JPH0176283U - - Google Patents
Info
- Publication number
- JPH0176283U JPH0176283U JP1987173124U JP17312487U JPH0176283U JP H0176283 U JPH0176283 U JP H0176283U JP 1987173124 U JP1987173124 U JP 1987173124U JP 17312487 U JP17312487 U JP 17312487U JP H0176283 U JPH0176283 U JP H0176283U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- metal
- thermal expansion
- card
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
は一般的と思われるＩＣカードの構造を示す分解
斜視図である。
１……金属基板、２……凹部、３……ＩＣチツ
プ、４……カバーシート、５……アルミニウム、
６……インバー、７……導電路。
FIG. 1 is a cross-sectional view showing an embodiment of the present invention, and FIG. 2 is an exploded perspective view showing the structure of a commonly used IC card. 1... Metal substrate, 2... Recess, 3... IC chip, 4... Cover sheet, 5... Aluminum,
6... Invar, 7... Conductive path.
Claims (1)
前記ＩＣチツプ実装基板が熱膨張率の低い金属の
両面に熱膨張率の高い金属が固着された金属基板
で形成され、前記金属基板の一主面に前記ＩＣチ
ツプが実装される凹部が設けられ、前記凹部内に
前記ＩＣチツプが収納されたことを特徴とするＩ
Ｃカード。 In an IC card equipped with an IC chip,
The IC chip mounting board is formed of a metal substrate having a metal with a high coefficient of thermal expansion fixed to both sides of a metal with a low coefficient of thermal expansion, and a recessed portion in which the IC chip is mounted is provided on one main surface of the metal substrate. , wherein the IC chip is housed in the recess.
C card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173124U JPH0176283U (en) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173124U JPH0176283U (en) | 1987-11-12 | 1987-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0176283U true JPH0176283U (en) | 1989-05-23 |
Family
ID=31465060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987173124U Pending JPH0176283U (en) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0176283U (en) |
-
1987
- 1987-11-12 JP JP1987173124U patent/JPH0176283U/ja active Pending