JPH0170549U - - Google Patents
Info
- Publication number
- JPH0170549U JPH0170549U JP16705787U JP16705787U JPH0170549U JP H0170549 U JPH0170549 U JP H0170549U JP 16705787 U JP16705787 U JP 16705787U JP 16705787 U JP16705787 U JP 16705787U JP H0170549 U JPH0170549 U JP H0170549U
- Authority
- JP
- Japan
- Prior art keywords
- sensing element
- circuit board
- printer head
- printed circuit
- driver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
Description
第１図、第２図は本考案のプリンタヘツドの一
実施例を示す感知部側面図、第３図〜第５図はヘ
ツド部側面図、第６図は従来のプリント基板平面
図、第７図、第９図はその側面図、第８図、第１
０図は従来のヘツド部側面図である。
２：ＬＥＤアレイ、３：ドライバ用ＩＣ、５：
レンズアレイ、６：感熱素子、９：コの字型プリ
ント基板、１０：かぎ型プリント基板、１１，１
２，１３：筐体。
1 and 2 are side views of the sensing portion showing an embodiment of the printer head of the present invention, FIGS. 3 to 5 are side views of the head portion, FIG. 6 is a plan view of a conventional printed circuit board, and FIG. Figure 9 is the side view, Figure 8, Figure 1.
Figure 0 is a side view of a conventional head section. 2: LED array, 3: Driver IC, 5:
Lens array, 6: Thermal element, 9: U-shaped printed circuit board, 10: Hook-shaped printed circuit board, 11, 1
2, 13: Housing.
Claims (1)
知素子を駆動するドライバ用ＩＣとを並設してヘ
ツド部を構成するプリンタヘツドにおいて、前記
プリント基板が金属板で裏打された屈曲形状の基
板よりなり、該屈曲された基板各面に前記感知素
子と前記ドライバ用ＩＣとが夫々分離して取付け
てあることを特徴とするプリンタヘツド。 (2) 前記感知素子には発光ダイオードアレイも
しくは感熱素子を用いるものである実用新案登録
請求の範囲第１項記載のプリンタヘツド。[Claims for Utility Model Registration] (1) In a printer head in which a printer sensing element and a driver IC for driving the sensing element are arranged side by side on a printed circuit board to form a head section, the printed circuit board is made of a metal plate. 1. A printer head comprising a bent substrate with a lining, and wherein the sensing element and the driver IC are separately attached to each surface of the bent substrate. (2) The printer head according to claim 1, wherein a light emitting diode array or a heat sensitive element is used as the sensing element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16705787U JPH0170549U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16705787U JPH0170549U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170549U true JPH0170549U (en) | 1989-05-11 |
Family
ID=31455008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16705787U Pending JPH0170549U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170549U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0541803U (en) * | 1991-11-14 | 1993-06-08 | 沖電気工業株式会社 | Optical printhead mounting structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59184681A (en) * | 1983-04-05 | 1984-10-20 | Oki Electric Ind Co Ltd | Optical printing head |
| JPS6424770A (en) * | 1987-07-21 | 1989-01-26 | Seiko Epson Corp | Optical printer head |
-
1987
- 1987-10-30 JP JP16705787U patent/JPH0170549U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59184681A (en) * | 1983-04-05 | 1984-10-20 | Oki Electric Ind Co Ltd | Optical printing head |
| JPS6424770A (en) * | 1987-07-21 | 1989-01-26 | Seiko Epson Corp | Optical printer head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0541803U (en) * | 1991-11-14 | 1993-06-08 | 沖電気工業株式会社 | Optical printhead mounting structure |
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