JPH0178028U - - Google Patents
Info
- Publication number
- JPH0178028U JPH0178028U JP1987173371U JP17337187U JPH0178028U JP H0178028 U JPH0178028 U JP H0178028U JP 1987173371 U JP1987173371 U JP 1987173371U JP 17337187 U JP17337187 U JP 17337187U JP H0178028 U JPH0178028 U JP H0178028U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- insulating film
- interlayer insulating
- hole
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図ａ及びｂは本考案の第１の実施例及びそ
のマスクパターンの平面図、第２図ａ及びｂは本
考案の第２の実施例及びそのマスクパターンの平
面図、第３図ａ及びｂは従来の半導体装置の一例
及びそのマスクパターンの平面図である。 １ａ，２ａ，３ａ，４ａ……マスクパターン、
１ｂ，２ｂ，３ｂ，４ｂ……転写パターン。
のマスクパターンの平面図、第２図ａ及びｂは本
考案の第２の実施例及びそのマスクパターンの平
面図、第３図ａ及びｂは従来の半導体装置の一例
及びそのマスクパターンの平面図である。 １ａ，２ａ，３ａ，４ａ……マスクパターン、
１ｂ，２ｂ，３ｂ，４ｂ……転写パターン。
Claims (1)
- 層間絶縁膜を介して順次積層されかつ該層間絶
縁膜に開口したスルーホールを通して接続された
第１及び第２の導体層を含む半導体装置において
、前記スルーホールのパターンの辺の少くとも一
部に内側に折れ曲つた形状の部分を有すること特
徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173371U JPH0178028U (ja) | 1987-11-13 | 1987-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173371U JPH0178028U (ja) | 1987-11-13 | 1987-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178028U true JPH0178028U (ja) | 1989-05-25 |
Family
ID=31465296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987173371U Pending JPH0178028U (ja) | 1987-11-13 | 1987-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178028U (ja) |
-
1987
- 1987-11-13 JP JP1987173371U patent/JPH0178028U/ja active Pending