 1997-07-25 2005-05-17 삼성전자주식회사 반도체제조설비엘리베이터장치
US6722834B1 (en) * 1997-10-08 2004-04-20 Applied Materials, Inc. Robot blade with dual offset wafer supports
USD424583S (en) * 1997-10-21 2000-05-09 Tokyo Electron Limited Hinge unit for vacuum-processing a semiconductor wafer
KR19980042582A (ko) * 1997-11-19 1998-08-17 히가시데쓰로 처리시스템
WO1999028220A1 (fr) 1997-12-03 1999-06-10 Nikon Corporation Dispositif et procede de transfert de substrats
US6155768A (en) * 1998-01-30 2000-12-05 Kensington Laboratories, Inc. Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput
JP4296587B2 (ja) * 1998-02-09 2009-07-15 株式会社ニコン 基板支持装置、基板搬送装置及びその方法、基板保持方法、並びに露光装置及びその製造方法
US6132165A (en) * 1998-02-23 2000-10-17 Applied Materials, Inc. Single drive, dual plane robot
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
US6467827B1 (en) 1999-10-30 2002-10-22 Frank J. Ardezzone IC wafer handling apparatus incorporating edge-gripping and pressure or vacuum driven end-effectors
US6997664B1 (en) * 2000-07-19 2006-02-14 Industrial Technology Research Institute Apparatus for loading/unloading wafers to and from semiconductor fabrication equipment
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
US7390458B2 (en) * 2000-10-13 2008-06-24 Irm Llc High throughput processing system and method of using
US6592324B2 (en) * 2001-02-26 2003-07-15 Irm, Llc Gripper mechanism
US7104578B2 (en) * 2002-03-15 2006-09-12 Asm International N.V. Two level end effector
US7256375B2 (en) * 2002-08-30 2007-08-14 Asm International N.V. Susceptor plate for high temperature heat treatment
US6817821B2 (en) * 2002-10-21 2004-11-16 Robert D. Henderson Wafer handling for a reflow tool
US7033126B2 (en) * 2003-04-02 2006-04-25 Asm International N.V. Method and apparatus for loading a batch of wafers into a wafer boat
US7181132B2 (en) 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
US20060060145A1 (en) * 2004-09-17 2006-03-23 Van Den Berg Jannes R Susceptor with surface roughness for high temperature substrate processing
US20060065634A1 (en) * 2004-09-17 2006-03-30 Van Den Berg Jannes R Low temperature susceptor cleaning
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
KR101889150B1 (ko) * 2016-08-19 2018-08-16 주식회사 포스코 표면 거칠기 측정 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116630A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Work offering feeding mechanism
JPS59201782A (ja) * 1983-04-23 1984-11-15 大日本スクリ−ン製造株式会社 ウエハ等の薄板物搬送装置
US4818169A (en) * 1985-05-17 1989-04-04 Schram Richard R Automated wafer inspection system
US4676709A (en) * 1985-08-26 1987-06-30 Asyst Technologies Long arm manipulator for standard mechanical interface apparatus
US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
JPS63128731A (ja) * 1986-11-19 1988-06-01 Sony Corp 配線形成方法
US4775281A (en) * 1986-12-02 1988-10-04 Teradyne, Inc. Apparatus and method for loading and unloading wafers

Also Published As

Publication number Publication date
JPH0617295Y2 (ja) 1994-05-02
US4923054A (en) 1990-05-08

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