JPH0175881U - - Google Patents
Info
- Publication number
- JPH0175881U JPH0175881U JP1987171835U JP17183587U JPH0175881U JP H0175881 U JPH0175881 U JP H0175881U JP 1987171835 U JP1987171835 U JP 1987171835U JP 17183587 U JP17183587 U JP 17183587U JP H0175881 U JPH0175881 U JP H0175881U
- Authority
- JP
- Japan
- Prior art keywords
- burn
- circuit board
- power source
- printed circuit
- ground wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図及び第２図は、本考案の第１及び第２実
施例の構成図である。第３図は、従来例を示す図
である。
１……恒温槽、２……ヒータ、３……電源、４
，５……電源及び接地配線、６……コネクタ、７
……プリント基板、８，９……プリント基板上の
電源及び接地配線、１０……ＩＣ、１１……ＬＥ
Ｄ、１２……ツエナーダイオード。
第３図は従来例の構成図である。第３図におい
て、
１……恒温槽、２……ヒータ、３……電源、４
，５……電源及び接地配線、６……コネクタ、７
……プリント基板、８，９……プリント基板上の
電源及び接地配線、１０……ＩＣ。
1 and 2 are configuration diagrams of first and second embodiments of the present invention. FIG. 3 is a diagram showing a conventional example. 1... Constant temperature chamber, 2... Heater, 3... Power supply, 4
, 5... Power supply and ground wiring, 6... Connector, 7
...Printed board, 8,9...Power and ground wiring on printed board, 10...IC, 11...LE
D, 12... Zener diode. FIG. 3 is a configuration diagram of a conventional example. In Figure 3, 1... constant temperature bath, 2... heater, 3... power supply, 4
, 5... Power supply and ground wiring, 6... Connector, 7
...Printed board, 8, 9...Power and ground wiring on printed board, 10...IC.
Claims (1)
以下ＩＣと記す）を実装するプリント基板と上記
ＩＣに電源電圧を供給する電源から構成されるバ
ーン・イン装置において、上記プリント基板の電
源と接地配線間に発光ダイオードを接続したこと
を特徴とするバーン・イン装置。 Constant temperature chamber, heater, and semiconductor integrated circuit under test (
A burn-in device comprising a printed circuit board on which an IC (hereinafter referred to as an IC) is mounted and a power source for supplying power voltage to the IC, characterized in that a light emitting diode is connected between the power source and ground wiring of the printed circuit board. Burn-in equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171835U JPH0175881U (en) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171835U JPH0175881U (en) | 1987-11-09 | 1987-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0175881U true JPH0175881U (en) | 1989-05-23 |
Family
ID=31463840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987171835U Pending JPH0175881U (en) | 1987-11-09 | 1987-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0175881U (en) |
-
1987
- 1987-11-09 JP JP1987171835U patent/JPH0175881U/ja active Pending
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