JPH0178036U - - Google Patents
Info
- Publication number
- JPH0178036U JPH0178036U JP1987172072U JP17207287U JPH0178036U JP H0178036 U JPH0178036 U JP H0178036U JP 1987172072 U JP1987172072 U JP 1987172072U JP 17207287 U JP17207287 U JP 17207287U JP H0178036 U JPH0178036 U JP H0178036U
- Authority
- JP
- Japan
- Prior art keywords
- die
- optical semiconductor
- lead
- resin
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987172072U JPH0178036U (lt) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987172072U JPH0178036U (lt) | 1987-11-12 | 1987-11-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0178036U true JPH0178036U (lt) | 1989-05-25 |
Family
ID=31464063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987172072U Pending JPH0178036U (lt) | 1987-11-12 | 1987-11-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0178036U (lt) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5448186A (en) * | 1977-09-24 | 1979-04-16 | Takeda Seisakusho Kk | Method of sealing light emitting diode |
JPS59108333A (ja) * | 1982-12-14 | 1984-06-22 | Nec Corp | 樹脂封止型半導体装置の製造方法 |
-
1987
- 1987-11-12 JP JP1987172072U patent/JPH0178036U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5448186A (en) * | 1977-09-24 | 1979-04-16 | Takeda Seisakusho Kk | Method of sealing light emitting diode |
JPS59108333A (ja) * | 1982-12-14 | 1984-06-22 | Nec Corp | 樹脂封止型半導体装置の製造方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0178036U (lt) | ||
JPH0217850U (lt) | ||
JPS59117166U (ja) | 樹脂封止型半導体装置 | |
JPH024258U (lt) | ||
JPH0178037U (lt) | ||
JPH0254248U (lt) | ||
JPS5914348U (ja) | 樹脂封止型半導体装置 | |
JPS606232U (ja) | 半導体装置の樹脂外装体 | |
JPS5987145U (ja) | 樹脂封止型半導体装置 | |
JPS62145344U (lt) | ||
JPH044767U (lt) | ||
JPH01145130U (lt) | ||
JPS6073249U (ja) | 樹脂封止半導体装置 | |
JPS59176151U (ja) | 樹脂封止型半導体装置 | |
JPH01113345U (lt) | ||
JPS6422044U (lt) | ||
JPH0245646U (lt) | ||
JPH0256439U (lt) | ||
JPS6033452U (ja) | 樹脂封止型半導体装置 | |
JPH01104720U (lt) | ||
JPS5892739U (ja) | 半導体装置 | |
JPH03113850U (lt) | ||
JPH0180952U (lt) | ||
JPS6274341U (lt) | ||
JPH01129851U (lt) |